LMD5711-2F9UG-XX-PF [LIGITEK]
DOT MATRIX DIGIT LED DISPLAY (1.2Inch); 点阵位LED显示（ 1.2Inch ）
| 型号： | LMD5711-2F9UG-XX-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | DOT MATRIX DIGIT LED DISPLAY (1.2Inch) |
| 文件： | 总9页 (文件大小：150K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DOT MATRIX DIGIT LED DISPLAY (1.2Inch)
Pb
Lead-Free Parts
LMD5711/2F9UG-XX-PF
DATA SHEET
DOC. NO : QW0905-LMD5711/2F9UG-XX-PF
REV.
: A
DATE
: 22 - Feb. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LMD5711/2F9UG-XX-PF
Package Dimensions
8.1
(0.32")
22.6(0.89")
31.7
(1.25")
4.57*6=27.42
(1.08")
22.86
(0.9")
0.2
4.57*4=
18.28(0.72")
ψ3.0(0.118")
LMD5711/2F9UG-XX-PF
LIGITEK
3.25±0.5
ψ0.51
TYP
2.0*8=16(0.63")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
2/8
Page
Internal Circuit Diagram
LMD5711F9UG-XX-PF
3
5
1
2
2
4
COLUMN
10
12
1
13
ROW PIN
1
16
2
3
15
17
4
5
14
8
6
7
5
6
LMD5712F9UG-XX-PF
1
2
3
4
5
COLUMN
10
2
12
1
13
ROW PIN
1
16
2
3
15
17
4
5
6
14
8
5
7
6
3,4,7,9,11,18PIN NC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
Page 3/8
Electrical Connection
PIN NO.
LMD5711F9UG-XX-PF
Cathode Column 1 (Green)
Cathode Column 2 (Green)
NO CONNECT
PIN NO.
LMD5712F9UG-XX-PF
Anode Column 1 (Green)
1
2
1
2
Anode Column 2 (Green)
NO CONNECT
3
3
NO CONNECT
NO CONNECT
4
4
Anode Row 6
Cathode Row 6
5
5
Cathode Row 7
NO CONNECT
Cathode Row 5
6
Anode Row 7
NO CONNECT
6
7
7
Anode Row 5
8
8
NO CONNECT
NO CONNECT
9
9
Anode Column 5 (Green)
NO CONNECT
Cathode Column 5 (Green)
NO CONNECT
10
11
12
13
14
15
16
17
18
10
11
12
13
14
15
16
17
18
Anode Column 4 (Green)
Cathode Column 4 (Green)
Cathode Column 3 (Green)
Anode Row 4
Anode Column 3 (Green)
Cathode Row 4
Anode Row 2
Anode Row 1
Anode Row 3
NO CONNECT
Cathode Row 2
Cathode Row 1
Cathode Row 3
NO CONNECT
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
4/8
Page
Absolute Maximum Ratings at Ta=25 ℃
Ratings
9UG
Symbol
Parameter
UNIT
IF
IFP
30
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
60
mW
μA
Power Dissipation
75
PD
Ir
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
10
2000
-25 ~ +85
-25 ~ +85
ESD
Topr
Tstg
V
℃
℃
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
△λ
(nm)
λD
(nm)
Vf(v)
Typ.
Iv(mcd)
Typ.
IV-M
2:1
PART NO
Material Emitted
Max.
Min.
Min.
1.7
Common
Cathode
AlGaInP
Green
20
20
2.1 2.6 8.5 15.25
574
574
LMD5711F9UG-XX-PF
LMD5712F9UG-XX-PF
Common
Anode
2.6 8.5 15.25
AlGaInP
Green
1.7
2.1
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Vf
Unit
volt
Test Condition
If=20mA
Parameter
Forward Voltage Per Chip
If=10mA
If=20mA
If=20mA
Luminous Intensity Per Chip
Dominant Wavelength
Iv
mcd
nm
λD
△λ
Spectral Line Half-Width
nm
μA
Reverse Current Any Chip
Ir
Vr=5V
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
Page6/8
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
2.5
2.0
100
1.5
1.0
10
1.0
0.5
0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.5
1.1
1.0
0.9
1.0
0.5
0
0.8
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 °C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
Page 8/8
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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