LTCV107MS3 [LGE]

ceramic filter; 陶瓷滤波器


型号：	LTCV107MS3
厂家：	LGE
描述：	ceramic filter 陶瓷滤波器陶瓷滤波器
文件：	总8页 (文件大小：198K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

http://www.luguang.cn Email: lge@luguang.cn

1 SCOPE

This specification shall cover the characteristics of the ceramic

fliter with the type LTCV10.7MS3. The LTCV10.7MS3 filters are small,

high performance and very thin (1.5mm) chip devices consisting of 2

ceramic elements for communication equipment. They are designed on

MgTiO3 ceramic cap package.

2 PART NO.

PART NUMBER

CUSTOMER PART NO.

SPECIFICATION NO.

LTCV10.7MS3

3 OUTLINE DRAWING AND STRUCTURE

3.1 Appearance

No visible damage and dirt.

3.2 Dimensions

①

②

③

range of frequency

①:Input

②:Ground

③:output

Unit:mm

2 3

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3.3 STRUCTURE

O u tp u t/In p u t

E lectro d e

C erm ic

C o v er

O scillatio n

E lectro d e

g lu e

C erm ic

S u b strate

4 ELECTRICAL SPECIFICATIONS

4.1 RATING

Items

Content

50 (DC，1min)

100 （100V，1min）

-25～+85

Withstanding Voltage (V)

Insulation Resistance Ri,（MΩ）min.

Operating Temperature Range (℃)

Storage Temperature Range (℃)

-40～+85

4.2 ELECTRICAL SPECIFICATIONS

Items

Content

Center Frequency(fo)(MHz)

A:10.700±0.030

B:10.670±0.030

D:10.640±0.030

The center point of 3dB band width is defined as C:10.730±0.030

the center frequency and identified by the E:10.760±0.030

letters:A,B,C,D or E.

3dB Bandwidth(kHz)

20dB Bandwidth(kHz) max

Insertion Loss (dB)

180±40

470

4.0±2.0 (at minimum loss point)

1.0 (within 3dB Bandwidth)

35 (9MHz-12MHz)

330

Ripple (dB) max

Spurious Response (dB) min

Input/Output Impedance(Ω)

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5 TEST

5.1 Test Conditions

Parts shall be tested under a condition (Temperature:+20℃±15℃，

Humidity:65%±20%R.H.)unless the standard

condition(Temperature:+25℃±3℃,Humidity:65%±5% R.H.) is regulated

to test.

5.2 Test Circuit:

R1=280Ω±5%,R2=330Ω±5%,Rg=50Ω

C2=10 Pf (Including stray capacitance

and capacitance of RF Voltmeter)

S.S.G:Output Voltmeter

①:Input

S.S.G.

Voltmeter

②:Ground

③:Output

6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS

Performance

Requirment

NO.

Item

Condition of Test

Low Temp

Storage

High Temp

Storage

Stored in -40℃±3℃ for 96h，and left at room

temp. for 1h before measurement.

Stored in 85℃±2℃ for 96h，and left at room

temp. for 1h before measurement.

Stored at 40℃±2℃，in 90%～95%R.H. for 96h,

and left at room temp. for 1h before measurement

After temp. cycling of -40℃(30 minutes) to +85℃

(30min) was performed 5 times, filter shall be

measured after being placed in natural condition

for 1h.

Passed through the reflow oven under the

following condition for 2 times, and left at room

temp. for 24h before measurement.

6.1

Meet Table 1

6.2

6.3 Humidity

Thermal

6.4

Meet Table 1

Shock

Soldering

Test

6.5

Dipped in 235℃±5℃ solder bath for 3s±0.5s

with rosin flux.

The terminals

shall be at

least 95%

covered by

solder

Temp. at the surface of

Time

6.6 Solderability

the substrate

Preheat 150℃±5℃

Peak 235℃±5℃

60s±10s

10s±3s

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Free drop to the wood plate from the height of 70

cm for 3 times.

6.7 Drop test

Meet Table 1

Apply the vibration of sweep frequency 10 to

55Hz/minutes, amplitude 1.5mm, duration 2h in Meet Table 1

each direction of 3 planes.

6.8

Vibration

Mount on

glass-epoxy board( width=50 mm,

thickness=1.6mm),then

bend it to 1mm

displacement(velocity 1mm/sec) and keep it for 5s.

Mechanical

damage such

as break shall

not occur

Press

Board

Bending

6.9

Press Head

Support bar

D.U.T

45± 2

TABLE 1 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS

Item

Specification after test

Insertion Loss Drift (dB) max

3dB Bandwidth Drift (kHz) max

20dB Bandwidth Drift (kHz) max

±2

±25

±60

Note ： The limits in the above table are referenced to the initial measurements.

RECOMMENDED LAND PATTERN AND REFLOW SOLDERING

STANDARD CONDITIONS

7.1Recommended land pattern

2.9± 0.3

1.5± 0.3

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7.2Recommended reflow soldering standard conditions

within 10 sec

220~230℃

200

150

100

Pre-heating

within

80-120sec.

20-40sec

8 PACKAGE

To protect the products in storage and transportation，it is

necessary to pack them（outer and inner package）.On paper pack, the

following requirements are requested.

Dimensions and Mark

At the end of package, the warning (moisture proof, upward put)

should be stick to it.

Dimensions and Mark (see below)

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NO.

Name

Package

Quantity

Notes

Certificate of approval

Label

Tying

Adhesive tape

Belt

1.2m

2.9m

Inner Box

Section of package

Package is made of corrugated paper with thickness of

0.8cm.Package has 10 inner boxes, each box has 1 reels, every reel is

vacuum packed for plastic bag (at 300 Torr of vacuum rate).

Quantity of package

Per plastic reel

Per inner box

Per package

4000 pieces of piezoelectric ceramic part

1 reels

10 inner boxe（s 40000 pieces of piezoelectric

ceramic part ）

Inner Packing Dimensions

1.UNIT: mm

Label

QC Label

Inner Box

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Pars shall be packaged in box with hold down tape upside. Part

No., quantity and lot No.

8.5Reel

2.0± 0.5

13.0± 0.5

(Unit: mm)

120°

16.4min

22.4max.

8.6Taping Dimensions

4.0± 0.1

1.5

2.0± 0.1

1.5^+0.1

(Unit:mm)

Chip Filter

8.0± 0.1

3.5± 0.1

8.7Tape Characteristics

Blank Pocket

10 Pitches

Blank Pocket

10 Pitches

lead tape

Loaded Pocket

......

End

150~200mm

Feeding direction

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8.8Test Condition Of Peeling Strength

T o p T a p e

1 0 ° M a x

C a rrie r T a p e

9 OTHER

9.1 Caution of use

9.1.1 Do not use this product with bend. Please don’t apply excess

mechanical stress to the component and terminals at soldering.

9.1.2 The component may be damaged when an excess stress will be

applied.

9.1.3 This specification mentions the quality of the component as a

single unit. Please insure the component is thoroughly evaluated in your

application circuit.

9.2 Notice

9.2.1 Please return one of this specification after your signature of

acceptance.

9.2.2 When something gets doubtful with this specifications, we shall

jointly work to get an agreement.

SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD

LTCV107MS3 [LGE]

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