LSI11240 [LIGITEK]
TOWER TYPE LED LAMPS; 塔型LED灯
| 型号： | LSI11240 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | TOWER TYPE LED LAMPS |
| 文件： | 总5页 (文件大小：70K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TOWER TYPE LED LAMPS
LSI11240
DATA SHEET
DOC. NO : QW0905-LSI11240
REV.
: A
DATE
: 01 - Mar - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSI11240
1/4
Package Dimensions
2.4
R1.7
3.3
1.8
3.0
1.6
1.5MAX
25.0MIN
1.0MIN
□0.5
TYP
2.54TYP
-
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
2/4
PART NO. LSI11240
Absolute Maximum Ratings at Ta=25 ℃
Ratings
UNIT
SI
Symbol
Parameter
IF
IFP
20
Forward Current
mA
Peak Forward Current
Duty 1/10@10KHz
80
mA
80
mW
μA
℃
Power Dissipation
PD
Ir
Reverse Current @5V
10
Topr
Tstg
Operating Temperature
Storage Temperature
Soldering Temperature
-40 ~ +85
-40 ~ +100
℃
Max 260℃for 5 sec Max
Tsol
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V) @10mA(mcd)
Luminous
intensity
Peak
wave
length
λPnm
Viewing
Spectral
halfwidth
△λnm
angle
2θ1/2
(deg)
COLOR
PART NO
MATERIAL
GaAsP/GaP
Typ.
7.5
Emitted
Orange
Lens
Red Diffused
Max.
2.6
Min.
1.7
Min.
4.5
610
45
50
LSI11240
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
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PART NO. LSI11240
3/4
Typical Electro-Optical Characteristics Curve
SI CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
100
10
3.0
2.5
2.0
1.5
1.0
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.5
1.0
0.5
0.0
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSI11240
4/4
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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