LH2640/S76-PF/TBS-2 [LIGITEK]
Visible LED;
| 型号： | LH2640/S76-PF/TBS-2 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | Visible LED |
| 文件： | 总7页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LH2640/S76-PF/TBS-X
DATA SHEET
DOC. NO : QW0905-LH2640/S76-PF/TBS-X
REV.
: A
DATE
:
23 - Jun. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH2640/S76-PF/TBS-X
Page 1/6
Package Dimensions
ΔH
P2
W2
H2
H1
L
W0
W1 W3
P1
F
P
D
T
LH2640/S76-PF
2.9
3.3
3.1
4.3
1.5
MAX
25.0MIN
1.0MIN
0.5
TYP
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH2640/S76-PF/TBS-X
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
H
IF
IFP
PD
Ir
15
60
Forward Current
mA
mA
mW
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
40
Reverse Current @5V
Operating Temperature
Storage Temperature
10
μA
℃
Topr
Tstg
-40 ~ +85
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Viewing
angle
2θ1/2
(deg)
Peak
wave
length
λPnm
Luminous
intensity
@10mA(mcd)
Spectral
halfwidth
△λnm
COLOR
PART NO
MATERIAL
GaP
Typ.
3
Lens
Red Diffused
Max.
Min.
1.7
Min.
Emitted
Red
LH2640/S76-PF-TBS-X
697
90
2.6 1.2
50
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
3/6
PART NO. LH2640/S76-PF/TBS-X
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
CODE
SYMBOL ITEMS
SYMBOL
Minimum
Maximum
inch
inch
mm
mm
Tape Feed Hole Diameter
Component Lead Pitch
Front-To-Rear Deflection
-------
-------
-------
D
F
3.8
2.3
0.15
0.09
-------
4.2
3.0
2.0
0.17
0.12
0.08
-------
△H
TBS-1
TBS-2
TBS-3
TBS-4
TBS-5
TBS-6
TBS-7
TBS-8
TBS-9
TBS-10
-------
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
-------
0.69
0.85
1.0
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
36
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
1.08
0.89
0.78
0.94
0.96
0.75
0.72
-------
Feed Hole To Bottom Of Component
H1
0.79
0.76
1.42
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
W0
11.0
13.0
5.8
0.43
0.51
0.23
0.3
Feed Hole Pitch
P
12.4
4.4
0.49
0.17
0.2
-------
-------
-------
-------
-------
Lead Location
P1
P2
T
Center Of Component Location
Overall Taped Package Thickness
5.1
7.7
-------
-------
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
8.5
14.5
0
0.33
0.57
0
-------
-------
-------
-------
17.5
0.69
19.0
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Symbol
Description
minimum
maxmum
W
L
mm
inch
13.0
10.4
1.97
mm
340
275
60
inch
Overall Length
L
W
H
330
265
50
13.4
10.8
2.4
H
Overall Width
Overall Thickness
Quantity/Box
2500PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
4/6
PART NO. LH2640/S76-PF/TBS-X
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
100
2.5
2.0
1.5
10
1.0
0.5
0.0
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.5
1.0
0.5
1.1
1.0
0.9
0.8
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80 100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
0°
1.0
-30°
30°
0.5
0.0
-60°
60°
600
700
800
900
1000
100% 75% 50% 25%
0
25% 50% 75%100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/6
PART NO. LH2640/S76-PF/TBS-X
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH2640/S76-PF/TBS-X
Page
6/6
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=85℃
2.RH=85%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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