ZTTCS6.00MT [LGE]
ceramic resonator; 陶瓷谐振器型号: | ZTTCS6.00MT |
厂家: | LGE |
描述: | ceramic resonator |
文件: | 总7页 (文件大小:204K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
http://www.luguang.cn Email: lge@luguang.cn
1 SCOPE
This specification shall cover the characteristics of the ceramic reson-
ator with the type ZTTCS6.00MT.
2 PART NO.
PART NUMBER
ZTTCS6.00MT
CUSTOMER PART NO.
SPECIFICATION NO.
3 OUTLINE DRAWING AND STRUCTURE
3.1 Appearance
No visible damage and dirt.
3.2 Dimensions
6.00M
DRAWING 1
UINT: mm
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4 ELECTRICAL SPECIFICATIONS
TABLE 1
Items
Content
6.000
±0.5
40
Remark
Oscillation Frequency Fosc(MHz)
Frequency Accuracy (%)
Resonant Impedance Ro(Ω) max.
Insulation Resistance Ri,(MΩ)min.
500
(100V,1min)
Temperature Coefficient of Oscillation
(Oscillation Frequency
drift,-25℃~+85℃)
±0.3
Frequency (%) max.
6V DC
15V p-p
50
Rating Voltage UR(V)max.
Withstanding Voltage (V)
(DC,1min)
Operating Temperature (℃)
-20~+80
-55~+85
Storage Temperature
(℃)
Aging Rate (%) max.
±0.3
(For Ten Years)
5 TEST
5.1 Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃,
Humidity:65%±20%R.H.)unless the standard
condition(Temperature:+25℃±3℃,Humidity:65%±5% R.H.) is regulated
to test.
5.2 Test Circuit:
IC: 1/6TC4069UBP×2
X: Ceramic Resonator
①INPUT ②GROUND ③OUTPUT
DRAWING 2
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6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
TABLE 2
Performance
Requirements
No
Item
Condition of Test
Keep the resonator at 40 ℃ ±2 ℃ and
90%~95% RH for 96h±4h. Then Release the
resonator into the room Condition for 1h prior
to the Measurement.
It shall fulfill the
specifications in
Table 3.
2.1 Humidity
Subject the resonator to 85℃±5℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
High
2.2 Temperature
Exposure
It shall fulfill the
specifications in
Table 3.
Subject the resonator to -25℃±5℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
Low
It shall fulfill the
specifications in
Table 3.
2.3 Temperature
Exposure
Subject the resonator to -40℃ for 30 min.
followed by a high temperature of 85℃ for
30 min.Cycling shall be repeated 5 times with
a transfer time of 15s. At the room
temperature for 1h prior to the measurement.
It shall fulfill the
specifications in
Table 3.
Temperature
Cycling
2.4
Subject the resonator to vibration for 2h each
in x、y and z axis With the amplitude of
1.5mm, the frequency shall be varied
uniformly between the limits of 10 Hz~55Hz.
It shall fulfill the
specifications in
Table 3.
2.5 Vibration
No visible
damage and it
shall fulfill the
specifications in
Table 3.
Drop the resonator randomly onto a wooden
floor from the height of 100cm 3 times.
Mechanical
Shock
2.6
Passed through the re-flow oven under the
following condition and left at room
temperature for 1 hour before measurement.
Resistance to
Soldering
Heat
It shall fulfill the
specifications in
Table 3.
Temperature at the surface of
the substrate
Time
2.7
Preheat 150℃±5℃
60s±10s
10s±3s
Peak
240℃±5℃
The
terminals
Dipped in 230℃±5℃ solder bath for 3s±0.5s shall be at least
2.8
Solderability
with rosin flux (25wt% ethanol solution.)
95% covered by
solder.
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TABLE 2 Continued
Mount a glass-epoxy board (Width=40mm,
thickness=1.6mm),then bend it to 1mm
displacement and keep it for 5s. (See the
following figure)
PRESS
Mechanical
Board
Bending
damage such as
breaks shall not
2.9
PRESS HEAD
occur.
SUPPORT BAR
TABLE 3 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS
No.
Item
Specification after test
Oscillation Frequency Change
±0.3
3.1
△Fosc/Fosc (%) max
Resonant Impedance Change
±30
3.2
△Ro(Ω)max
Note : The limits in the above table are referenced to the initial measurements.
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
7.1 Recommended land pattern
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DRAWING 4
7.2 Recommended reflow soldering standard conditions
℃
w ith in 1 0 s
℃
P re -h e a tin g
w ith in
w ith in
8 0 s-1 2 0 s.
2 0 s-4 0 s
DRAWING 5
8 PACKAGE
To protect the products in storage and transportation,it is necessary to
pack them(outer and inner package).On paper pack, the following
requirements are requested.
8.1 Dimensions and Mark
At the end of package, the warning (moisture proof, upward put) should
be stick to it.
Dimensions and Mark (see below)
1 Package
2 Certificate ofapproval
3 Label
4 Tying
5 Adhesive tape
6 Belt Box
7 Inner
UNIT:mm
DRAWING 6
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8.2 Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for
plastic bag).
8.3 Quantity of package
Per plastic reel
Per inner box
Per package
1000 pieces of piezoelectric ceramic part
5 reels
12 inner boxe(s 60000 pieces of piezoelectric ceramic
part )
8.4Reel
φ
max
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8.5 Packing Method Sketch Map
Leader
200mm Max
Blank Pocket
10 Pitches
Blank Pocket
10 Pitches
Loaded Pocket
8.6Test Condition Of Peeling Strength
T o p T a p e
1 0 ° M a x
C a rrie r T a p e
9 OTHERS
9.1 Caution of use
9.1.1 Do not use this product with bend. Please don’t apply axcess
mechanical stress to the component and terminals at soldering.
9.1.2 The component may be damaged when an excess stress will be
applied.
9.1.3 Comformal coating of the component is acceptable,However the
resin materials ,curing temperature and other process conditions should
be evaluated to conform stable electrical characteristics are maintained.
9.2 Notice
9.2.1 This specification mentions the quality of the component as a
single unit. Please insure the component is thoroughly evaluated in your
application circuit.
9.2.2 Please return one of this specification after your signature of
acceptance.
9.2.3 When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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