LSD3356-XX [LIGITEK]

LED Display;
LSD3356-XX
型号: LSD3356-XX
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

LED Display

文件: 总8页 (文件大小:87K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
SINGLE DIGIT LED DISPLAY (0.32 Inch)  
LSD335/66-XX  
DATA SHEET  
DOC. NO : QW0905-LSD335/66-XX  
REV.  
: A  
DATE  
: 03 - Feb- 2005  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
1/7  
PART NO. LSD335/66-XX  
Page  
Package Dimensions  
PIN NO.1  
7.5  
6.5  
(0.295")  
(0.256")  
2.54X4  
=10.16  
(0.4")  
8.0  
(0.32")  
13.0  
(0.512")  
LSD335/66-XX  
LIGITEK  
ψ1.0(0.039")  
6.9±0.5  
0.45  
TYP.  
5.08  
(0.2")  
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted.  
2.Specifications are subject to change without notice.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 2/7  
PART NO. LSD335/66-XX  
Internal Circuit Diagram  
LSD3356-XX  
1,6  
DP  
A B C D E F G  
10 9 8 5 4  
3 7  
2
LSD3366-XX  
1,6  
DP  
A B C D E F G  
10 9 8 5 4  
3 7  
2
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 3/7  
PART NO. LSD335/66-XX  
Electrical Connection  
PIN NO.  
1
LSD3356-XX  
PIN NO.  
1
LSD3366-XX  
Common Anode  
Common Cathode  
Anode F  
Cathode F  
Cathode G  
Cathode E  
Cathode D  
2
3
2
3
Anode G  
Anode E  
4
4
Anode D  
5
5
Common Cathode  
Anode DP  
Anode C  
Common Anode  
Cathode DP  
6
6
7
7
Cathode C  
Cathode B  
Cathode A  
8
8
Anode B  
9
9
Anode A  
10  
10  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSD335/66-XX  
Page 4/7  
Absolute Maximum Ratings at Ta=25  
Ratings  
HR  
Symbol  
Parameter  
UNIT  
Forward Current Per Chip  
IF  
30  
mA  
mA  
Peak Forward Current Per  
Chip (Duty 1/10,0.1ms  
Pulse Width)  
IFP  
100  
Power Dissipation Per Chip  
mW  
100  
10  
PD  
μA  
Reverse Current Per Any Chip  
Operating Temperature  
Ir  
Topr  
Tstg  
-25 ~ +85  
-25 ~ +85  
Storage Temperature  
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃  
Part Selection And Application Information(Ratings at 25)  
Electrical  
common  
cathode  
or anode  
CHIP  
λP △λ  
Vf(v)  
Typ.  
Iv(mcd)  
Typ.  
Max. Min.  
IV-M  
2:1  
PART NO  
(nm)  
(nm)  
Material Emitted  
Min.  
Common  
Cathode  
LSD3356-XX  
LSD3366-XX  
Red  
660  
20  
1.5 1.7  
2.4 7.2 10.5  
GaAlAs  
Common  
Anode  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSD335/66-XX  
Page 5/7  
Test Condition For Each Parameter  
Symbol  
Vf  
Unit  
volt  
Test Condition  
If=20mA  
If=10mA  
If=20mA  
If=20mA  
Vr=5V  
Parameter  
Forward Voltage Per Chip  
Luminous Intensity Per Chip  
Peak Wavelength  
Iv  
mcd  
nm  
λP  
△λ  
Ir  
Spectral Line Half-Width  
Reverse Current Any Chip  
Luminous Intensity Matching Ratio  
nm  
μA  
IV-M  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page3/4  
PART NO. LSD335/66-XX  
Typical Electro-Optical Characteristics Curve  
HR CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
3.0  
1000  
2.5  
2.0  
1.5  
100  
10  
1.0  
0.5  
1.0  
0.1  
0
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
3.0  
1.2  
2.5  
2.0  
1.5  
1.0  
0.5  
1.1  
1.0  
0.9  
0.8  
0
-40  
-20  
-0  
20  
40  
60  
80  
100  
-40  
-20  
-0  
20  
40  
60  
80  
100  
Ambient Temperature()  
Ambient Temperature()  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0
600  
650  
700  
750  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LSD335/66-XX  
Page 7/7  
Reliability Test:  
Reference  
Standard  
Description  
Test Item  
Test Condition  
1.Under Room Temperature  
2.If=10mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resisance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under ondition  
of hogh temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hous.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105±5&-40±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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