LUR2043/TBS-1 [LIGITEK]
Visible LED;
| 型号： | LUR2043/TBS-1 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | Visible LED |
| 文件： | 总6页 (文件大小：79K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX ROUND TYPE LED LAMPS
LUR2043/TBS-X
DATA SHEET
DOC. NO : QW0905-LUR2043/TBS-X
REV.
: A
DATE
: 23 - Mar. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 1/5
Package Dimensions
ΔH
P2
W2
H2
H1
L
W0
W1 W3
P1
F
P
D
T
LUR2043
3.0
4.2
4.0
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
UR
Symbol
Parameter
UNIT
40
IF
IFP
PD
Ir
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
120
mW
μA
Power Dissipation
120
Reverse Current @5V
Operating Temperature
Storage Temperature
10
Topr
Tstg
-40 ~ +85
-40 ~ +100
℃
℃
Max 260℃for 5 sec Max
Soldering Temperature
Tsol
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V) @20mA(mcd)
Luminous
intensity
Viewing
angle
2θ1/2
(deg)
Peak
wave
length
λPnm
Spectral
halfwidth
△λnm
COLOR
PART NO MATERIAL
Typ.
2.4 550 900
Emitted
Red
Lens
Max.
Min.
Min.
1.5
LUR2043/TBS-X
Water Clear
660
20
30
GaAlAs
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 3/5
‧ Dimensions Symbol Information
SPECIFICATIONS
Minimum Maximum
OPTION
CODE
SYMBOL ITEMS
SYMBOL
mm
inch
mm
inch
Tape Feed Hole Diameter
Component Lead Pitch
Front-To-Rear Deflection
-------
-------
-------
D
F
3.8
2.3
0.15
0.09
-------
4.2
3.0
2.0
0.17
0.12
0.08
-------
△H
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
-------
0.69
0.85
1.0
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
36
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
TRS-1
TRS-2
TRS-3
TRS-4
TRS-5
TRS-6
TRS-7
TRS-8
TRS-9
TRS-10
-------
1.08
0.89
0.78
0.94
0.96
0.75
0.72
-------
Feed Hole To Bottom Of Component
H1
0.79
0.76
1.42
Feed Hole To Overall Component Height
Lead Length After Component Height
H2
L
-------
-------
-------
-------
-------
-------
-------
-------
-------
W0
11.0
13.0
5.8
0.43
0.51
0.23
0.3
Feed Hole Pitch
P
12.4
4.4
0.49
0.17
0.2
Lead Location
P1
P2
T
Center Of Component Location
Overall Taped Package Thickness
5.1
7.7
-------
-------
1.42
9.75
15.5
4.0
0.06
0.38
0.61
0.16
0.75
Feed Hole Location
Adhesive Tape Width
Adhesive Tape Position
Tape Width
W0
W1
W2
W3
8.5
14.5
0
0.33
0.57
0
17.5
0.69
19.0
REMARK:TBS=Tape And Box Straight Leads
‧ Package Dimensions
‧ Dimensions Symbol Information
Specification
Symbol
Description
minimum
maxmum
W
L
inch
inch
mm
330
265
50
mm
340
275
60
Overall Length
L
W
H
13.0
10.4
1.97
13.4
10.8
2.4
H
Overall Width
Overall Thickness
Quantity/Box
2500PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LUR2043/TBS-X
4/5
Typical Electro-Optical Characteristics Curve
UR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
1
0 1
1.0
2.0
3.0
4.0
5.0
1
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.1
1.0
0.9
0.8
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40 -20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
0°
1.0
-30°
30°
-60°
-60°
0.5
0.0
0
50% 25%
25% 50% 75%100%
100% 75%
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR2043/TBS-X
Page 5/5
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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