SPG67-102 [LEIDITECH]
Less decay at on/off state;型号: | SPG67-102 |
厂家: | Leiditech |
描述: | Less decay at on/off state |
文件: | 总5页 (文件大小:1705K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SPG67-501 Series
Features
• RoHS compliant.
• Bilateral symmetrical.
• Less decay at on/off state.
• Approximately zero leaking current before clamping voltage
• High capability to withstand repeated lightning strikes.
• Low electrode capacitance(≤1.0pF) and high isolation
(≥100MΩ).
• Temperature, humidity and lightness insensitive.
• Working temperature range: : -40℃ ~ +85℃
• Storaging temperature range: -40℃ ~ +125℃
Applications
Dimensions
• Power Supplies
• Motor sparks eliminating
• Relay switching spark absorbing
• Data line pulse guarding
• Electronic devices requiring UL497A and UL497B
compliant
6.7±1.0
28±2.0
28±2.0
• Telephone/Fax/Modem
• High frequency signal transmitters/receivers
• Satellite antenna
0.5±0.05
• Radio amplifiers
• Alarm systems
Φ2.6±0.5
• Cathode ray tubes in Monitors/TVs
1/5
Rev :01.06.2017
www.leiditech.com
SPG67-501 Series
ElectrIcal CharacterlstIcs
DC
Minimum
Insulation
Resistance
Surge
Maximum
Spark-Over
Current
Capacitance
(1kHz-6Vmax )
Surge
Voltage
Capacity
Life Test
Type Number
10x700µs
Vs
V
R
Test Voltage
V
CJ
pF
8/20µs
MΩ
100
A
140±30%
200±20%
300±20%
400±20%
500±20%
600±20%
1000±20%
1200±20%
1500±20%
50
1
1
1
1
1
1
1
1
1
1000
1000
1000
1000
1000
1000
1000
1000
1000
4000V 10 times
4000V 10 times
4000V 10 times
4000V 10 times
4000V 10 times
4000V 10 times
4000V 10 times
4000V 10 times
4000V 10 times
SPG67-141
SPG67-201
SPG67-301
SPG67-401
100
100
100
100
100
100
100
100
50
100
250
250
250
250
500
500
SPG67-501
SPG67-601
SPG67-102
SPG67-122
SPG67-152
2/5
Rev :01.06.2017
www.leiditech.com
SPG67-501 Series
Test Methods And Results
Items
Test Method
Standard
Measure starting discharge voltage (Vs) by gradually increasing
applied DC voltage. Test current is 0.5mA max. And the
DC Spark-over Voltage
Insulation Resistance
DC voltage ascends up within 100V/s(Vs 1000V) or 500V/
<
s(Vs≥1000V).
Meet specified value.
Measure the insulation resistance across the terminal at regular
voltage. But the test voltage doesn’t over the DC spark-over
voltage.
Measure the electrostatic capacitance by applying a voltage of
less than 6V (at 1KHz) between terminals.
Capacitance
Static Life
10KV with 1500pf condenser is discharged through 0Ω resistor.
200 times at an interval of 10sec.
Vs/Vs ≤30% Characteristics of other
∣△ ∣
items must meet the specified value.
The following impulse current for specified current applied
±5 times, each time interval 60 seconds. Thereafter, outer
appearance shall be visually examined.
Type
Impulse current
Vs < 400V
1.2/50μs & 8/20μs, 1000A
Surge Current Capacity
No crack and no failures
1.2/50μs & 8/20μs, 1000A, electrically
connected with a resistor (1~2 Ω).
Vs ≥ 400V
Measurement after -40 /1000 HRS & normal temperature/2
HRS.
℃
Cold Resistance
Heat Resistance
Humidity Resistance
Measurement after 125 /1000 HRS & normal temperature/2
℃
HRS.
Features are conformed to rated spec.
Measurement after humidity 90~95
normal temperature/2 HRS.
(45
) /1000 HRS &
℃
℃
10 times repetition of cycle -40
/30min →normal, temp/2 min
℃
Temperature Cycle
Solder Ability
→125 /30min, measurement after normal temp/2 HRS.
℃
Apply flux and immerse in molten solder 230±5 for 3sec up to
℃
Lead wire is evenly covered by solder.
Conformed to rated spec.
the point of 1.5mm from
body. Check for solder adhesion.
℃
Measurement after lead wire is dipped up to the point of 1.5mm
from body into 260±5 solder for 10sec.
Solder Heat
℃
Pull Strength
Apply 0.5kg load for 10sec.
Lead shall not pull out to snap.
Bend lead wire at the point of 2mm from body under 0.25 load
and back to its original point.Repeat 1 time.
Flexural Strength
3/5
Rev :01.06.2017
www.leiditech.com
SPG67-501 Series
Recommended Soldering Conditions
Flow Soldering Conditions
Soldering
Cooling
Air Priheat
260℃
250
200
150
150~180℃
100
50
0
60~120 sec
3~4 sec
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110
3) After soldering, do not force cool, allow the parts to cool gradually.
℃
Hand Soldering
Solder iron temperature: 350±5
Heating time: 3 seconds max.
℃
General attention to soldering
● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change
of characteristic may occur.
● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding 200 to fewer than
℃
50 seconds.
● Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue
from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in
the adherence of the termination, we recommend that you use the conditions below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
4/5
Rev :01.06.2017
www.leiditech.com
SPG67-501 Series
Ordering Information
Symbol
Dimension (mm)
52.0±2.0
W
P
5.0±0.5
1.0 max.
6.0±1.0
1.2max.
3.2max.
0.8max
Φ3.1max.
Φ0.5±0.05
7.7max
75.0
L1-L2
T
Z
t
S
D
D1
L
A
B
68.0
C
255.0
Antity: 2000PCS
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
5/5
Rev :01.06.2017
www.leiditech.com
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