LSBK2040 [LIGITEK]
ROUND TYPE LED LAMPS; ROUND型LED灯
| 型号： | LSBK2040 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | ROUND TYPE LED LAMPS |
| 文件： | 总5页 (文件大小：99K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
LSBK2040
DATA SHEET
DOC. NO : QW0905-LSBK2040
REV.
: A
DATE
: 03 - Mar- 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSBK2040
1/4
Package Dimensions
3.0
4.2
4.0
5.2
1.5MAX
25.0MIN
1.0MIN
□0.5
TYP
2.54TYP
-
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBK2040
Page 2/4
Absolute Maximum Ratings at Ta=25 ℃
Ratings
SBK
Symbol
Parameter
UNIT
IF
IFP
30
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
100
mW
μA
Power Dissipation
PD
Ir
120
Reverse Current @5V
Electrostatic Discharge
Operating Temperature
Storage Temperature
50
ESD
Topr
Tstg
500
V
-20 ~ +80
-30 ~ +100
℃
℃
Max 260℃for 5 sec Max
Soldering Temperature
Tsol
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Peak
wave
length
λPnm
Viewing
angle
2θ1/2
(deg)
Luminous
intensity
@20mA(mcd)
Dominant
wave
Spectral
halfwidth
△λnm
COLOR
length
PART NO MATERIAL
λDnm
Typ.
Max.
Min.
Typ.
Emitted
Lens
Blue Diffused
LSBK2040 InGaN/SiC Blue
468
26
3.5
4.2 160 450
44
470
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LLSBK2040
Page 3/4
Typical Electro-Optical Characteristics Curve
SBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
30
25
20
15
10
5
1.5
1.25
1.0
0.75
0.5
0.25
0
0
1
2
3
4
5
5
0
10
15
20
25
30
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Temperature
40
1.0
30
20
10
0
0.5
0
0
25
50
75
100
380 430
480 530 580 630 680
Wavelength (nm)
Ambient Temperature(℃)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSBK2040
4/4
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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