ZTTCW240MX [LGE]
ceramic resonator; 陶瓷谐振器型号: | ZTTCW240MX |
厂家: | LGE |
描述: | ceramic resonator |
文件: | 总9页 (文件大小:248K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
http://www.luguang.cn Email: lge@luguang.cn
1. SCOPE
This specification shall cover the characteristics of the ceramic
resonator with the type ZTTCW24.0MX.
2. PART NO.:
PART NUMBER CUSTOMER PART NO SPECIFICATION NO
ZTTCW24.0MX
3. OUTLINE DRAWING AND DIMENSIONS:
Appearance: No visible damage and dirt.
Dimensions:
NOTES:
1.All dimensions are in millimeters.
2.Marking: A and EIAJ Monthly Code.
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4. STRUCTURE
NO:
Components
Materials
Insulation Substrate
Piezoelectric Ceramics (PZT)
Insulation Substrate
Epoxy Resin
1
2
3
4
5
6
Ceramic Substrate
Ceramic Substrate
Ceramic Substrate
Adhesive
UV Ink for Marking
Outer Electrodes
Top and Bottom Electrodes
Ag+Ni(under plating)+Sn(over plating)
Side Electrodes
Ni+Cu+Ag(under
plating)
plating)+Sn(over
7
Electrode
Cu+Ag
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5. ELECTRICAL SPECIFICATIONS:
Requirements
No
Item
5.1 Oscillation Frequency Fosc(MHz)
Frequency Accuracy (%)
24.0
±0.5
5.2 Resonant Impedance Ro (Ω)max
40
5.3
Temperature Coefficient of
Oscillation Frequency (%) max
Withstanding Voltage
Rating Voltage UR (V)
(1) D.C. Voltage
±0.2 (Oscillation Frequency
drift -25℃ to +85℃)
50 VDC, 1 min
5.4
5.5
6 VDC.
(2) A.C. Voltage
15 Vp-p.
5.6
500
Insulation Resistance Ri(, MΩ)min
Operating Temperature (℃)
5.7
5.8
-25~+85
-55~+85
Storage Temperature
(℃)
5.9
5.10
Aging Rate (%) max
Loop Gain (dB) min
±0.2 (For 10 years)
12.0
6. MEASUREMENT:
Measurement Conditions: Parts shall be measured under a condition
( Temp. :20±15℃,Humidity :65±20% R.H.) unless the standard
condition(Temp.:25±3℃,Humidity :65±5% R.H.) is regulated to
measure.
Test Circuit:
IC: 1/6 TC74HCU04P×2
X: Ceramic Resonator
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7. PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No
Item
Condition of Test
Performance
Requirements
7.1 Humidity
Keep the resonator at 60±2 ℃ and It shall fulfill the
90-95% RH for 96±4 hours. Then release specifications in Table
the resonator into the room condition for 1 1.
hour prior to the measurement.
7.2 Vibration
Subject the resonator to vibration for 2
hours each in x、y and z axis with the
amplitude of 1.5mm, the frequency shall
be varied uniformly between the limits of
10Hz—55Hz.
It shall fulfill the
specifications in Table
1.
7.3 Mechanical
Shock
Drop the resonator randomly onto a
It shall fulfill the
wooden floor from the height of 100cm 3 specifications in Table
times. 1.
Passed through the re-flow oven under the It shall fulfill the
following condition and left at room
temperature for 1 hour before
measurement.
7.4 Soldering
Test
specifications in Table
1.
Temperature at the
surface of the
Time
substrate
Preheat 150±5℃
60±10 sec
10±3 sec
Peak
240±5℃
7.5 Solder
Ability
Dipped in
The terminals shall
be at least 95%
covered by solder.
230±5℃ solder
bath for 3±0.5 sec
seconds with rosin
flux 25wt% ethanol
solution.
7.6 High
Temperature
Exposure
Subject the
resonator to 85±5℃ specifications
It shall fulfill the
in
for 96±4 hours.
Then release the
resonator into the
room conditions for
1 hour prior to the
measurement.
Table 1.
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7. PHYSICAL AND ENVIRONMENAL CHARACTERISICS
(Continued from the preceding page)
No
Item
Condition of Test
Performance
Requirements
7.7 Low
Subject the resonator to –25±5℃ for
96±4 hours. Then release the resonator
into the room conditions for 1 hour prior
to the measurement.
It shall fulfill the
specifications in Table
1.
Temperature
Exposure
7.8 Temperature
Cycling
Subject the resonator to -40℃ for
30 min. followed by a high temperature of specifications in Table
It shall fulfill the
85℃ for 30 min. cycling shall be
repeated 5 times with a transfer time of 15
sec. At the room temperature for 1 hour
prior to the measurement.
1.
7.9 Board
Bending
Mount a glass-epoxy board
Mechanical damage
(Width=40mm,thickness=1.6mm), then such as breaks shall
bend it to 1mm displacement and keep It not occur.
for 5 seconds. (See the following Figure)
PRESS
PRESS HEAD
D
SUPPORT BAR
TABLE 1
Item
Specification
Oscillation Frequency Change
±0.3
60
△Fosc/Fosc (%) max
Resonant Impedance (Ω) max
8. REVIEW OF SPECIFICATIONS
When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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9. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
a) Recommended land pattern
:Land Pattern
b) Recommended reflow soldering standard conditions
within 10 sec
℃
Pre-heating
within
within
80-120sec.
20-40sec
10.PACKAGE
To protect the products in storage and transportation,it is
necessary to pack them(outer and inner package).On paper pack, the
following requirements are requested.
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a) Dimensions and Mark
At the end of package, the warning (moisture proof, upward put)
should be stick to it.
Dimensions and Mark (see below)
NO.
1
Name
Package
Quantity
Notes
1
1
2
Certificate of approval
Label
3
1
4
Tying
2
5
Adhesive tape
Belt
1.2m
2.9m
10
6
7
Inner Box
b)
Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 12 inner boxes, each box has 6 reels (each reel for
plastic bag).
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c)
Quantity of package
Per plastic reel
Per inner box
Per package
3000 pieces of piezoelectric ceramic part
6 reels
12 inner boxes(216000 pieces of piezoelectric
ceramic part )
d)
Inner Packing Dimensions
1
2
3
Label
UNIT: mm
QC Label
Inner Box
Pars shall be packaged in box with hold down tape upside. Part No.,
quantity and lot No.
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e) Reel
φ
max
f)
Packing Method Sketch Map
Leader
200mm Max
Blank Pocket
10 Pitches
Blank Pocket
10 Pitches
Loaded Pocket
g) Test Condition Of Peeling Strength
T o p T a p e
1 0 ° M a x
C a r r i e r T a p e
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