LG-150SRF-9UG-CT [LIGITEK]
LED SMD; SMD LED![LG-150SRF-9UG-CT](http://pdffile.icpdf.com/pdf1/p00129/img/icpdf/LG-15_715315_icpdf.jpg)
型号: | LG-150SRF-9UG-CT |
厂家: | ![]() |
描述: | LED SMD |
文件: | 总11页 (文件大小:167K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-150SRF/9UG-CT
DATA SHEET
DOC. NO : QW0905-LG-150SRF/9UG-CT
REV.
: A
DATE
: 03 - Aug - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 1/11
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-150SRF/9UG SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
COLOR
PART NO
MATERIAL
Emitted
Red
Lens
AlGaInP
AlGaInP
LG-150SRF/9UG-CT
Water Clear
Green
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 2/11
Package Dimensions
Cathode Mark
1.1
0.5
2
1
Resin
0.6
0.6
3.2
2.0
Soldering
Terminal
DIE2
DIE1
4
3
PCB
0.4
0.6
0.6
1.6
2
1
9UG
SRF
4
3
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.7
0.4
0.7
0.8
1.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 3/11
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SRF
72
9UG
78
mW
Power Dissipation
PD
IFP
Peak Forward Current
Duty 1/10@10KHz
90
30
10
60
30
10
mA
mA
μA
V
IF
Forward Current
Reverse Current @5V
Electrostatic Discharge
Operating Temperature
Storage Temperature
Ir
ESD
Topr
Tstg
2000
-40 ~ +85
-40 ~ +90
℃
℃
Max 260℃for 5 sec Max
Soldering Temperature
Tsol
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Typ.
40
Symbol
Items
Max. UNIT
Min.
20
CONDITION
SRF
----
mcd
----
Luminous Intensity
Iv
IF=20mA
IF=20mA
9UG
SRF
9UG
SRF
9UG
SRF
9UG
SRF
9UG
SRF
9UG
20
40
---- 642
575
---- 630
----
nm
----
Peak Wavelength
λP
λD
△λ
----
----
nm
----
IF=20mA
Dominant Wavelength
Spectral Line Half-Width
574
20
----
----
----
1.5
1.7
----
nm
----
IF=20mA
IF=20mA
IF=20mA
20
----
----
2.4
V
2.6
V
F
Forward Voltage
---- 140
---- 140
----
deg
2θ1/2
----
Viewing Angle
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/11
PART NO. LG-150SRF/9UG-CT
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.0
2.5
2.0
100
10
1.5
1.0
0.5
1.0
0.1
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
1.2
1.1
1.0
0.9
0.8
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/11
PART NO. LG-150SRF/9UG-CT
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.0
2.5
2.0
100
10
1.5
1.0
0.5
0
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.1
1.0
0.9
1.5
1.0
0.5
0
0.8
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
0.5
0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 6/11
Carrier Tape Dimensions
4.0±0.2
2.0
0.23
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.38
Polarity
1.36
4.0±0.2
1.76
Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm.
‧ Packing Specifications
Label
Label
Aluminum Moist-Proof bag
Description
8.0mm tape,7"reel
Quantity/Reel
3000 devices
Part No.
LG-150SRF/9UG-CT
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 7/11
Label Explanation
BIN Q : Red Chip Luminous Intensity
BIN N : Green Chip Luminous Intensity
HUE 29 : Red Chip Dominant Wavelength
HUE 9 : Green Chip Dominant Wavelength
1.8 - 2.6 : Forward Voltage
立碁電子工業股份有限公司
LIGITEK ELECTRONICS CO., LTD.
Pb
LIGITEK LED
PART NO. : LG-150SRF/9UG-CT
LOT NO. : GSI-670107
Q'TY(PCS) : 3000 PCS
VF:1.6 - 2.4
VF:1.8 - 2.6
BIN/HUE : Q/29-N/9
Reel Dimensions
2.0±0.5
178±1.5
6.0±1.0
9.0±1.0
12.0±1.0
ψ13.5±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/11
PART NO. LG-150SRF/9UG-CT
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/9UG-CT
Page 9/11
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260℃
245±5℃within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
Cooling
+5℃/sec
-5℃/sec
Preheat
150
120
Time
60 ~ 120 sec
5sec
3-2 PB-Free Reflow Solder
1~5°C/sec
260°C MaX.
10sec.Max
Preheat
180~200°C
Above 220°C
60 sec.Max.
1~5°C/sec
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 11/11
PART NO. LG-150SRF/9UG-CT
Reliability Test:
Reference
Standard
Classification
Test Item
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
Operating Life Test
3.t=1000 hrs (-24hrs, +72hrs)
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Endurance
Test
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=1000hrs ±2hrs
MIL-STD-202F:103B
JIS C 7021: B-11
1.Ta=105℃±5℃&-40℃±5℃
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
(10min)
(10min)
Thermal Shock Test
Solderability Test
2.total 10 cycles
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
JIS C 7021: A-2
Environmental
Test
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
1.105℃~25℃ ~-55℃~25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
Temperature
Cycling
1.T=260°C Max. 10sec.Max.
2. 6 Min
MIL-STD-750D:2031.2
J-STD-020
IR Reflow
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