LSD3556F-XX-PF [LIGITEK]
LED Display;型号: | LSD3556F-XX-PF |
厂家: | LIGITEK ELECTRONICS CO., LTD. |
描述: | LED Display |
文件: | 总9页 (文件大小:156K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (0.39Inch)
Pb
Lead-Free Parts
LSD355/66F-XX-PF
DATA SHEET
DOC. NO : QW0905-
LSD355/66F-XX-PF
REV.
: A
DATE
:
05 - Jun.-2009
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LSD355/66F-XX-PF
Package Dimensions
9.85
7.0
PIN NO.1
(0.388")
(0.276")
2.54X4=
10.16
(0.4")
10.0
(0.394)
12.9
(0.508")
LSD355/66F-XX-PF
LIGITEK
ψ1.2(0.047")
5.0±0.5
Ø 0.45
TYP
7.62
(0.3")
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/66F-XX-PF
Page 2/8
Internal Circuit Diagram
LSD3556F-XX-PF
3,8
DP
A B C D E F G
7 5 4
9
2 1 6
10
LSD3566F-XX-PF
3,8
DP
A B C D E F G
9 7 5 4 2 1 6
10
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LSD355/66F-XX-PF
Electrical Connection
PIN NO.
PIN NO.
LSD3556F-XX-PF
LSD3566F-XX-PF
Cathode G
1
2
1
Anode G
Anode F
Cathode F
2
3
Common Cathode
Anode E
Common Anode
Cathode E
3
4
4
Anode D
Cathode D
Cathode DP
Cathode C
Common Anode
Cathode B
5
5
Anode DP
Anode C
6
6
7
7
Common Cathode
Anode B
8
8
9
9
Anode A
Cathode A
10
10
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/8
PART NO. LSD355/66F-XX-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
HRF
30
Symbol
Parameter
UNIT
Forward Current Per Chip
IF
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
90
IFP
Power Dissipation Per Chip
mW
PD
75
10
μA
Reverse Current Per Any Chip
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
Ir
2000
ESD
Topr
Tstg
V
-25 ~ +85
-25 ~ +85
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
*
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λD
(nm)
△λ
(nm)
Vf(v)
Typ.
Iv(mcd)
IV-M
2:1
PART NO
Typ.
Max. Min.
Material Emitted
Min.
Common
Cathode
LSD3556F-XX-PF
LSD3566F-XX-PF
AlGaInP
Red
630
20
1.5 1.7
2.4
8.5 12.8
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/66F-XX-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Vf
Iv
Luminous Intensity Per Chip
Dominant Wavelength
mcd
nm
λD
△λ
Ir
Spectral Line Half-Width
nm
Reverse Current Any Chip
Luminous Intensity Matching Ratio
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page6/8
PART NO. LSD355/66F-XX-PF
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.5
3.0
2.5
2.0
100
10
1.0
0.1
1.5
1.0
0.5
0
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
1.2
1.1
1.0
2.0
1.5
1.0
0.5
0.9
0.8
0
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD355/66F-XX-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 °C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LSD355/66F-XX-PF
PART NO.
Page 8/8
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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