LG-150HRF-UG-CT [LIGITEK]
LED SMD; SMD LED型号: | LG-150HRF-UG-CT |
厂家: | LIGITEK ELECTRONICS CO., LTD. |
描述: | LED SMD |
文件: | 总12页 (文件大小:181K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-150HRF/UG-CT
DATA SHEET
DOC. NO : QW0905-LG-150HRF/UG-CT
REV.
: B
DATE
: 12 - Apr - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 1/11
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-150HRF/UG SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
COLOR
PART NO
MATERIAL
Emitted
Red
Lens
AlGaInP
AlGaInP
LG-150HRF/UG-CT
Water Clear
Green
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 2/11
Package Dimensions
Cathode Mark
1.1
0.5
2
1
Resin
0.6
0.6
3.2
2.0
DIE2
Soldering
Terminal
DIE1
4
2
3
PCB
0.4
0.6
0.6
1.6
1
HRF
UG
4
3
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.7
0.4
0.7
0.8
1.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 3/11
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HRF
72
UG
78
mW
Power Dissipation
PD
IFP
Peak Forward Current
Duty 1/10@10KHz
90
30
10
120
30
mA
mA
μA
IF
Forward Current
Reverse Current @5V
Electrostatic Discharge
Operating Temperature
Storage Temperature
10
Ir
2000
ESD
Topr
Tstg
V
-40 ~ +85
-40 ~ +90
℃
℃
Max 260℃for 5 sec Max
Soldering Temperature
Tsol
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Typ.
60
Symbol
Items
Min.
32
Max. UNIT
CONDITION
HRF
----
mcd
----
Luminous Intensity
Iv
IF=20mA
IF=20mA
UG
HRF
UG
32
60
---- 642
---- 575
---- 630
---- 574
----
nm
----
Peak Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
λP
λD
△λ
HRF
UG
----
nm
----
IF=20mA
HRF
UG
----
----
1.5
1.7
----
20
20
----
nm
----
IF=20mA
IF=20mA
IF=20mA
HRF
UG
----
----
140
2.4
V
2.6
V
F
HRF
UG
----
Viewing Angle
deg
2θ1/2
---- 140
----
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 4/11
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.5
3.0
2.5
2.0
100
10
1.5
1.0
0.5
0
1.0
0.1
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
1.2
1.1
1.0
2.0
1.5
1.0
0.5
0.9
0.8
0
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
0.5
0
550
6050
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 5/11
Typical Electro-Optical Characteristics Curve
UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.0
2.5
2.0
100
10
1.5
1.0
0.5
1.0
0.1
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
1.2
1.1
1.0
0.9
0.8
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 6/11
Carrier Type Dimensions
4.0±0.2
2.0
0.23
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.38
Polarity
1.36
4.0±0.2
1.76
Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm.
‧ Packing Specifications
Label
Label
Aluminum Moist-Proof bag
Description
8.0mm tape,7"reel
Quantity/Reel
3000 devices
Part No.
LG-150HRF/UG-CT
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/11
PART NO. LG-150HRF/UG-CT
Label Explanation
BIN P : Red Chip Luminous Intensity
BIN P : Green Chip Luminous Intensity
HUE 30 : Red Chip Dominant Wavelength
HUE 8 : Green Chip Dominant Wavelength
1.6 - 2.4 : Forward Voltage
立碁電子工業股份有限公司
LIGITEK ELECTRONICS CO., LTD.
Pb
LIGITEK LED
PART NO. : LG-150HRF/UG-CT
LOT NO. : MC9400472
Q'TY(PCS) : 3000 PCS
VF:1.6 - 2.4
VF:1.8 - 2.6
BIN/HUE : P/30-P/8
Reel Dimensions
2.0±0.5
178±1.5
6.0±1.0
9.0±1.0
12.0±1.0
ψ13.5±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 8/11
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 9/11
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260℃
245±5℃within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
Cooling
+5℃/sec
-5℃/sec
Preheat
150
120
Time
60 ~ 120 sec
5sec
3-2 PB-Free Reflow Solder
1~5°C/sec
260°C MaX.
10sec.Max
Preheat
180~200°C
Above 220°C
60 sec.Max.
1~5°C/sec
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150HRF/UG-CT
Page 10/11
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃~ 35℃,RH60%,
they should be treated at 60℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 11/11
PART NO. LG-150HRF/UG-CT
Reliability Test:
Reference
Standard
Test Item
Classification
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
Operating Life Test
3.t=1000 hrs (-24hrs, +72hrs)
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Endurance
Test
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=1000hrs ±2hrs
MIL-STD-202F:103B
JIS C 7021: B-11
1.Ta=105℃±5℃&-40℃±5℃
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
(10min)
(10min)
Thermal Shock Test
Solderability Test
2.total 10 cycles
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
JIS C 7021: A-2
Environmental
Test
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
1.105℃~25℃ ~-55℃~25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
Temperature
Cycling
1.T=260°C Max. 10sec.Max.
2. 6 Min
MIL-STD-750D:2031.2
J-STD-020
IR Reflow
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