ZTTCS6.00MT [LGE]

ceramic resonator; 陶瓷谐振器
ZTTCS6.00MT
型号: ZTTCS6.00MT
厂家: LGE    LGE
描述:

ceramic resonator
陶瓷谐振器

陶瓷谐振器 晶体
文件: 总7页 (文件大小:204K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
http://www.luguang.cn Email: lge@luguang.cn  
1 SCOPE  
This specification shall cover the characteristics of the ceramic reson-  
ator with the type ZTTCS6.00MT.  
2 PART NO.  
PART NUMBER  
ZTTCS6.00MT  
CUSTOMER PART NO.  
SPECIFICATION NO.  
3 OUTLINE DRAWING AND STRUCTURE  
3.1 Appearance  
No visible damage and dirt.  
3.2 Dimensions  
6.00M  
DRAWING 1  
UINT: mm  
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4 ELECTRICAL SPECIFICATIONS  
TABLE 1  
Items  
Content  
6.000  
±0.5  
40  
Remark  
Oscillation Frequency FoscMHz)  
Frequency Accuracy %)  
Resonant Impedance Romax.  
Insulation Resistance Ri,MΩmin.  
500  
100V1min)  
Temperature Coefficient of Oscillation  
Oscillation Frequency  
drift-25℃~+85℃)  
±0.3  
Frequency %max.  
6V DC  
15V p-p  
50  
Rating Voltage URVmax.  
Withstanding Voltage (V)  
(DC1min)  
Operating Temperature ()  
-20+80  
-55+85  
Storage Temperature  
()  
Aging Rate %max.  
±0.3  
For Ten Years)  
5 TEST  
5.1 Test Conditions  
Parts shall be tested under a condition (Temperature:+20±15℃,  
Humidity:65%±20%R.H.)unless the standard  
condition(Temperature:+25±3,Humidity:65%±5% R.H.) is regulated  
to test.  
5.2 Test Circuit:  
IC: 1/6TC4069UBP×2  
X: Ceramic Resonator  
①INPUT ②GROUND ③OUTPUT  
DRAWING 2  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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http://www.luguang.cn Email: lge@luguang.cn  
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS  
TABLE 2  
Performance  
Requirements  
No  
Item  
Condition of Test  
Keep the resonator at 40 ±2 and  
90%~95% RH for 96h±4h. Then Release the  
resonator into the room Condition for 1h prior  
to the Measurement.  
It shall fulfill the  
specifications in  
Table 3.  
2.1 Humidity  
Subject the resonator to 85±5for 96h,  
then release the resonator into the room  
conditions for 1h prior to the measurement.  
High  
2.2 Temperature  
Exposure  
It shall fulfill the  
specifications in  
Table 3.  
Subject the resonator to -25±5for 96h,  
then release the resonator into the room  
conditions for 1h prior to the measurement.  
Low  
It shall fulfill the  
specifications in  
Table 3.  
2.3 Temperature  
Exposure  
Subject the resonator to -40for 30 min.  
followed by a high temperature of 85for  
30 min.Cycling shall be repeated 5 times with  
a transfer time of 15s. At the room  
temperature for 1h prior to the measurement.  
It shall fulfill the  
specifications in  
Table 3.  
Temperature  
Cycling  
2.4  
Subject the resonator to vibration for 2h each  
in xy and z axis With the amplitude of  
1.5mm, the frequency shall be varied  
uniformly between the limits of 10 Hz~55Hz.  
It shall fulfill the  
specifications in  
Table 3.  
2.5 Vibration  
No visible  
damage and it  
shall fulfill the  
specifications in  
Table 3.  
Drop the resonator randomly onto a wooden  
floor from the height of 100cm 3 times.  
Mechanical  
Shock  
2.6  
Passed through the re-flow oven under the  
following condition and left at room  
temperature for 1 hour before measurement.  
Resistance to  
Soldering  
Heat  
It shall fulfill the  
specifications in  
Table 3.  
Temperature at the surface of  
the substrate  
Time  
2.7  
Preheat 150±5℃  
60s±10s  
10s±3s  
Peak  
240±5℃  
The  
terminals  
Dipped in 230±5solder bath for 3s±0.5s shall be at least  
2.8  
Solderability  
with rosin flux (25wt% ethanol solution.)  
95% covered by  
solder.  
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http://www.luguang.cn Email: lge@luguang.cn  
TABLE 2 Continued  
Mount a glass-epoxy board (Width=40mm,  
thickness=1.6mm),then bend it to 1mm  
displacement and keep it for 5s. (See the  
following figure)  
PRESS  
Mechanical  
Board  
Bending  
damage such as  
breaks shall not  
2.9  
PRESS HEAD  
occur.  
SUPPORT BAR  
TABLE 3 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS  
No.  
Item  
Specification after test  
Oscillation Frequency Change  
±0.3  
3.1  
Fosc/Fosc (%) max  
Resonant Impedance Change  
±30  
3.2  
Ro(Ω)max  
Note The limits in the above table are referenced to the initial measurements.  
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING  
STANDARD CONDITIONS  
7.1 Recommended land pattern  
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DRAWING 4  
7.2 Recommended reflow soldering standard conditions  
w ith in 1 0 s  
P re -h e a tin g  
w ith in  
w ith in  
8 0 s-1 2 0 s.  
2 0 s-4 0 s  
DRAWING 5  
8 PACKAGE  
To protect the products in storage and transportationit is necessary to  
pack themouter and inner package.On paper pack, the following  
requirements are requested.  
8.1 Dimensions and Mark  
At the end of package, the warning (moisture proof, upward put) should  
be stick to it.  
Dimensions and Mark (see below)  
1 Package  
2 Certificate ofapproval  
3 Label  
4 Tying  
5 Adhesive tape  
6 Belt Box  
7 Inner  
UNIT:mm  
DRAWING 6  
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http://www.luguang.cn Email: lge@luguang.cn  
8.2 Section of package  
Package is made of corrugated paper with thickness of  
0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for  
plastic bag).  
8.3 Quantity of package  
Per plastic reel  
Per inner box  
Per package  
1000 pieces of piezoelectric ceramic part  
5 reels  
12 inner boxes 60000 pieces of piezoelectric ceramic  
part )  
8.4Reel  
φ
max  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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http://www.luguang.cn Email: lge@luguang.cn  
8.5 Packing Method Sketch Map  
Leader  
200mm Max  
Blank Pocket  
10 Pitches  
Blank Pocket  
10 Pitches  
Loaded Pocket  
8.6Test Condition Of Peeling Strength  
T o p T a p e  
1 0 ° M a x  
C a rrie r T a p e  
9 OTHERS  
9.1 Caution of use  
9.1.1 Do not use this product with bend. Please don’t apply axcess  
mechanical stress to the component and terminals at soldering.  
9.1.2 The component may be damaged when an excess stress will be  
applied.  
9.1.3 Comformal coating of the component is acceptable,However the  
resin materials ,curing temperature and other process conditions should  
be evaluated to conform stable electrical characteristics are maintained.  
9.2 Notice  
9.2.1 This specification mentions the quality of the component as a  
single unit. Please insure the component is thoroughly evaluated in your  
application circuit.  
9.2.2 Please return one of this specification after your signature of  
acceptance.  
9.2.3 When something gets doubtful with this specifications, we shall  
jointly work to get an agreement.  
SHENZHEN LUGUANG ELECTRONIC TECHNOLOGY CO.,LTD  
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