MMB4G [LGE]
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LGE 
MMB1G-MMB10G
SILICON BRIDGE RECTIFIERS
FEATURES
z
z
z
z
Glass：passivated chip junctions
High surge overload rating: 30A peak
Saves space on printed circuit boards
High temperature soldering guaranteed: 260°C/10 seconds at 5 lbs. (2.3kg) tension
MECHANICAL DATA
z
Case: Molded plastic body over passivated junctions
z
Terminals: Plated leads solderable per MIL-STD-750, Method 2026
Maximum Ratings (@TA = 25°C unless otherwise specified)
Characteristic
Symbol
MMB1G
MMB2G
MMB4G
MMB6G
MMB8G
MMB10G
UNITS
Peak Repetitive Reverse Voltage
RMS Reverse Voltage
VRRM
VRMS
VDC
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
V
V
V
DC Blocking Voltage
100
1000
Maximum average forward Output current
@TA=25℃
IF(AV)
A
1
Peak forward surge current
8.3ms single half-sine-wave
superimposed on rated load
I²t Rating for fusing @Tj=25℃
IFSM
30
A
3.7
A²S
I²t
Thermal Characteristics
Characteristic
Symbol
MMB1G
MMB2G
MMB4G
MMB6G
MMB8G
MMB10G
UNITS
Typical junction capacitance per leg (NOTE 3)
CJ
R ΘJA
RθJL
RθJC
TJ
8
p F
85
20
30
Typical thermal resistance per leg (NOTE 1)
(NOTE 2)
℃/W
Operating junction temperature range
Storage temperature range
- 55 ---- + 150
- 55 ---- + 150
℃
℃
TSTG
Electrical Characteristics (@TA = 25°C unless otherwise specified)
Characteristic
Symbol
MMB1G
MMB2G
MMB4G
MMB6G
MMB8G
MMB10G
UNITS
Maximum instantaneous forward voltage
at 0.4 A
VF
1.0
V
Maximum reverse current @TA=25℃
at rated DC blocking voltage @TA=100℃
5.0
0.5
μ A
IR
m A
NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
(3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
http://www.lgesemi.com
mail:lge@lgesemi.com
Revision:20170701-P1
MMB1G-MMB10G
SILICON BRIDGE RECTIFIERS
PACKAGE OUTLINE DIMENSIONS
MMB
Dim
A
Min
4.45
3.50
1.25
6.55
0.18
Max
4.75
3.80
1.60
6.90
0.22
A
B
C
+
-
D
E
~
~
F
0.85
1.10
K
D
G
G
H
I
0.00
0.15
1.60
0.80
2.65
1.30
E
F
I
0.60
2.35
K
All Dimensions in mm
SOLDERING FOOTPRINT
Unit ：mm
PACKAGE INFORMATION
Device
Package
Shipping
MMB1G--MMB10G
MMB
5000/Tape&Reel
http://www.lgesemi.com
mail:lge@lgesemi.com
Revision:20170701-P1
MMB1G-MMB10G
SILICON BRIDGE RECTIFIERS
Ratings and Characteristic Curves (TA=25°C unless otherwise noted)
Fig.1-Forward Current Derating Curve
Fig.2- Surge Current Derating Curve
1
30
25
20
15
10
5
0.8
0.6
0.4
0.2
0
0
0
25
50
75
100
125
150
1
10
100
Lead Temperature (°C)
Number of Cycles at 60HZ
Fig.3- Typical Forward Voltage Characteristic
Fig.4- Typical Reverse Characteristic
10
Tj=125℃
Tj=125℃
10
1
Tj=25℃
Tj=75℃
1
Tj=75℃
Tj=25℃
0.1
0.01
0.1
0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
10 20 30 40 50 60 70 80 90 100
Reverse Voltage ,VR(%)
Forward Voltage ,VF(V)
http://www.lgesemi.com
mail:lge@lgesemi.com
Revision:20170701-P1
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