LH3330-PF/TRF-1 [LIGITEK]
Visible LED;
| 型号： | LH3330-PF/TRF-1 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | Visible LED |
| 文件： | 总8页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
Pb
Lead-Free Parts
LH3330-PF/TRF-X
DATA SHEET
DOC. NO : QW0905-LH3330-PF/TRF-X
REV.
: A
DATE
: 09 - Nov. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH3330-PF/TRF-X
Page 1/7
Package Dimensions
P2
△H
H2
W2
H1
H
L
W0
W3
W1
P1
F
-
+
D
P
T
LH3330-PF
5.0 5.9
7.6
8.6
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LH3330-PF/TRF-X
Page
PART NO.
2/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
H
IF
IFP
PD
Ir
15
60
Forward Current
mA
mA
mW
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
40
Reverse Current @5V
Operating Temperature
Storage Temperature
10
μA
℃
Topr
Tstg
-40 ~ +85
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
Peak
Luminous
intensity
@10mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Spectral
voltage
@20mA(V)
wave
length
COLOR
halfwidth
Δλnm
MATERIAL
GaP
PART NO
λPnm
Emitted
Typ.
4.5
Lens
Min. Max. Min.
Red
Red Diffused
LH3330-PF/TRF-X
28
697
90
1.7
2.6
3.0
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH3330-PF/TRF-X
Page 3/7
•Dimensions Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
0.15
0.19
-------
mm
4.2
inch
Tape Feed Hole Diameter
Component Lead Pitch
-------
-------
-------
-------
3.8
4.8
0.17
0.23
0.08
0.65
0.77
0.83
0.96
1.04
0.89
0.83
0.83
0.89
1.1
D
F
5.8
-------
15.5
17.5
19.0
22.5
25.5
21.5
20.2
17.125
20.0
26.0
24.0
21.0
-------
△H
H
Front-To-Rear Deflection
Height Of Seating Plane
2.0
0.61
0.69
0.75
0.89
1.0
16.5
19.5
21.0
24.5
26.5
22.5
21.2
21.125
22.5
28.0
26.0
23.0
36
TRF-1
TRF-2
TRF-3
TRF-4
TRF-5
TRF-6
TRF-7
TRF-8
TRF-9
TRF-11
TRF-12
-------
0.85
0.8
Feed Hole To Bottom Of Component
H1
0.67
0.79
1.02
0.94
0.83
-------
1.02
0.91
1.42
0.43
0.51
0.18
0.3
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
W0
11.0
13.0
4.55
7.7
-------
Feed Hole Pitch
P
12.4
3.15
5.1
0.49
0.12
0.2
-------
Lead Location
P1
P2
T
Center Of Component Location
Overall Taped Package Thickness
-------
-------
-------
-------
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
-------
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
8.5
14.5
0
0.33
0.57
0
-------
-------
-------
17.5
0.69
19.0
REMARK:TRF=Tape And Reel Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
D3
MARKING
D2
D1
mm
inch
3.08
1.37
1.13
0.54
---
mm
inch
14.96
4.02
3.46
1.5
Reel Diameter
D
D1
D2
D3
T
78.2
34.9
28.6
13.8
---
380
102
Core Diameter
D
Hub Recess Inside Diameter
Arbor Hole Diameter
88.0
38.1
57.2
50.0
T2
T1
Overall Reel Thickness
2.25
1.97
Iside Reel Flange Thickness
30.0
1.18
T1
LH3330-PF/TRF-X
1000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH3330-PF/TRF-X
Page 4/7
•Dimensions Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
0.15
0.19
-------
mm
inch
0.17
0.23
0.08
0.65
0.79
0.93
0.93
Tape Feed Hole Diameter
Component Lead Pitch
-------
D
F
3.8
4.8
4.2
5.8
-------
-------
-------
△H
H
2.0
Front-To-Rear Deflection
Height Of Seating Plane
-------
15.5
19.0
0.61
0.75
16.5
20.0
23.7
23.5
TRF-13
TRF-14
TRF-15
TRF-16
TRF-17
TRF-18
TRF-19
TRF-20
TRF-21
TRF-22
21.7
22.5
17.5
18.5
20.5
0.85
0.89
0.69
0.71
0.77
0.85
18.0
19.5
21.5
0.73
0.81
Feed Hole To Bottom Of Component
H1
25.5
20.5
25.0
22.0
1.0
27.5
22.5
27.0
23.0
1.08
0.89
1.06
0.91
0.81
0.98
0.87
Feed Hole To Overall Component Height
Lead Length After Component Height
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
-------
H2
L
36
1.42
0.43
0.51
0.18
0.3
W0
11.0
13.0
4.55
7.7
Feed Hole Pitch
P
12.4
3.15
5.1
0.49
0.12
0.2
Lead Location
P1
P2
T
Center Of Component Location
Overall Taped Package Thickness
-------
8.5
-------
0.33
0.57
0
0.06
0.38
0.61
0.16
0.75
1.42
9.75
15.5
4.0
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
14.5
0
17.5
0.69
19.0
REMARK:TRF=Tape And Reel Forming Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
D3
MARKING
D2
D1
mm
inch
3.08
1.37
1.13
0.54
---
mm
inch
14.96
4.02
3.46
1.5
Reel Diameter
D
D1
D2
D3
T
78.2
34.9
28.6
13.8
---
380
102
Core Diameter
D
Hub Recess Inside Diameter
Arbor Hole Diameter
88.0
38.1
57.2
50.0
T2
T1
Overall Reel Thickness
2.25
1.97
Iside Reel Flange Thickness
T1
30.0
1.18
LH3330-PF/TRF-X
1000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LH3330-PF/TRF-X
Page5/7
PART NO.
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
100
2.5
2.0
1.5
1.0
0.5
0.0
10
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.1
1.0
1.5
1.0
0.5
0.9
0.8
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80 100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
700
800
900
1000
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH3330-PF/TRF-X
Page 6/7
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LH3330-PF/TRF-X
Page7/7
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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