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LA140B-3-HG-S3-PF

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品牌：LIGITEK

描述：LED ARRAY

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LA140B-3-HG-S3-PF 概述

LED ARRAY LED阵列

LA140B-3-HG-S3-PF 数据手册

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LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

LED ARRAY

Lead-Free Parts

LA140B-3/HG-S3-PF

DATA SHEET

DOC. NO : QW0905-LA140B-3/HG-S3-PF

REV.

: B

DATE

: 06 - Oct. - 2008

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page

PART NO. LA140B-3/HG-S3-PF

1/6

Package Dimensions

2.2±0.5

4.6

6.5

7.4

2.9

2.4±0.5

3.5~4.0

0.5

TYP

2.54TYP

4.75±0.5

LHG2662-PF

2.9

3.3

3.1

4.3

0.5

TYP

25.0MIN

1.0MIN

2.54TYP

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.

2.Specifications are subject to change without notice.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LA140B-3/HG-S3-PF

Page 2/6

Absolute Maximum Ratings at Ta=25 ℃

Ratings

Symbol

Parameter

UNIT

Forward Current

μA

℃

Peak Forward Current

Duty 1/10@10KHz

120

100

IFP

Power Dissipation

Reverse Current @5V

Operating Temperature

Topr

-40 ~ +85

Tstg

Storage Temperature

-40 ~ +100

℃

Typical Electrical & Optical Characteristics (Ta=25 ℃)

Forward

voltage

@20mA(V) @ 10mA(mcd)

Luminous

intensity

Peak

wave

length

λPnm

Viewing

angle

2θ 1/2

Spectral

halfwidth

△λnm

COLOR

PART NO

MATERIAL

(deg)

Typ.

4.2

Emitted

Red

Lens

Max.

Min.

1.7

697

565

2.6 1.8

2.6 8.0

GaP

LA140B-3/HG-S3-PF

White Diffused

Green

1.7

Note : 1.The forward voltage data did not including ±0.1V testing tolerance.

2. The luminous intensity data did not including ±15% testing tolerance.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page3/6

PART NO. LA140B-3/HG-S3-PF

Typical Electro-Optical Characteristics Curve

H CHIP

Fig.1 Forward current vs. Forward Voltage

Fig.2 Relative Intensity vs. Forward Current

3.0

1000

100

2.5

2.0

1.5

1.0

0.5

0.0

1.0

0.1

1.0

2.0

3.0

4.0

5.0

1.0

100

1000

Forward Current(mA)

Forward Voltage(V)

Fig.3 Forward Voltage vs. Temperature

Fig.4 Relative Intensity vs. Temperature

3.0

1.2

2.5

2.0

1.5

1.0

0.5

1.1

1.0

0.9

0.8

0.0

-40

-20

100

-40

-20

80 100

Ambient Temperature(℃)

Fig.5 Relative Intensity vs. Wavelength

1.0

0.5

0.0

600

700

800

900

1000

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page 4/6

PART NO. LA140B-3/HG-S3-PF

Typical Electro-Optical Characteristics Curve

G CHIP

Fig.1 Forward current vs. Forward Voltage

Fig.2 Relative Intensity vs. Forward Current

3.5

3.0

1000

100

2.5

2.0

1.5

1.0

0.5

1.0

0.0

0.1

1.0

2.0

3.0

4.0

5.0

1.0

100

1000

Forward Current(mA)

Forward Voltage(V)

Fig.3 Forward Voltage vs. Temperature

Fig.4 Relative Intensity vs. Temperature

3.0

1.2

2.5

2.0

1.1

1.0

1.5

1.0

0.5

0.9

0.8

0.0

-40

-20

100

-40

-20

100

Ambient Temperature(℃)

Fig.5 Relative Intensity vs. Wavelength

Fig.6 Directive Radiation

1.0

0.5

0.0

500

550

600

650

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LA140B-3/HG-S3-PF

Page 5/6

Soldering Condition(Pb-Free)

1.Iron:

Soldering Iron:30W Max

Temperature 350°C Max

Soldering Time:3 Seconds Max(One time only)

Distance:2mm Min(From solder joint to case)

2.Wave Soldering Profile

Dip Soldering

Preheat: 120°C Max

Preheat time: 60seconds Max

Ramp-up

2°C/sec(max)

Ramp-Down:-5°C/sec(max)

Solder Bath:260°C Max

Dipping Time:3 seconds Max

Distance:2mm Min(From solder joint to case)

Temp(°C)

260°C3sec Max

260°

5°/sec

max

120°

2°/sec

25°

0°

max

150

Time(sec)

100

Preheat

60 Seconds Max

Note: 1.Wave solder should not be made more than one time.

2.You can just only select one of the soldering conditions as above.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page

PART NO. LA140B-3/HG-S3-PF

6/6

Reliability Test:

Reference

Description

Test Item

Test Condition

Standard

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Operating Life Test

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

High Temperature

Storage Test

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

MIL-STD-883:1008

JIS C 7021: B-10

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Low Temperature

Storage Test

1.Ta=-40 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

JIS C 7021: B-12

1.Ta=85℃

2.RH=85%

3.t=240hrs ±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hours.

MIL-STD-202:103B

JIS C 7021: B-11

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

Thermal Shock Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

Solder Resistance

Test

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to see soldering well

performed or not.

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

Solderability Test

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