SMD1206P100/6 [LEIDITECH]
RoHS Compliant & Halogen Free;
| 型号： | SMD1206P100/6 |
| 厂家： | 
Leiditech |
| 描述： | RoHS Compliant & Halogen Free |
| 文件： | 总4页 (文件大小：457K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMD1206P100/6
1. Summary
(a) RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: Small surface mountable, Solid state, Faster time to trip than
standard SMD devices, Lower resistance than standard SMD devices
(d) Operation Current: 1.10A
(e) Maximum Voltage: 16V
(f) Temperature Range : -40℃ to 85℃
2. Agency Recognition
UL:
C-UL:
TÜ V:
File No. E211981
File No. E211981
File No. R50090556
3. Electrical Characteristics (23℃)
Max Time to Trip
Resistance
Hold
Trip
Rated
Max
Typical
Part
Current Current
Voltage
Current Power
Current
Time
RMIN
R1MAX
Number
IH, A
IT, A
VMAX, VDC IMAX, A
Pd, W
A
Sec
Ohms
Ohms
SMD1206P100/16
1.10
2.20
16
100
0.8
8.00
0.30
0.040
0.180
I
I
H
=Hold current-maximum current at which the device will not trip at 23℃still air.
T
=Trip current-minimum current at which the device will always trip at 23℃ still air.
MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
V
I
R
MIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
Termination pad characteristics
Termination pad materials: Pure Tin
4. FSMD Product Dimensions (Millimeters)
A
B
C
D
E
Part
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Number
3.00
3.50
1.50
1.80
0.80
1.40
0.25
0.75
0.10
0.45
SMD1206P100/16
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SMD1206P100/6
5. Thermal Derating Curve
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Temperature (C)
6. Typical Time-To-Trip at 23℃
10
1
0.1
0.01
0.001
1
10
100
Fault current (A)
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SMD1206P100/6
7. Material Specification
Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
8. Pad Layouts、Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each SMD1206 device
Pad dimensions (millimeters)
A
B
C
Device
Nominal
Nominal
Nominal
2.00
1.00
1.90
SMD1206P100/16
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Pb-Free Assembly
3 ℃/second max.
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150 ℃
200 ℃
60-180 seconds
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard
methods and aqueous solvent.
Time maintained above:
Temperature(TL)
Time (tL)
3. Rework use standard industry practices.
4. Storage Envorinment : < 30℃ / 60%RH
217 ℃
60-150 seconds
260 ℃
Peak/Classification Temperature(Tp) :
Time within 5℃ of actual Peak :
Temperature (tp)
Ramp-Down Rate :
Caution:
20-40 seconds
6 ℃/second max.
8 minutes max.
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
Time 25 ℃ to Peak Temperature :
Note 1: All temperatures refer to of the package,
measured on the package body surface.
2. Devices are not designed to be wave soldered
to the bottom side of the board.
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SMD1206P100/6
Reflow Profile
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
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