MB12S [LGE]

1 Amp Surface mount Schottky Bridge Rectifier 20 to 100 V; 1安培表面贴装肖特基整流桥20至100 V


型号：	MB12S
厂家：	LGE
描述：	1 Amp Surface mount Schottky Bridge Rectifier 20 to 100 V 1安培表面贴装肖特基整流桥20至100 V 二极管光电二极管
文件：	总2页 (文件大小：524K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MB12S THRU MB110S

1 Amp Surface mount Schottky Bridge Rectifier

20 to 100 V

Features

•

High Temperature Soldering Guaranteed:260^oC/10 Second

Saves Space On Printed Circuit Board

MBS -1

∼

Mechanical Data

•

Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix

designates RoHS Compliant. See ordering information)

Case Material:Molded Plastic. UL Flammability

•

Classification Rating 94V-0 and MSL Rating 1

•

Teminals: Plated leads Solderable per MIL-STD-750,Method 2026

Moisture Sensitiviy:Level 1 per J-STD-020C

MCC

Part

Number

Maximum

Recurrent

Marking Peak Reverse

Voltage

Maximum

RMS

Voltage

Maximum

Blocking

Voltage

Device

20V

40V

60V

80V

100V

20V

40V

60V

80V

100V

MB12S

MB14S

MB16S

MB18S

MB12S

MB14S

MB16S

MB18S

14V

28V

42V

56V

70V

MB110S MB110S

Case Style

Electrical Characteristics @ 25^OC Unless Otherwise Specified

ꢀꢁꢂꢃꢄꢅꢁꢆꢄꢅ

ꢇ ꢇ ꢇ ꢇ ꢁꢄꢈ

ꢉꢃꢅ

Average Forward

Current

I_F(AV)

ꢂꢂ

ꢀꢁꢂ

ꢊ

ꢂꢁꢄ

.252

ꢎꢏꢐꢑ

ꢂꢊꢋ

.275

ꢎꢒꢏ6

ꢂꢁꢄ

6.40

ꢓꢎꢔꢒ

ꢂꢊꢋ

7.00

2.70

ꢄꢆꢌꢃ

Peak Forward Surge

Current

Maximum

I_FSM

30A

8.3ms, half sine

ꢍ

ꢃ

ꢕ

.150

.179

.019

.090

.004

.165

.195

.031

.106

.008

3.80

4.55

0.50

2.30

0.10

4.20

4.95

0.80

2.70

0.20

Instantaneous

ꢖ

Forward Voltage

MB12S~MB14S

MB16S

ꢉ

ꢗ

.027

.058

.195

.039

.043

.062

.205

.049

0.70

1.47

4.95

0.99

1.10

1.57

5.21

1.24

V_F

0.50V

0.70V

0.85V

_FM= 1A;

T_A= 25^OC

ꢘ

MB18S~MB110S

.006

.016

0.15

0.41

Maximum DC

Reverse Current At

Rated DC Blocking

Voltage

^OC

I_R

T_A= 25

0.5mA

20mA

Mounting Pad Layout

T_A=

^OC

100

0.023 MIN.

(0.58 MIN.)

Typical Thermal

Resistance

per leg

^OC

(2)

R_thJA

R_thJL

88 /W

28^O^C/W⁽²⁾

-55 to+150

^OC

0.272 MAX.

(6.91 MAX.)

Operating Junction

and Storage

Temperature Range

T_J

T_STG

0.030 MIN.

(0.76 MIN.)

Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7

2. Thermal resistance form junction to ambient and from junction to lead P.C.B.

mounted on 0.2*0.2"(5.0*5.0mm) copper pad areas.

0.105 (2.67)

0.095 (2.41)

http://www.luguang.cn

Email:lge@luguang.cn

MB12S THRU MB110S

http://www.luguang.cn

Email:lge@luguang.cn

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