SMD0603P004TF [LEIDITECH]

Positive Thermal Coefficent Diodes;


型号：	SMD0603P004TF
厂家：	Leiditech
描述：	Positive Thermal Coefficent Diodes
文件：	总6页 (文件大小：1405K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMD0603P003~050 Series

Positive Thermal Coefﬁcent Diodes

Features：



RoHS Compliant ＆ Halogen Free

faster tripping, 0603 Dimension, Surface mountable, Solid state

Operation Current: 0.03A~0.50A



Maximum Voltage: 6V~30Vdc

Operating Temperature：-40℃ TO 85℃

Product Dimensions

Terminal pad materials :Tin-Plated Nickle-copper

Terminal pad solderability : Meets EIA specification

RS 186-9E and ANSI/J-STD-002 Category 3.

Pig.1

Unit ：mm

Part Number

Max

0.50

Min

1.45

Max

1.85

Min

0.65

Max

1.05

Min

0.40

0.50

Max

0.90

0.75

1.20

Min

0.15

MAX

0.40

SMD0603P003TF

SMD0603P004TF

SMD0603P005TF

SMD0603P010TF

SMD0603P020TF

SMD0603P025TF

SMD0603P030TF

SMD0603P035TF

SMD0603P040TF

SMD0603P050TF

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SMD0603P003~050 Series

Thermal Derating Chart-IH（A）

Maximum ambient operating temperatures（℃）

25 40 50 60

0.03 0.026 0.021 0.018 0.015 0.011

Part number

-40

-20

SMD0603P003TF 0.042 0.038 0.035

SMD0603P004TF 0.056

0.05 0.046

0.07 0.063 0.058 0.05 0.043 0.035

0.04

0.034 0.028 0.024

0.02 0.014

SMD0603P005TF

SMD0603P010TF

SMD0603P020TF

SMD0603P025TF

SMD0603P030TF

SMD0603P035TF

SMD0603P040TF

SMD0603P050TF

0.03 0.025 0.018

0.14 0.125 0.115 0.10

0.085

0.17

0.21

0.26

0.30

0.34

0.43

0.07

0.14

0.18

0.21

0.27

0.31

0.39

0.06

0.12

0.15

0.18

0.24

0.27

0.34

0.05 0.035

0.28

0.35

0.42

0.47

0.54

0.67

0.25

0.31

0.38

0.44

0.50

0.63

0.23

0.29

0.35

0.39

0.45

0.56

0.20

0.25

0.30

0.35

0.40

0.50

0.10

0.13

0.15

0.20

0.23

0.29

0.07

0.09

0.11

0.14

0.16

0.20

Electrical Characteristic

Maximum time to

trip

V_max

I_max

I_hold

I_trip

Resistence

Ri_minR1_max

P_d

Part Number

Current

(A)

Time

(Sec)

1.00

0.60

0.08

0.10

Max.

(W)

(Vdc)

(A)

()

6.0

()

SMD0603P003TF

SMD0603P004TF

SMD0603P005TF

SMD0603P010TF

SMD0603P020TF

SMD0603P025TF

SMD0603P030TF

SMD0603P035TF

SMD0603P040TF

SMD0603P050TF

30.0

24.0

15.0

9.0

0.03

0.04

0.05

0.10

0.20

0.25

0.30

0.35

0.40

0.50

0.09

0.12

0.15

0.30

0.50

0.55

0.70

0.75

0.80

1.00

0.50

0.15

0.2

65.00

45.00

35.00

8.00

4.0

0.25

0.5

3.0

0.9

1.00

8.0

0.55

0.500

0.300

0.200

0.20

0.100

3.50

9.0

3.00

6.0

8.0

2.00

6.0

8.0

1.400

0.900

0.800

6.0

8.0

6.0

8.0

Part Numbering System

0603

LM- SMD

□□□

Holding current Rating

0603 Dimension

Surface Mount Device

leiditech mark

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Rev :01.06.2018

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SMD0603P003~050 Series

Test Procedures And Requirements

Test

Test Conditions

Accept/Reject Criteria

Resistance

In still air @ 25℃

R_min≤R≤R_max

Time to Trip

Specified current，V_max，25℃ T≤maximum Time to Trip

Hold Current

30min，at I_H

No trip

Trip Cycle Life

Trip Endurance

Vmax，Imax，100cycles

Vmax，1 hours

No arcing or burning

Physical Characteristics and Environmental Specifications

Terminal materials :

Tin-Plated Nickle-copper

Soldering zone

Environmental Specifications

Test

Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Conditions

Resistance Change

Passive aging

85℃,1000hours

±10%

Humidity aging

Thermal shock

85℃/85%RH.1000 hours

MIL-STD-202,Method 107G

+85℃/-40℃,20times

MIL-STD-202,Method 215

±5%

-30% typical resistance change

Solvent Resistance

Vibration

no change

ML-STD-883C,Test Condition A No chage

Electrical Specifications:

I_hold= Hold Current. Maximum current device will not trip in 25°C still air.

I_trip= Trip Current. Minimum current at which the device will always trip in 25°C still air.

V_max= Maximum operating voltage device can withstand without damage at rated current (Imax).

I_max= Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Ri_min/max= Minimum/Maximum device resistance prior to tripping at 25°C.

R1_max= Maximum device resistance is measured one hour post reflow.

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Rev :01.06.2018

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SMD0603P003~050 Series

Recommended pad layout (mm)

Solder reflow conditions

● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.

● Devices are not designed to be wave soldered to the bottom side of the board.

● Recommended maximum paste thickness is 0.25mm (0.010inch).

● Devices can be cleaned using standard industry methods and solvents.

● Soldering temprature profile meets RoHs leadfree process.

Notes: If reflow temperatures exceed the recommended profile, devices may not meet the

performance requirements

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Rev :01.06.2018

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SMD0603P003~050 Series

Tape Specification And Reel Dimensions

Coverning Specifications

EIA 481-1(Unit:mm)

8.00± 0.10

4.0 ± 0.10

4.0± 0.10

2.0 ± 0.05

0.95 ± 0.10

1.85± 0.05

1.55± 0.05

3.50± 0.05

1.75 ± 0.10

0.20± 0.02

390

P₀

P₁

P₂

A₀

B₀

D₀

E₁

Leader min.

Trailer min.

160

Reel Dimensions

178±1.0

59±1

W₁

W₂

8.5+1.0/-0.2

12.0±1

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Rev :01.06.2018

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SMD0603P003~050 Series

Storage

The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the

deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with

high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the

components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be

opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present

WARNING

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and

flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be

used when repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended

electronic, thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the

performance of the devices.PPTC SMD can be cleaned by standard methods.

• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper

board layouts or reflow profilecould negatively impact solderability performance of our devices.

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

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