LHY3333-PF/TBS-10 [LIGITEK]
Visible LED;
| 型号： | LHY3333-PF/TBS-10 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | Visible LED |
| 文件： | 总7页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LHY3333-PF/TBS-X
DATA SHEET
DOC. NO : QW0905-LHY3333-PF/TBS-X
REV.
: A
DATE
: 05 -Jun. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY3333-PF/TBS-X
Page 1/6
Package Dimensions
P2
ΔH
H2
H1
W2
L
W0
W1 W3
- +
D
P1
F
P
T
LHY3333-PF
5.0 5.9
7.6
8.6
1.5MAX
25.0MIN
0.5
TYP
1.0MIN
2.54TYP
+ -
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY3333-PF/TBS-X
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
HY
Symbol
Parameter
UNIT
30
IF
IFP
Forward Current
mA
mA
mW
μA
V
Peak Forward Current
Duty 1/10@10KHz
60
75
Power Dissipation
PD
Ir
Reverse Current @5V
Electrostatic Discharge(*)
Operating Temperature
Storage Temperature
10
ESD
Topr
Tstg
2000
-40 ~ +85
-40 ~ +100
℃
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Dominant
wave
length
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
COLOR
Lens
PART NO
MATERIAL
AlGaInP
λDnm
Typ.
Emitted
Min. Max. Min.
Yellow Water Clear
595
15
1.7
2.6 1100 2200
20
LHY3333-PF/TBS-X
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY3333-PF/TBS-X
Page 3/6
•Dimension Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
inch
inch
mm
mm
Tape Feed Hole Diameter
Component Lead Pitch
Front-To-Rear Deflection
-------
-------
-------
D
F
3.8
2.3
0.15
0.09
-------
4.2
3.0
0.17
0.12
0.08
0.73
0.89
1.04
0.93
0.82
0.98
1.0
-------
△H
2.0
17.5
21.5
25.5
22.5
19.9
24.0
24.5
19.0
18.4
21.0
20.5
18.0
-------
0.69
0.85
1.0
18.5
22.5
26.5
23.5
20.9
25.0
25.5
20.0
19.4
22.0
21.5
19.0
36
TBS-1
TBS-2
TBS-3
TBS-5
TBS-6
TBS-7
TBS-8
TBS-9
TBS-10
TBS-11
TBS-12
TBS-13
-------
0.89
0.78
0.94
0.96
0.75
0.72
0.83
0.81
0.71
-------
Feed Hole To Bottom Of Component
H1
0.79
0.76
0.87
0.85
0.75
1.42
0.43
0.51
0.23
0.3
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
W0
11
-------
Feed Hole Pitch
P
12.4
4.4
0.49
0.17
0.2
13
-------
Lead Location
P1
P2
T
5.8
Center Of Component Location
Overall Taped Package Thickness
-------
5.1
7.7
-------
-------
8.5
-------
0.33
0.57
0
0.06
0.38
0.61
0.16
0.75
1.42
9.75
15.5
4.0
-------
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
-------
14.5
0
-------
-------
17.5
0.69
19
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
minimum maxmum
Symbol
Description
mm
inch
13.0
10.4
mm
inch
13.4
10.8
Overall Length
Overall Width
330
265
50
340
275
60
L
W
H
Overall Thickness
Quantity/Box
1.97
2.4
2000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY3333-PF/TBS-X
Page4/6
Typical Electro-Optical Characteristics Curve
HY CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
100
10
3.0
2.5
2.0
1.5
1.0
1.0
0.1
0.5
0.0
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
1.1
1.0
0.9
0.8
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
1.0
0.5
0.0
0°
-30°
30°
-60°
60°
0
100% 75% 50% 25%
25% 50% 75%100%
550
600
650
500
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY3333-PF/TBS-X
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY3333-PF/TBS-X
Page 6/6
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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