LPT3323/TBS-12-PF [LIGITEK]
Photo Transistor;
| 型号： | LPT3323/TBS-12-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | Photo Transistor |
| 文件： | 总6页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LPT3323/TBS-X-PF
DATA SHEET
DOC. NO : QW0905-LPT3323/TBS-X-PF
REV.
: D
DATE
: 19 - Sep.- 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LPT3323/TBS-X-PF
PART NO.
Page 1/5
Package Dimension
5.0
7.6
5.9
8.6
ΔH
P2
H2
H1
W2
W1
12.5MIN
1.0MIN
L
W0
1.EMITTER
2.COLLECTOR
W3
2.3TYP
1 2
- +
D
Features
P1
F
. High illumination sensitivity
. Stable characteristics
P
. Spectrally and mechanically
matched with IR emitter
Description
The LPT3323/TBS-X-PF series are silicon nitride passivated
NPN planar phototransistors with exceptionally table
characteristics and igh illumination sensitivity the cases of
LPT3323/TBS-X-PF are ncapsulated in water clear plastic T1
3/4 package individuallt
T
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted
2.Specifications are subject to change without notice
•MAXIMUM RATINGS(Ta=25℃)
PARAMETER
MAXIMUM RATINGS
UNIT
mw
V
Power Dissipation
100
30
5
Collector-Emitter Voltage
Emitter-Collector Voltage
Operating Temperature
Storage Temperature
V
-50℃ TO +100℃
-50℃ TO +100℃
•ELECTRICAL CHARACTERISTICS(Ta=25℃)
Typ.
TEST CONDITION
Ic=1mA
PARAMETER
SYMBOL
Min.
30
Max.
0.4
UNIT
V
Collector-Emitter
Breakdown Voltage
Emitter-Collector
Breakdown Voltage
Collector-Emitter
Saturation Voltage
Rise Time
V(BR)CEO
Ee=0mw/c㎡
IE=100μA
Ee=0mw/c㎡
Ic=0.5mA
Ee=20mw/c㎡
V(BR)ECO
5
V
VCE(sat)
V
μs
5
5
Tr
Tf
VCE=30V
IC=800μA, RL=1KΩ
μs
Fall Time
VCE=10V
Ee=0mw/c㎡
Collector Dark
Current
Wavelength of Peak
Sensitivity
Range of Spectral Bandwidth
ICEO
100
---
nA
λP
800
---
---
nm
---
2
λ0.5
400-1100
nm
mA
mA
mA
mA
Ip(on)
1
2
4
8
On State Collector
Current
VCE=5v
Ee=1mw/c㎡
λP=940nm
4
8
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT3323/TBS-X-PF
Page 2/5
•Dimension Symbol Information
SPECIFICATIONS
OPTION
CODE
SYMBOL ITEMS
SYMBOL
Minimum
Maximum
inch
inch
mm
3.8
mm
4.2
Tape Feed Hole Diameter
Component Lead Pitch
Front-To-Rear Deflection
------
------
D
F
0.15
0.09
-----
0.17
0.12
0.08
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
2.2
3.0
△H
------
-----
2.0
TBS-1
TBS-2
TBS-3
TBS-4
TBS-5
TBS-6
TBS-7
TBS-8
TBS-9
TBS-10
TBS-11
TBS-12
TBS-13
------
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
21.0
20.5
18.0
-----
0.69
0.85
1.0
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
22.0
21.5
19.0
36.0
11.0
13.0
2.8
1.08
0.89
0.78
0.94
0.96
0.75
0.72
0.83
0.81
0.71
-----
Feed Hole To Bottom Of Component
H1
0.79
0.76
0.87
0.85
0.75
1.42
0.43
0.51
0.23
0.3
Feed Hole To Overall Component Height
Lead LengthAfter Component Height
H2
L
------
W0
Feed Hole Pitch
0.49
0.17
0.2
------
P
12.4
4.4
Lead Location
------
P1
P2
T
Center Of Component Location
Overall Taped Package Thickness
5.1
------
7.7
------
-----
8.5
-----
0.33
0.57
0.0
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
Feed Hole Location
------
W0
W1
W2
W3
Adhesive Tape Width
------
14.5
0.0
Adhesive Tape Position
Tape Width
------
17.5
0.69
19.0
------
REMARK : TBS = Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
minimum maxmum
Description
Symbol
W
L
mm
inch
13.0
10.4
1.97
mm
inch
13.4
10.8
2.40
Overall Length
Overall Width
L
W
H
330
265
50.0
340
275
60.0
H
Overall Thickness
Quantity/Box
2000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/5
PART NO.LPT3323/TBS-X-PF
Typical Electro-Optical Characteristics Curve
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LPT3323/TBS-X-PF
PART NO.
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO.
LPT3323/TBS-X-PF
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=85℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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