LFH3360-PF [LIGITEK]

FLASH ROUND TYPE LED LAMPS; FLASH ROUND型LED灯
LFH3360-PF
型号: LFH3360-PF
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

FLASH ROUND TYPE LED LAMPS
FLASH ROUND型LED灯

文件: 总2页 (文件大小:66K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Pb  
Lead-Free Parts  
Page 1/2  
FLASH ROUND TYPE LED LAMPS  
Package Dimension  
SERIES  
Features  
LFH3360-PF  
Built-in IC chip flashes lamps  
on and off to attract attention  
Pulse rate 2.4Hz  
5.0 5.9  
T-1 size  
1 inch leads  
Large full flood radiating area  
IC compatible  
7.6  
8.6  
Description  
1.5MAX  
The LFH3360-PF series is a solid state  
lamp with a red diffused plastic lens  
The built-in IC flashes the lamp on/off  
and can be driven directly by  
25.0MIN  
0.5  
TYP  
standard TTL and CMOS circuit  
eliminating the need for external  
switching circuitry  
1.0MIN  
2.54TYP  
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted  
2.Specifications are subject to change without notice  
Part Selection And Application Information (Ratings At 25Ambient)  
Peak  
wave  
length  
λPnm  
Operating  
voltage  
Pulse  
rate(Hz)  
volt=5v  
Spectral  
halfwidth  
λnm  
Luminous  
intensity  
volt=5v(mcd)  
COLOR  
PART NO  
MATERIAL  
Typ.  
Min.  
Max.  
Min.  
Min.  
Max.  
Emitted  
Red  
Lens  
LFH3360-PF  
Red Diffused  
GaP  
697  
90  
2.0  
3.0  
1.7  
2.8  
3.0  
12  
Absolute Maximum Rating (Ta=25)  
UNIT  
RED  
GREEN  
YELLOW  
ORANGE  
REMARK  
PARAMETER  
H
Peak Current (1/4)  
Duty cycle  
60  
mA  
V
V
Operating Voltage  
Reverse Voltage  
10  
0.4  
Operating Temperature  
0TO +85℃  
-20TO +85℃  
REV. : A  
Storage Temperature  
DOC NO:QW0905-LFH3360-PF  
DATE:31 - Mar. - 2006  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
FLASH ROUND TYPE LED LAMPS  
LFH3360-PF  
Page 2/2  
Soldering Condition(Pb-Free)  
1.Iron:  
Soldering Iron:30W Max  
Temperature 350°C Max  
Soldering Time:3 Seconds Max(One Time)  
Distance:2mm Min(From solder joint to body)  
2.Wave Soldering Profile  
Dip Soldering  
Preheat: 120°C Max  
Preheat time: 60seconds Max  
Ramp-up  
2°C/sec(max)  
Ramp-Down:-5°C/sec(max)  
Solder Bath:260°C Max  
Dipping Time:3 seconds Max  
Distance:2mm Min(From solder joint to body)  
Temp(°C)  
260°C3sec Max  
260°  
120°  
5°/sec  
max  
2°/sec  
25°  
0°  
max  
0
50  
150  
Time(sec)  
100  
Preheat  
60 Seconds Max  

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