LSEFDGL9553-TR1 [LIGITEK]
SURFACE MOUNT LED TAPE AND REEL; 表面安装型LED卷带
| 型号： | LSEFDGL9553-TR1 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT LED TAPE AND REEL |
| 文件： | 总9页 (文件大小：159K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LSEFDGL9553/TR1
DATA SHEET
SEFDGL9553/TR1
DOC. NO : QW0905-L
REV
: B
DATE
:
11 - Jan. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LSEFDGL9553/TR1
Package Dimensions
3.5
3.2
1.85
3.0
0.7±0.05
0.7±0.05
0.7±0.05
4
1
3
2.8
2.2
0.7±0.05
2
0.6
SEF
DGL
1.85
-
+
3
2
4
0.95
+
-
1
1.3
0.8
0.8
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Carrier Type Dimensions
2.0
0.23
4.0
1.55
1.75
5.5
12.0±0.3
4.06
9.3
Polarity
4.0
3.12
2.24
Note : The tolerances unless mentioned is ±0.2mm,Angle ±0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO.
LSEFDGL9553/TR1
Reel Dimensions
16.0±1.0
ψ178±2.0
14.2±1.0
74.0±1.5
Description
12.0mm tape,7"reel
Quantity/Reel
1500 devices
Part No.
LSEFDGL9553/TR1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
3/8
PART NO. :LSEFDGL9553/TR1
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SEF
50
DGL
30
IF
IFP
PD
Ir
Forward Current
mA
mA
mW
Peak Forward Current
Duty 1/10@10KHz
90
100
120
50
Power Dissipation
120
10
Reverse Current @5V
μA
Electrostatic Discharge
Operating Temperature
ESD
2000
150
V
Topr
-20 ~ +80
℃
Tstg
Storage Temperature
-30 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
Luminous
intensity
Dominant
wave
length
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
COLOR
@ mA(V) @20mA(mcd)
20
PART NO
MATERIAL
λDnm
Typ.
Emitted
Lens
Typ. Max. Min.
Min.
1.7
605
505
200 500
125 280
120
120
17
32
Orange
Green
AlGaInP
--- 2.6
Water Clear
LSEFDGL9553/TR1
InGaN/GaN
3.5 4.0
---
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.
LSEFDGL9553/TR1
Page4/8
Typical Electro-Optical Characteristics Curve
SEF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
100
2.5
2.0
1.5
1.0
10
1.0
0.5
0.0
0.1
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.1
1.0
1.5
1.0
0.5
0.9
0.8
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80 100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
1.0
0°
-30°
30°
0.5
0.0
-60°
60°
0
100% 75% 50% 25%
25% 50% 75%100%
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/8
PART NO.
LSEFDGL9553/TR1
Typical Electro-Optical Characteristics Curve
DGL CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
2.0
1000
100
10
1.5
1.0
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
1.1
1.0
2.0
1.5
1.0
0.9
0.8
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
1.0
0.5
0.0
0°
-30°
30°
-60°
60°
100% 75% 50% 25%
0
25% 50% 75%100%
500
Wavelength (nm)
600
450
550
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/8
PART NO.
LSEFDGL9553/TR1
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
(℃)
240
Rising
Cooling
+5℃/sec
-5℃/sec
Preheat
150
120
Time
60 ~ 120 sec
5sec
3-2 PB-Free Reflow Solder
1~5°C/sec
260°C MaX.
10sec.Max
Preheat
180~200° C
Above 220° C
60 sec.Max.
1~5°C/sec
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/8
PART NO.LSEFDGL9553/TR1
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5℃ ~ 35℃,RH<60%,
they should be treated at 60℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LSEFDGL9553/TR1
Reliability Test:
Page 8/8
Reference
Standard
Classification
Test Item
Test Condition
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
Operating Life Test
3.t=1000 hrs (-24hrs, +72hrs)
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Endurance
Test
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=1000hrs ±2hrs
MIL-STD-202F:103B
JIS C 7021: B-11
1.Ta=105 ℃±5℃&-40℃±5℃
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
(10min)
(10min)
Thermal Shock Test
Solderability Test
2.total 10 cycles
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧95% of the dipped surface
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
1.105℃ ~ 25℃ ~ -55℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
Temperature
Cycling
Environmental
Test
Ramp-up rate(183 ℃ to Peak) +3 ℃ second max
Temp. maintain at 125( ±25)℃ 120 seconds max
Temp. maintain above 183 ℃ 60-150 seconds
Peak temperature range 235 ℃+5/-0℃
Time within 5 ℃ of actual Peak Temperature(tp)
10-30 seconds
MIL-STD-750D:2031.2
J-STD-020
IR Reflow
Ramp-down rate +6 ℃/second max
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