LUR9653H-30C [LIGITEK]
SQUARE WITH 4LEADS TYPE LED LAMPS; 方用4LEADS型LED灯
| 型号： | LUR9653H-30C |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | SQUARE WITH 4LEADS TYPE LED LAMPS |
| 文件： | 总6页 (文件大小：112K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SQUARE WITH 4LEADS TYPE LED LAMPS
Pb
Lead-Free Parts
LUR9653H-30C
DATA SHEET
DOC. NO : QW0905-LUR9653H-30C
REV.
: A
DATE
: 06 - Aug. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LUR9653H-30C
Package Dimensions
R0.7
CATHODE
C1.25
7.62±0.5
ANODE
ψ3.0
7.62±0.5
2.1
2.5±0.5
4.4±0.5
3.5±0.5
0.4
1.55
0.5
5.08
5.08±0.3
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR9653H-30C
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
UR(H)
70
Symbol
Parameter
UNIT
IF
IFP
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
100
mW
μA
130
Power Dissipation
PD
Ir
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
10
ESD
Topr
Tstg
2000
V
-40 ~ +85
-40 ~ +100
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Dominant
wave
length
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
COLOR
PART NO MATERIAL
LUR9653H-30C AlGaInP/GaP
λDnm
Typ.
Emitted
Red
Lens
Min. Max. Min.
Water Clear
630
20
1.7
2.6 550 900
58
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page3/5
PART NO. LUR9653H-30C
Typical Electro-Optical Characteristics Curve
UR(H) CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
10
1
0 1
1.0
1.5
2.0
2.5
3.0
1
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.1
1.0
0.9
0.8
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40 -20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR9653H-30C
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
120°
5°/sec
max
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUR9653H-30C
Page 5/5
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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