LTD315-66-XX-RP12-PF [LIGITEK]
TRIPLE DIGIT LED DISPLAY; 三位数的LED显示屏
| 型号： | LTD315-66-XX-RP12-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | TRIPLE DIGIT LED DISPLAY |
| 文件： | 总9页 (文件大小：143K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TRIPLE DIGIT LED DISPLAY (0.36 Inch)
Pb
Lead-Free Parts
LTD315/66-XX/RP12-PF
DATA SHEET
DOC. NO : QW0905-LTD315/66-XX/RP12-PF
REV.
: A
DATE
: 19 - Mar.- 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LTD315/66-XX/RP12-PF
Package Dimensions
22.5
7.25
(0.886")
(0.283")
DIG.1
DIG.2
DIG.3
9.14
(0.36")
14.0
(0.551")
10.16
(0.4")
ψ1.0
LTD315/66-XX/RP12-PF
LIGITEK
A
F
B
G
E
C
DP
D
Ø 0.51
12.0±0.5
TYP
2.54X5=
12.7(0.5")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LTD315/66-XX/RP12-PF
Internal Circuit Diagram
LTD3156-XX/RP12-PF
9
8
12
DIG.1
DIG.2
DIG.3
A B C D E F GDP A B C D E F GDP A B C D E F GDP
4
3
10 5
11 7 2 1
LTD3166-XX/RP12-PF
12
DIG.1
9
8
DIG.2
DIG.3
A B C D E F GDP A B C D E F GDP A B C D E F GDP
4
3
10 5
7
11
2 1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LTD315/66-XX/RP12-PF
Electrical Connection
PIN NO.
1
LTD3156-XX/RP12-PF
PIN NO.
1
LTD3166-XX/RP12-PF
Cathode E
Anode E
Anode D
Cathode D
2
3
2
3
Anode DP
Cathode DP
C
G
C
G
Anode
Anode
Cathode
Cathode
4
4
5
5
6
No Connect
6
No Connect
Anode B
B
Cathode
7
7
Common Cathode Dig.3
Common Cathode Dig.2
Anode F
Common Anode Dig.3
Common Anode Dig.2
Cathode F
8
8
9
9
10
11
12
10
11
12
Anode A
Cathode A
Common Cathode Dig.1
Common Anode Dig.1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD315/66-XX/RP12-PF
4/8
Page
Absolute Maximum Ratings at Ta=25 ℃
Ratings
HR
Symbol
Parameter
UNIT
Forward Current Per Chip
IF
30
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
100
IFP
Power Dissipation Per Chip
mW
PD
100
10
μA
Reverse Current Per Any Chip
Operating Temperature
Ir
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
℃
Storage Temperature
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
Emitted
λP
(nm)
△λ
(nm)
Vf(v)
Typ.
Iv(mcd)
Typ.
Min.
IV-M
PART NO
Max.
Min.
1.5
Material
Common
Cathode
LTD3156-XX/RP12-PF
LTD3166-XX/RP12-PF
660
20
1.8
2.4 3.05 5.0
2:1
GaAlAs Red
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD315/66-XX/RP12-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
Vf
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Luminous Intensity Per Chip
Peak Wavelength
Iv
mcd
nm
λP
△λ
Ir
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
nm
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD315/66-XX/RP12-PF
Page6/8
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
2.5
2.0
1.5
100
10
1.0
0.5
1.0
0.1
0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
2.0
1.2
1.1
1.0
1.5
1.0
0.5
0.9
0.8
0
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD315/66-XX/RP12-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
8/8
PART NO. LTD315/66-XX/RP12-PF
Page
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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