LTD5962-XX [LIGITEK]

LED Display;
LTD5962-XX
型号: LTD5962-XX
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

LED Display

文件: 总8页 (文件大小:157K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
TRIPLE DIGIT LED DISPLAY (0.56 Inch)  
LTD595/62-XX  
DATA SHEET  
DOC. NO : QW0905-LTD595/62-XX  
REV.  
: A  
DATE  
: 22 - Nov.- 2005  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LTD595/62-XX  
Page 1/7  
Package Dimensions  
8.0  
37.6(1.48˝)  
(0.315˝)  
15.24  
(0.6˝)  
14.2  
(0.56˝  
19.0  
(0.75˝)  
LTD595/62-XX  
LIGITEK  
ψ1.6  
A
F
B
G
E
C
D
DP  
Ø0.5TYP  
4.5±0.5  
2.54X5=12.7  
(0.5˝)  
PIN NO.1  
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO.LTD595/62-XX  
Page 2/7  
Internal Circuit Diagram  
LTD5952-XX  
LTD5962-XX  
NC: 6PIN  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 3/7  
PART NO.  
LTD595/62-XX  
Electrical Connection  
PIN NO.1  
1
LTD5952-XX  
PIN NO.1  
1
LTD5962-XX  
Cathode E  
Anode E  
Anode D  
Anode DP  
Anode C  
Anode G  
2
3
2
3
Cathode D  
Cathode DP  
Cathode C  
Cathode G  
4
4
5
5
6
NC  
6
NC  
Anode B  
Cathode B  
7
7
Common Cathode Dig.3  
Common Cathode Dig2  
Anode F  
Common Anode Dig.3  
Common Anode Dig.2  
Cathode F  
8
8
9
9
10  
11  
12  
10  
11  
12  
Anode A  
Cathode A  
Common Cathode Dig.1  
Common Anode Dig.1  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO.  
Page 4/7  
LTD595/62-XX  
Absolute Maximum Ratings at Ta=25  
Ratings  
Symbol  
Parameter  
UNIT  
G
Forward Current Per Chip  
30  
IF  
mA  
mA  
Peak Forward Current Per  
Chip (Duty 1/10,0.1ms  
Pulse Width)  
120  
100  
IFP  
Power Dissipation Per Chip  
mW  
PD  
Reverse Current Per Any Chip  
Operating Temperature  
Storage Temperature  
10  
μA  
Ir  
Topr  
Tstg  
-25 ~ +85  
-25 ~ +85  
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃  
Part Selection And Application Information(Ratings at 25)  
Electrical  
common  
cathode  
or anode  
CHIP  
λP △λ  
Vf(v)  
Typ.  
Iv(mcd)  
Typ.  
Max. Min.  
IV-M  
PART NO  
(nm)  
(nm)  
Material Emitted  
Min.  
1.7  
Common  
Cathode  
LTD5952-XX  
LTD5962-XX  
GaP  
Green  
Green  
565  
565  
30  
30  
2.1 2.6 4.0 7.2  
2:1  
2:1  
Common  
Anode  
GaP  
2.6 4.0  
1.7  
2.1  
7.2  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO.  
LTD595/62-XX  
Page 5/7  
Test Condition For Each Parameter  
Symbol  
Vf  
Unit  
volt  
Test Condition  
If=20mA  
If=10mA  
If=20mA  
If=20mA  
Vr=5V  
Parameter  
Forward Voltage Per Chip  
Luminous Intensity Per Chip  
Peak Wavelength  
Iv  
mcd  
nm  
λp  
Spectral Line Half-Width  
Reverse Current Any Chip  
Luminous Intensity Matching Ratio  
△λ  
Ir  
nm  
μA  
IV-M  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
6/7  
PART NO.  
Page  
LTD595/62-XX  
Typical Electro-Optical Characteristics Curve  
G CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
3.5  
3.0  
2.5  
2.0  
1.5  
1000  
100  
10  
1.0  
0.5  
1.0  
0.0  
0.1  
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
3.0  
1.2  
2.5  
2.0  
1.1  
1.0  
1.5  
1.0  
0.5  
0.9  
0.8  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Ambient Temperature()  
Ambient Temperature()  
Fig.5 Relative Intensity vs. Wavelength  
Fig.6 Directive Radiation  
1.0  
0.5  
0.0  
500  
550  
600  
650  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO.  
Page 7/7  
LTD595/62-XX  
Reliability Test:  
Reference  
Standard  
Description  
Test Item  
Test Condition  
1.Under Room Temperature  
2.If=10mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resisance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under ondition  
of high temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105 ℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40℃±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65℃±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hous.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105 ℃±5&-40℃±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ℃±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ℃±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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