概述
数据手册L8SRF25030 概述
SUPER BRIGHT RECTANGLE TYPE LED LAMPS SUPER BRIGHT回型LED灯
L8SRF25030 数据手册
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PDF下载LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT RECTANGLE TYPE LED LAMPS
L8SRF25030
DATA SHEET
DOC. NO : QW0905-:L8SRF25030
A
REV.
:
24 - May - 2007
DATE
:
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. L8SRF25030
1/4
Package Dimensions
5.6
LIGHTED AREA
3.64
3.18
6.16
REFERENCE MARK
E
S
6.65
0.38
□0.5
TYP
26.4MIN
1.0MIN.
2.54TYP
- +
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L8SRF25030
Page 2/4
Absolute Maximum Ratings at Ta=25 ℃
Ratings
8SRF
25
Symbol
Parameter
UNIT
IF
IFP
Forward Current
mA
mA
mW
μA
V
Peak Forward Current
Duty 1/10@10KHz
75
Power Dissipation
PD
Ir
65
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
10
ESD
Topr
2000
-40 ~ +85
℃
Tstg
Storage Temperature
-40 ~ +100
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Dominant
Luminous
intensity
@20mA(mcd)
Spectral
halfwidth
△λnm
Forward
voltage
@20mA(V)
Viewing
angle
2θ 1/2
(deg)
wave
length
λDnm
COLOR
MATERIAL
AlGaInP
PART NO
Typ.
90
Emitted
Red
Lens
Min. Max. Min.
630
20
1.5 2.4
50
120
Red Diffused
L8SRF25030
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L8SRF25030
Page 3/4
Typical Electro-Optical Characteristics Curve
8SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
60
2.0
1.0
0.0
50
40
30
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
2.5
2.0
1.1
1.0
1.5
1.0
0.9
0.8
0.5
0.0
-20
0
20
40
60
80
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L8SRF25030
Page
4/4
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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