概述
数据手册LSD505/64-XX 概述
SINGLE DIGIT LED DISPLAY (0.50 Inch) 单位LED显示（ 0.50英寸）
LSD505/64-XX 数据手册
通过下载LSD505/64-XX数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (0.50 Inch)
LSD505/64-XX
DATA SHEET
DOC. NO : QW0905-LSD505/64-XX
REV.
: A
DATE
: 24 - Jan - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
1/7
PART NO. LSD505/64-XX
Page
Package Dimensions
12.7
(0.50")
8.0
(0.315")
12.7
(0.50")
19.0
(0.748")
15.24
(0.60")
ψ1.5(0.059")
LSD505/64-XX
LIGITEK
0.51
TYP
4.9±0.5
2.45X4=9.8
(0.386")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
2/7
PART NO. LSD505/64-XX
Page
Internal Circuit Diagram
LSD5054-XX
3,8
DP
A B C D E F G
7 6 4
9 10 5
2 1
LSD5064-XX
3,8
DP
A B C D E F G
7 6 4
9 10 5
2 1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/64-XX
Page 3/7
Electrical Connection
PIN NO.
1
LSD5054-XX
PIN NO.
1
LSD5064-XX
Anode E
Anode D
Cathode E
Cathode D
2
3
2
3
Common Cathode
Anode C
Common Anode
Cathode C
4
4
Cathode DP
Cathode B
Cathode A
Anode DP
Anode B
5
5
6
6
Anode A
7
7
Common Anode
Cathode F
Common Cathode
Anode F
8
8
9
9
Cathode G
Anode G
10
10
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/64-XX
Page 4/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
E
Forward Current Per Chip
IF
30
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
120
Power Dissipation Per Chip
mW
100
10
PD
μA
Reverse Current Per Any Chip
Operating Temperature
Ir
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
℃
Storage Temperature
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
Material
λP △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
(nm)
(nm)
Emitted
Orange
Min.
1.7
Common
Cathode
LSD5054-XX
LSD5064-XX
GaAsP/GaP
635
45
2.0 2.6 1.75 3.2
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/7
PART NO. LSD505/64-XX
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
Vf
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Luminous Intensity Per Chip
Peak Emission Wavelength
Spectral Line Half-Width
Iv
mcd
nm
λP
△λ
Ir
nm
Reverse Current Any Chip
Luminous Intensity Matching Ratio
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.
Page6/7
LSD505/64-XX
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
100
10
3.0
2.5
2.0
1.5
1.0
1.0
0.1
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
1.1
1.0
0.9
0.8
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/64-XX
Page 7/7
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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