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LA232W-SEFUG-PF

更新时间：2024-09-18 07:31:02
品牌：LIGITEK
描述：LED ARRAY

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LA232W-SEFUG-PF 概述

LED ARRAY LED阵列

LA232W-SEFUG-PF 数据手册

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LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
LED ARRAY  
Pb  
Lead-Free Parts  
LA232W/SEFUG-PF  
DATA SHEET  
DOC. NO : QW0905-LA232W/SEFUG-PF-08  
REV.  
: B  
DATE  
: 28 - Jan.- 2008  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 1/6  
PART NO. LA232W/SEFUG-PF  
Package Dimensions  
8.0  
5.7±0.5  
10.0  
6.2  
5.0  
10.0  
6.0  
3.5±0.5  
1.15  
0.5TYP  
3.5  
5.9±0.5  
2.54TYP  
2.54TYP  
2
3
1
UG  
SEF  
1.ANODE ORANGE  
2.COMMON CATHODE  
3.ANODE GREEN  
1
2
3
LSEFUG3392/R2-PF  
5.0  
7.6  
5.9  
8.6  
SEF UG  
10.5±0.5  
1.5MAX  
1
2
3
1.ANODE ORANGE  
2.COMMON CATHODE  
3.ANODE GREEN  
18.0MIN  
2.0MIN  
0.5TYP  
2.0MIN  
2.54TYP  
2.54TYP  
1
2
3
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page2/6  
PART NO. LA232W/SEFUG-PF  
Absolute Maximum Ratings at Ta=25 ℃  
Ratings  
Symbol  
Parameter  
UNIT  
Orange  
25  
Green  
25  
IF  
IFP  
Forward Current  
mA  
mA  
Peak Forward Current  
Duty 1/10@10KHz  
60  
75  
mW  
μA  
Power Dissipation  
PD  
Ir  
65  
65  
Reverse Current @5V  
Electrostatic Discharge( * )  
Operating Temperature  
Storage Temperature  
10  
ESD  
Topr  
Tstg  
2000  
V
-40 ~ +85  
-40 ~ +100  
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic  
glove is recommended when handing these LED. All devices, equipment and machinery must be properly  
grounded.  
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)  
Forward  
voltage  
@20mA(V) @20mA(mcd)  
Luminous Viewing  
Dominant  
wave  
length  
Spectral  
halfwidth  
△λnm  
intensity  
angle  
2θ 1/2  
(deg)  
COLOR  
MATERIAL  
PART NO  
λDnm  
Typ.  
Lens  
Emitted  
Min. Max. Min.  
AlGaInP Orange  
605  
574  
300  
17  
20  
1.7 2.6  
2.6  
450  
70  
70  
White Diffused  
LA232W/SEFUG-PF  
Green  
65 120  
1.7  
AlGaInP  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LA232W/SEFUG-PF  
Page 3/6  
Typical Electro-Optical Characteristics Curve  
SEF CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
60  
50  
3.0  
2.0  
40  
30  
20  
1.0  
0.0  
10  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
1.2  
2.5  
2.0  
1.5  
1.1  
1.0  
0.9  
0.8  
1.0  
0.5  
0.0  
-20  
0
20  
40  
60  
80  
-20  
0
20  
40  
60  
80  
Ambient Temperature(℃)  
Ambient Temperature(℃)  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0.0  
550  
500  
600  
650  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LA232W/SEFUG-PF  
Page 4/6  
Typical Electro-Optical Characteristics Curve  
UG CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
2.0  
1.0  
60  
50  
40  
30  
20  
10  
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
1.2  
2.5  
2.0  
1.5  
1.0  
1.1  
1.0  
0.9  
0.8  
0.5  
0
-20  
0
20  
40  
60  
80  
-20  
0
20  
40  
60  
80  
Ambient Temperature(℃)  
Ambient Temperature(℃)  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0
500  
550  
600  
650  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LA232W/SEFUG-PF  
Page 5/6  
Soldering Condition(Pb-Free)  
1.Iron:  
Soldering Iron:30W Max  
Temperature 350°C Max  
Soldering Time:3 Seconds Max(One time only)  
Distance:2mm Min(From solder joint to case)  
2.Wave Soldering Profile  
Dip Soldering  
Preheat: 120°C Max  
Preheat time: 60seconds Max  
Ramp-up  
2°C/sec(max)  
Ramp-Down:-5°C/sec(max)  
Solder Bath:260°C Max  
Dipping Time:3 seconds Max  
Distance:2mm Min(From solder joint to case)  
Temp(°C)  
260°C3sec Max  
260°  
5°/sec  
max  
120°  
2°/sec  
25°  
0°  
max  
0
50  
150  
Time(sec)  
100  
Preheat  
60 Seconds Max  
Note: 1.Wave solder should not be made more than one time.  
2.You can just only select one of the soldering conditions as above.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LA232W/SEFUG-PF  
Page 6/6  
Reliability Test:  
Reference  
Standard  
Description  
Test Item  
Test Condition  
1.Under Room Temperature  
2.If=20mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resistance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under condition  
of high temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105 ℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40 ℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65℃±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hours.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105 ℃±5℃&-40℃±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ℃±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ℃±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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