SMD0603P300L [LEIDITECH]

Positive Thermal Coeffcent Diodes;


型号：	SMD0603P300L
厂家：	Leiditech
描述：	Positive Thermal Coeffcent Diodes
文件：	总5页 (文件大小：557K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SMD0603P035~300L Series

Positive Thermal Coeffcent Diodes

Features：

RoHS Compliant ＆ Halogen Free

Faster tripping, 0603 Dimension, Surface mountable, Solid state

Operating Current: 0.35A~3.0A, @25℃

Maximum Voltage: 6V

Operating Temperature：-40℃~ 85℃

Certification: ROHS

Product Dimensions (mm)

Part number

Min

1.45

Max

1.85

Min

0.65

Max

1.05

Min

0.3

0.4

0.5

0.7

Max

0.7

1.0

1.2

1.4

Min

0.15

Min

0.1

SMD0603 035L

SMD0603 050L

SMD0603P075L

SMD0603 100L

SMD0603 125L

SMD0603 P150L

SMD0603 175L

SMD0603 200L

SMD0603 260L

SMD0603 300L

1/5

Rev :01.06.2018

www.leiditech.com

SMD0603P035~300L Series

Recommended Solder Pad Layout Dimensions (mm)

Normal Value

0.8

Normal Value

1.0

Device

Normal Value

0603 Series

1.0

Electrical Characteristics

Maximum

Resistance

Time-to-Trip

V_MAX

I_MAX

(A)

I_H

I_T

P_D

Model

Current

Time

Ri_MIN

(Ω)

R1_MAX

(Ω)

(V)

(A)

(W)

(A)

8.0

(Sec)

0.1

0.6

1.0

2.0

3.0

4.0

5.0

SMD0603 035L

6.0

50.0

0.35

0.5

0.7

1.0

1.5

2.0

2.5

3.0

3.5

4.0

5.2

6.0

0.5

0.15

1.0

SMD0603 050L

0.07

0.4

SMD0603P075L

0.75

1.0

0.055

0.045

0.035

0.025

0.015

0.012

0.008

0.25

0.12

0.10

0.08

0.07

0.06

0.05

0.04

SMD0603 100L

SMD0603 125L

1.25

1.5

SMD0603 P150L

SMD0603 175L

1.75

2.0

SMD0603 200L

SMD0603 260L

2.6

SMD0603 300L

3.0

Thermal Derating Chart-I_H(A)

Maximum ambient operating temperature (℃)

Model

-40

-20

SMD0603 035L

0.46

0.66

0.99

1.31

1.64

1.97

2.30

2.63

3.42

3.94

0.40

0.57

0.86

1.14

1.43

1.71

2.00

2.29

2.97

3.43

0.37

0.53

0.79

1.06

1.32

1.59

1.85

2.11

2.75

3.17

0.35

0.50

0.75

1.00

1.25

1.50

1.75

2.00

2.60

3.00

0.29

0.41

0.62

0.83

1.04

1.24

1.45

1.66

2.15

2.49

0.25

0.36

0.54

0.71

0.89

1.07

1.25

1.43

1.86

2.14

0.24

0.34

0.51

0.69

0.86

1.03

1.20

1.37

1.78

2.06

0.20

0.29

0.43

0.57

0.71

0.86

1.00

1.14

1.49

1.71

0.14

0.20

0.30

0.40

0.50

0.60

0.70

0.80

1.04

1.20

SMD0603 050L

SMD0603P075L

SMD0603 100L

SMD0603 125L

SMD0603 P150L

SMD0603 175L

SMD0603 200L

SMD0603 260L

SMD0603 300L

2/5

Rev :01.06.2018

www.leiditech.com

SMD0603P035~300L Series

Test Procedures and Requirements

Test Item

Test Conditions

Accept/Reject Criteria

Ri_min≤R≤R1_max

Resistance

Initial

In still air at 25±2℃

Specified current，V_max，25±2℃

30min，at I_H，@25±2℃

V_max，1 hour

Time to Trip

Holding Current

Trip Endurance

T≤Maximum Time to Trip

No trip

No arcing or burning

Physical Characteristics

Terminal Materials

Soldering Zone

Tin-Plated Nickle-copper

Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Level 2a, per IPC/JEDEC J-STD 020C

Moisture Sensitivity

Environmental Specifications

Test Item

Test Conditions

85℃,1000 hours

Resistance Change

±10% typical

Passive Aging

Humidity Aging

85℃/85%RH.100 hours

MIL-STD-202,Method 107G

+85℃/-40℃,20 times

±5% typical

Thermal Shock

-30% typical

Solvent Resistance

Vibration

MIL-STD-202,Method 215

ML-STD-883C,Test Condition A

No change

Electrical Specifications

I_H=Hold current: Maximum current at which the device will not interrupt in 25℃ still air.

I_T=Trip current: Minimum current at which the device from low resistance to high resistance in 25℃ still air.

V_MAX=Maximum continuous voltage device can withstand without damage at rated current.

I_MAX=Maximum fault current device can withstand without damage at rated voltage.

Maximum Time-to-trip: Maximum time to trip at assigned current.

P_D=Typical power dissipation: Typical amount of power dissipated from the device when in 25℃ still air environment.

Ri_MIN=Minimum resistance of device at 25℃ prior to tripping.

R1_MAX= Maximum device resistance is measured one hour post reflow.

3/5

Rev :01.06.2018

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SMD0603P035~300L Series

Solder Reflow Profiles

Profile Feature

Pb-Free Assembly

Average ramp up rate(Ts_MAXto Tp)

Preheat

3℃/second max.

●Temperature min.(Ts_MIN

●Temperature max.( Ts_MAX

●Time (Ts_MINto Ts_MAX

)

150℃

)

200℃

)

60-120 seconds

Time maintained above:

●Temperature (T_L)

●Time (T_L)

217℃

60-150 seconds

260℃

Peak/Classification temperature (T_P)

Time within 5℃ of actual peak temperature

Time (T_P)

30 seconds max.

3℃/second max.

8 minutes max.

Ramp down rate

Time 25℃ to peak temperature

● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.

● Devices are not designed to be wave soldered to the bottom side of the board.

● Recommended maximum paste thickness is 0.25mm (0.010inch).

● Devices can be cleaned using standard industry methods and solvents.

Note 1: All temperature refer to topside of the package, measured on the package body surface.

Note 2: If reflow temperature exceed the recommended profile, devices may not meet the performance requirements.

4/5

Rev :01.06.2018

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SMD0603P035~300L Series

Tape Specifications and Reel Dimensions

Covering Specifications EIA

481-1

8.0± 0.1

4.0 ± 0.1

4.0± 0.10

2.0 ± 0.05

0.95± 0.10

1.85± 0.05

1.55± 0.05

3.5 ± 0.05

1.75 ± 0.10

0.20± 0.02

390

P₀

P₁

P₂

A₀

B₀

D₀

E₁

Leader min.

Trailer min.

160

Reel Dimensions

178 ± 1

59 ± 1

W₁

W₂

8.5+1.0/-0.2

12.0±1

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

5/5

Rev :01.06.2018

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