LSD505-62-XX-RP63 [LIGITEK]
SINGLE DIGIT LED DISPLAY (0.50 Inch); 单位LED显示（ 0.50英寸）
| 型号： | LSD505-62-XX-RP63 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | SINGLE DIGIT LED DISPLAY (0.50 Inch) |
| 文件： | 总8页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (0.50 Inch)
LSD505/62-XX/RP63
DATA SHEET
DOC. NO : QW0905-LSD505/62-XX/RP63
REV.
: A
DATE
: 24 - Jan - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/62-XX/RP63
Page 1/7
Package Dimensions
12.7
8.0
(0.50")
(0.315")
12.7
19.0
15.24
(0.50")
(0.748")
(0.60")
ψ1.5(0.059")
LSD505/62-XX/RP63
LIGITEK
0.51
TYP
6.3±0.5
2.45X4=9.8
(0.386")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/62-XX/RP63
Page 2/7
Internal Circuit Diagram
LSD5052-XX/RP63
3,8
DP
A B C D E F G
7 6 4 2 1 9 10 5
LSD5062-XX/RP63
3,8
DP
A B C D E F G
7 6 4 2 1 9 10 5
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/7
PART NO. LSD505/62-XX/RP63
Electrical Connection
PIN NO.
1
LSD5052-XX/RP63
PIN NO.
1
LSD5062-XX/RP63
Anode E
Anode D
Cathode E
Cathode D
2
3
2
3
Common Cathode
Anode C
Common Anode
Cathode C
4
4
Cathode DP
Cathode B
Cathode A
Anode DP
Anode B
5
5
6
6
Anode A
7
7
Common Cathode
Anode F
Common Anode
Cathode F
8
8
9
9
Cathode G
Anode G
10
10
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/62-XX/RP63
Page 4/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
G
Forward Current Per Chip
IF
30
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
120
Power Dissipation Per Chip
mW
PD
100
10
μA
Reverse Current Per Any Chip
Operating Temperature
Ir
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
℃
Storage Temperature
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λP △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
(nm)
(nm)
Material Emitted
Min.
1.7
Common
Cathode
LSD5052-XX/RP63
LSD5062-XX/RP63
565
30
2.1 2.6 1.75 2.6
GaP
Green
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD505/62-XX/RP63
Page 5/7
Test Condition For Each Parameter
Symbol
Vf
Unit
volt
Test Condition
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Parameter
Forward Voltage Per Chip
Luminous Intensity Per Chip
Peak Wavelength
Iv
mcd
nm
λP
△λ
Ir
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
nm
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LSD505/62-XX/RP63
Page 6/7
PART NO.
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
3.0
2.5
2.0
1.5
1.0
1000
100
10
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
3.0
1.2
2.5
2.0
1.5
1.0
0.5
1.1
1.0
0.9
0.8
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/7
PART NO. LSD505/62-XX/RP63
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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