LUR3330/S46 [LIGITEK]
SUPER BRIGHT ROUND TYPE LED LAMPS; SUPER BRIGHT ROUND型LED灯![LUR3330/S46](http://pdffile.icpdf.com/pdf1/p00147/img/icpdf/LUR33_817013_icpdf.jpg)
型号: | LUR3330/S46 |
厂家: | ![]() |
描述: | SUPER BRIGHT ROUND TYPE LED LAMPS |
文件: | 总5页 (文件大小:95K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
LUR3330/S46
DATA SHEET
DOC. NO : QW0905-LUR3330/S46
REV.
: A
DATE
: 04 - Mar. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/4
PART NO. LUR3330/S46
Package Dimensions
5.0
5.9
7.6
8.6
1.5
MAX
□0.5
TYP
25.0MIN
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR3330/S46
Page 2/4
Absolute Maximum Ratings at Ta=25 ℃
Ratings
UR
Symbol
Parameter
UNIT
IF
IFP
PD
Ir
40
Forward Current
mA
Peak Forward Current
Duty 1/10@10KHz
120
mA
mW
Power Dissipation
120
Reverse Current @5V
Operating Temperature
Storage Temperature
10
μA
℃
Topr
Tstg
-40 ~ +85
-40 ~ +100
℃
Max 260℃ for 5 sec Max
Soldering Temperature
Tsol
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V) @20mA(mcd)
Luminous
intensity
Viewing
angle
2θ 1/2
(deg)
Peak
wave
length
λPnm
Spectral
halfwidth
△λnm
COLOR
PART NO MATERIAL
Typ.
Emitted
Red
Lens
Red Diffused
Min. Max. Min.
660
20
1.5 2.4 450 700
40
GaAlAs
LUR3330/S46
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR3330/S46
Page
3/4
Typical Electro-Optical Characteristics Curve
UR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
1
0 1
1.0
2.0
3.0
4.0
5.0
1
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
1.2
3.0
2.5
2.0
1.1
1.0
0.9
0.8
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40 -20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/4
PART NO. LUR3330/S46
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
相关型号:
©2020 ICPDF网 联系我们和版权申明