LTD521-22-XX-PF [LIGITEK]
LTD521-22-XX-PF;
| 型号： | LTD521-22-XX-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | LTD521-22-XX-PF |
| 文件： | 总10页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TRIPLE DIGIT LED DISPLAY (0.56 Inch)
Pb
Lead-Free Parts
LTD521/22-XX-PF
DATA SHEET
DOC. NO : QW0905-LTD521/22-XX-PF
REV.
: A
23 - Apr.
- 2006
DATE
:
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/22-XX-PF
Page 1/9
Package Dimensions
37.6
8.1
(1.481")
(0.319")
DIG.1
DIG.2
DIG.3
19.0
(0.748")
14.2
(0.56")
15.28
(0.602")
ψ1.7(0.067")
A
LTD521/22-XX-PF
LIGITEK
F
B
G
E
C
DP
D
4.1±0.5
Ø0.51
TYP
2.54X13=33.02(1.3")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/22-XX-PF
Page 2/9
Internal Circuit Diagram
LTD5212-XX-PF
LTD5222-XX-PF
25
24
4
2
1
27
28
5
25
24
4
2
1
27
28
5
A DIG.1
A DIG.1
B
C
D
B
C
D
3,26
3,26
E
F
G
DP
E
F
G
DP
21
20
8
7
6
23
22
9
21
20
8
7
6
23
22
9
A DIG.2
A DIG.2
B
C
D
B
C
D
19
19
E
F
G
DP
E
F
G
DP
16
15
13
11
10
17
12
14
16
15
13
11
10
17
12
14
DIG.3
DIG.3
A
B
C
D
E
F
G
DP
A
B
C
D
E
F
G
DP
18
18
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
3/9
Page
PART NO. LTD521/22-XX-PF
Electrical Connection
PIN NO.
1
LTD5212-XX-PF
PIN NO.
15
LTD5212-XX-PF
Anode Dig.3 B
Anode Dig.1 E
Anode Dig.1 D
Anode Dig.3 A
16
17
18
19
20
21
22
23
24
25
26
27
28
2
3
Anode Dig.3 F
Common Cathode Dig.1
Anode Dig.1 C
Common Cathode Dig.3
4
Anode Dig.1 DP
Anode Dig.2 E
Anode Dig.2 D
Common Cathode Dig.2
5
Anode Dig.2 B
Anode Dig.2 A
6
7
Anode Dig.2 C
Anode Dig.2 DP
Anode Dig.2 G
Anode Dig.2 F
Anode Dig.1 B
8
9
Anode Dig.3 E
10
11
12
13
14
Anode Dig.3 D
Anode Dig.3 G
Anode Dig.1 A
Common Cathode Dig.1
Anode Dig.1 F
Anode Dig.3 C
Anode Dig.3 DP
Anode Dig.1 G
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/9
PART NO. LTD521/22-XX-PF
Electrical Connection
PIN NO.
1
LTD5222-XX-PF
PIN NO.
15
LTD5222-XX-PF
Cathode Dig.1 E
Cathode Dig.1 D
Cathode Dig.3 B
Cathode Dig.3 A
2
3
16
17
18
19
20
21
22
23
24
25
26
27
28
Common Anode Dig.1
Cathode Dig.1 C
Cathode Dig.1 DP
Cathode Dig.2 E
Cathode Dig.2 D
Cathode Dig.3 F
Common Anode Dig.3
4
Common Anode Dig.2
Cathode Dig.2 B
Cathode Dig.2 A
Cathode Dig.2 G
Cathode Dig.2 F
5
6
7
Cathode Dig.2 C
Cathode Dig.2 DP
Cathode Dig.3 E
Cathode Dig.3 D
8
9
Cathode Dig.1 B
Cathode Dig.1 A
Common Anode Dig.1
10
11
12
13
14
Cathode Dig.3 G
Cathode Dig.3 C
Cathode Dig.3 DP
Cathode Dig.1 F
Cathode Dig.1 G
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/22-XX-PF
5/9
Page
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
G
Forward Current Per Chip
30
IF
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
120
100
IFP
Power Dissipation Per Chip
mW
PD
Reverse Current Per Any Chip
Operating Temperature
Storage Temperature
Ir
10
μA
℃
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λP △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
PART NO
(nm)
(nm)
Material Emitted
Min.
1.7
Common
Cathode
LTD5212-XX-PF
LTD5222-XX-PF
GaP
Green
Green
565
565
30
30
2.1 2.6 1.75 3.05
2:1
2:1
Common
Anode
GaP
2.6 1.75 3.05
1.7
2.1
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/9
PART NO. LTD521/22-XX-PF
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
Vf
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Luminous Intensity Per Chip
Peak Wavelength
Iv
λp
△λ
Ir
mcd
nm
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
nm
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/9
PART NO. LTD521/22-XX-PF
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
3.0
2.5
2.0
1.5
1000
100
10
1.0
0.5
0.0
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.5
1.0
0.5
1.1
1.0
0.9
0.8
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD521/22-XX-PF
Page 8/9
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 9/9
PART NO. LTD521/22-XX-PF
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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