SMD0805P030TF [LEIDITECH]
Positive Thermal Coefficent Diodes;
| 型号： | SMD0805P030TF |
| 厂家： | 
Leiditech |
| 描述： | Positive Thermal Coefficent Diodes |
| 文件： | 总6页 (文件大小：2020K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMD0805P005~110 Series
Positive Thermal Coefficent Diodes
Features：
RoHS Compliant ＆ Halogen Free
faster tripping, 0805 Dimension, Surface mountable, Solid state
Operation Current: 0.05A~1.10A
Maximum Voltage: 6V~24Vdc
Operating Temperature：-40℃TO 85℃
Product Dimensions
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Pig.1
Unit ：mm
A
B
C
D
E
Part Number
Min
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
Max
2.20
2.20
2.20
2.20
2.20
2.20
2.20
2.20
2.20
2.20
Min
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
1.20
Max
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
Min
0.45
0.40
0.40
0.40
0.30
0.30
0.40
0.50
0.50
0.50
Max
1.00
1.00
1.00
1.00
1.00
1.00
0.80
1.20
1.20
1.20
Min
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
Min
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
SMD0805P005TF
SMD0805P010TF
SMD0805P020TF
SMD0805P025TF
SMD0805P030TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
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Rev :01.06.2018
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SMD0805P005~110 Series
Thermal Derating Chart-IH（A）
Maximum ambient operating temperatures（℃）
25 40 50 60
0.03 0.025 0.018
Part number
-40
-20
0
70
85
SMD0805P005TF
SMD0805P010TF
SMD0805P020TF
SMD0805P025TF
SMD0805P030TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
0.07 0.063 0.058 0.05 0.043 0.035
0.14 0.125 0.115 0.10
0.085
0.17
0.21
0.255
0.30
0.40
0.63
0.82
0.92
0.07
0.14
0.18
0.21
0.27
0.37
0.57
0.74
0.84
0.06
0.12
0.05 0.035
0.10 0.07
0.28
0.35
0.42
0.47
0.68
1.00
1.35
1.45
0.25
0.31
0.38
0.44
0.62
0.90
1.25
1.35
0.23
0.29
0.35
0.39
0.55
0.79
1.10
1.20
0.20
0.25
0.30
0.35
0.50
0.75
1.00
1.10
0.15 0.013 0.09
0.18
0.24
0.33
0.53
0.65
0.75
0.15
0.20
0.29
0.41
0.55
0.65
0.11
0.14
0.23
0.34
0.42
0.52
Electrical Characteristic
Maximum time
to trip
Vmax
Imax
Ihold
(A)
Itrip
Resistence
Pd
Part Number
Current Time
Rimin
()
R1max
()
Max.
(W)
0.5
0.5
0.5
0.5
0.5
0.5
0.6
0.6
0.6
0.6
(Vdc)
(A)
(A)
(A)
0.5
0.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
(Sec)
1.50
1.50
0.02
0.02
0.10
0.10
0.10
0.20
0.30
0.30
SMD0805P005TF
SMD0805P010TF
SMD0805P020TF
SMD0805P025TF
SMD0805P030TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
24
15
9
100
100
100
100
100
100
100
100
100
100
0.05
0.10
0.20
0.25
0.30
0.35
0.50
0.75
1.00
1.10
0.15
0.30
0.50
0.50
0.70
0.75
1.00
1.50
1.95
2.20
1.50
1.00
0.50
0.45
0.25
0.25
0.15
0.09
0.06
0.06
20.0
6.00
3.50
3.20
2.00
1.20
0.85
0.385
0.23
0.21
6
6
6
6
6
6
6
Part Numbering System
0805
LM- SMD
□□□
Holding current Rating
0805 Dimension
Surface Mount Device
leiditech mark
2/6
Rev :01.06.2018
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SMD0805P005~110 Series
Test Procedures And Requirements
Test
Test Conditions
Accept/Reject Criteria
Resistance
In still air @ 25℃
Rmin≤R≤Rmax
Time to Trip
Hold Current
Trip Cycle Life
Trip Endurance
Specified current，Vmax，25℃ T≤maximum Time to Trip
30min，at IH
No trip
Vmax，Imax，100cycles
Vmax，1hours
No arcing or burning
No arcing or burning
Physical Characteristics and Environmental Specifications
Physical Characteristics
Terminal materials :
Tin-Plated Nickle-copper
Soldering zone
Environmental Specifications
Test
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Conditions
Resistance Change
Passive aging
85℃,1000hours
±10%
Humidity aging
Thermal shock
85℃/85%RH.1000 hours
MIL-STD-202,Method 107G
+85℃/-40℃,20times
MIL-STD-202,Method 215
±5%
-30% typical resistance change
Solvent Resistance
Vibration
no change
ML-STD-883C,Test Condition A No chage
Electrical Specifications:
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
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Rev :01.06.2018
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SMD0805P005~110 Series
Recommended pad layout (mm)
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
● Soldering temprature profile meets RoHsleadfree process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
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Rev :01.06.2018
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SMD0805P005~110 Series
Tape Specification And Reel Dimensions
Coverning Specifications
EIA 481-1(Unit:mm)
W
8.00± 0.30
4.0 ± 0.10
4.0± 0.10
2.0 ± 0.05
1.65 ± 0.10
2.35 ± 0.10
1.55± 0.05
3.50± 0.05
1.75 ± 0.10
0.20± 0.10
390
P0
P1
P2
A0
B0
D0
F
E1
T
Leadermin.
Trailer min.
160
Reel Dimensions
A
178±1.0
59±1
N
W1
W2
8.5+1.0/-0.2
12.0±1
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Rev :01.06.2018
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SMD0805P005~110 Series
Storage
The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present
WARNING
• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
6/6
Rev :01.06.2018
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