LURF32743-H0 [LIGITEK]
SUPER BRIGHT ROUND TYPE LED LAMPS; SUPER BRIGHT ROUND型LED灯
| 型号： | LURF32743-H0 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | SUPER BRIGHT ROUND TYPE LED LAMPS |
| 文件： | 总5页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
LURF32743/H0
DATA SHEET
DOC. NO : QW0905-LURF32743/H0
A
REV.
:
DATE
: 05 - Oct.- 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LURF32743/H0
1/4
3.8
3.1
Package Dimensions
3.55
4.85
1.5MAX
25.0MIN
1.0MIN
□0.5
TYP
2.5TYP
-
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
60°
60°
0
100% 75% 50% 25%
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LURF32743/H0
Page2/4
Absolute Maximum Ratings at Ta=25 ℃
Ratings
URF
50
Symbol
Parameter
UNIT
IF
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
130
IFP
PD
mW
μA
120
Power Dissipation
Reverse Current @5V
Ir
10
ESD
Topr
2000
-40 ~ +85
Electrostatic Discharge
Operating Temperature
V
℃
Tstg
Tsol
Storage Temperature
Soldering Temperature
-40 ~ +100
℃
Max 260℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
Luminous
intensity
Dominant
wave
length
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
COLOR
20
@
mA(V) @20mA(mcd)
PART NO
MATERIAL
λDnm
Typ.
Emitted
Red
Lens
Water Clear
Min. Max. Min.
LURF32743/H0 AlGaInP
630
20
1.5 2.4 1500 3000
60
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LURF32743/H0
PART NO.
Page 3/4
Typical Electro-Optical Characteristics Curve
URF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
3.0
1000
100
2.5
2.0
10
1.0
0.1
1.5
1.0
0.5
0
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
2.0
1.2
1.1
1.0
1.5
1.0
0.9
0.8
0.5
0
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
650
700
600
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LURF32743/H0
4/4
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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