SPG32-302 [LEIDITECH]

Approximately zero leaking current before clamping voltage;


型号：	SPG32-302
厂家：	Leiditech
描述：	Approximately zero leaking current before clamping voltage
文件：	总5页 (文件大小：1016K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SPG32-501 Series

Features

• RoHS compliant.

• Bilateral symmetrical.

• Less decay at on/off state.

• Approximately zero leaking current before clamping voltage

• High capability to withstand repeated lightning strikes.

• Low electrode capacitance(≤1.0pF) and high isolation

(≥100MΩ).

• Temperature, humidity and lightness insensitive.

• Working temperature range: : -40℃ ~ +85℃

• Storaging temperature range: -40℃ ~ +125℃

Applications

Dimensions

• Power Supplies

• Motor sparks eliminating

• Relay switching spark absorbing

• Data line pulse guarding

• Telephone/Fax/Modem

• High frequency signal transmitters/receivers

• Satellite antenna

6.7±1.0

28±2.0

• Radio ampliﬁers

• Alarm systems

• Cathode ray tubes in Monitors/TVs

0.5±0.05

Φ3.1±0.5

1/5

Rev :01.06.2017

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SPG32-501 Series

ElectrIcal CharacterlstIcs

Minimum

Insulation

Resistance

Surge

Maximum

Spark-Over

Current

Capacitance

(1kHz-6Vmax )

Surge

Voltage

Capacity

Life Test

Type Number

10x700µs

Test Voltage

8/20µs

MΩ

140±30%

200±20%

300±20%

400±20%

500±20%

600±20%

1000±20%

1200±20%

1500±20%

1800±20%

2000±20%

2400±20%

3000±20%

3600±20%

4500±20%

100

500

3000

6000V 10 times

SPG32-141

SPG32-201

100

250

500

SPG32-301

SPG32-401

SPG32-501

SPG32-601

SPG32-102

SPG32-122

SPG32-152

SPG32-182

SPG32-202

SPG32-242

SPG32-302

SPG32-362

SPG32-452

2/5

Rev :01.06.2017

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SPG32-501 Series

Test Methods And Results

Items

Test Method

Standard

di/dt

Measure starting discharge voltage (Vs) by gradually increasing

applied DC voltage. Test current is 0.5mA max. And the

DC Spark-over Voltage

Insulation Resistance

DC voltage ascends up within 100V/s(Vs 1000V) or 500V/

s(Vs≥1000V).

Meet speciﬁed value.

Measure the insulation resistance across the terminal at regular

voltage. But the test voltage doesn’t over the DC spark-over

voltage.

Measure the electrostatic capacitance by applying a voltage of

less than 6V (at 1KHz) between terminals.

Capacitance

Static Life

10KV with 1500pf condenser is discharged through 0Ω resistor.

200 times at an interval of 10sec.

Vs/Vs ≤30% Characteristics of other

∣△ ∣

items must meet the speciﬁed value.

The following impulse current for speciﬁed current applied

±5 times, each time interval 60 seconds. Thereafter, outer

appearance shall be visually examined.

Type

Impulse current

Vs < 400V

1.2/50μs & 8/20μs, 3000A

Surge Current Capacity

No crack and no failures

1.2/50μs & 8/20μs, 3000A, electrically

connected with a resistor (1~2 Ω).

Vs ≥ 400V

Measurement after -40 /1000 HRS & normal temperature/2

HRS.

℃

Cold Resistance

Heat Resistance

Humidity Resistance

Measurement after 125 /1000 HRS & normal temperature/2

℃

HRS.

Features are conformed to rated spec.

Measurement after humidity 90~95

normal temperature/2 HRS.

(45

) /1000 HRS &

℃

10 times repetition of cycle -40

/30min →normal, temp/2 min

℃

Temperature Cycle

Solder Ability

→125 /30min, measurement after normal temp/2 HRS.

℃

Apply ﬂux and immerse in molten solder 230±5 for 3sec up to

℃

Lead wire is evenly covered by solder.

Conformed to rated spec.

the point of 1.5mm from

body. Check for solder adhesion.

℃

Measurement after lead wire is dipped up to the point of 1.5mm

from body into 260±5 solder for 10sec.

Solder Heat

℃

Pull Strength

Apply 0.5kg load for 10sec.

Lead shall not pull out to snap.

Bend lead wire at the point of 2mm from body under 0.25 load

and back to its original point.Repeat 1 time.

Flexural Strength

3/5

Rev :01.06.2017

www.leiditech.com

SPG32-501 Series

Recommended Soldering Conditions

Flow Soldering Conditions

Soldering

Cooling

Air Priheat

260℃

250

200

150

150~180℃

100

60~120 sec

3~4 sec

1) Time shown in the above ﬁgures is measured from the point when chip surface reaches temperature.

2) Temperature difference in high temperature part should be within 110

3) After soldering, do not force cool, allow the parts to cool gradually.

℃

Hand Soldering

Solder iron temperature: 350±5

Heating time: 3 seconds max.

℃

General attention to soldering

● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change

of characteristic may occur.

● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding 200 to fewer than

℃

50 seconds.

● Please use a mild ﬂux (containing less than 0.2wt% CI). Also, if the ﬂux is water soluble, be sure to wash thoroughly to remove any residue

from the underside of components that could affect resistance.

Cleaning

When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in

the adherence of the termination, we recommend that you use the conditions below.

Frequency: 40kHz max.

Output power: 20W/liter

Cleaning time: 5 minutes max.

4/5

Rev :01.06.2017

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SPG32-501 Series

Ordering Information

Symbol

Dimension (mm)

52.0±2.0

5.0±0.5

1.0 max.

6.0±1.0

1.2max.

3.2max.

0.8max.

Φ3.6max

Φ0.5±0.05

7.7max

75.0

L1-L2

68.0

255.0

Antity: 2000PCS

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

5/5

Rev :01.06.2017

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