LVG9353 [LIGITEK]

AXIAL TYPE LED LAMPS; 轴向型LED灯
LVG9353
型号: LVG9353
厂家: LIGITEK ELECTRONICS CO., LTD.    LIGITEK ELECTRONICS CO., LTD.
描述:

AXIAL TYPE LED LAMPS
轴向型LED灯

文件: 总7页 (文件大小:82K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
AXIAL TYPE LED LAMPS  
LVG9353  
DATA SHEET  
DOC. NO : QW0905-LVG9353  
REV  
: A  
DATE  
: 13 - Jul. - 2005  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LVG9353  
Page 1/6  
Package Dimensions  
6.0MIN  
3.0  
6.0MIN  
0.5  
2.2  
1.54  
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.  
2.Specifications are subject to change without notice.  
Directivity Radiation  
0°  
-30°  
30°  
-60°  
60°  
100% 75% 50% 25% 0 25% 50% 75% 100%  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LVG9353  
Page 2/6  
Absolute Maximum Ratings at Ta=25 ℃  
Absolute Maximum Ratings  
Symbol  
Parameter  
UNIT  
VG  
30  
IF  
Forward Current  
mA  
mA  
mW  
Peak Forward Current  
Duty 1/10@10KHz  
IFP  
PD  
120  
100  
Power Dissipation  
Reverse Current @5V  
Operating Temperature  
μA  
Ir  
10  
Topr  
-40 ~ +85  
Tstg  
Tsol  
Storage Temperature  
Soldering Temperature  
-40 ~ +100  
Max 260for 5 sec Max  
Typical Electrical & Optical Characteristics (Ta=25 )  
Peak  
wave  
length  
λPnm  
Spectral  
halfwidth  
△λnm  
Forward  
voltage  
@20mA(V) @20mA(mcd)  
Luminous  
intensity  
Viewing  
angle  
2θ 1/2  
(deg)  
COLOR  
PART NO  
MATERIAL  
GaP  
Typ.  
20  
Emitted  
Lens  
Min. Max. Min.  
1.7 2.6 12  
LVG9353  
Green Water Clear  
30  
84  
565  
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.  
2. The luminous intensity data did not including ±15% testing tolerance.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 3/6  
PART NO. LVG9353  
Typical Electro-Optical Characteristics Curve  
VG CHIP  
Fig.1 Forward current vs. Forward Voltage  
Fig.2 Relative Intensity vs. Forward Current  
1000  
100  
3.5  
3.0  
2.5  
2.0  
1.5  
10  
1.0  
0.5  
0.0  
1.0  
0.1  
1.0  
2.0  
3.0  
4.0  
5.0  
1.0  
10  
100  
1000  
Forward Current(mA)  
Forward Voltage(V)  
Fig.3 Forward Voltage vs. Temperature  
Fig.4 Relative Intensity vs. Temperature  
3.0  
1.2  
2.5  
2.0  
1.1  
1.0  
1.5  
1.0  
0.5  
0.9  
0.8  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80 100  
Ambient Temperature()  
Ambient Temperature()  
Fig.5 Relative Intensity vs. Wavelength  
1.0  
0.5  
0.0  
500  
550  
600  
650  
Wavelength (nm)  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
PART NO. LVG9353  
Soldering Iron:  
Page 4/6  
Basic spec is 5 sec when 260℃. If temperature is higher, time should be shorter(+10-1sec).  
Power dissipation of iron should be smaller than 15W,and temperature should be controllable.  
Surface temperature of the device should be under 230.  
Soldering heat  
Soldering heat Max. 260℃  
245±5within 5 sec  
Preheat  
120 ~ 150℃  
120 ~ 180 sec  
Reflow Temp/Time  
Temp.  
()  
220  
Rising  
Cooling  
+5/sec  
-5/sec  
Preheat  
150  
120  
Time  
60 ~ 120 sec  
5sec  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page 5/6  
PART NO. LVG9353  
Precautions For Use:  
Storage time:  
1.The operation of Temperatures and RH are : 5~35,RH60%.  
2.Once the package is opened, the products should be used within a week.  
Otherwise, they should be kept in a damp proof box with descanting agent.  
Considering the tape life, we suggest our customers to use our products within  
a year(from production date).  
3.If opened more than one week in an atmosphere 5 ~ 35,RH60%,  
they should be treated at 60±5 fo r 15hrs.  
Drive Method:  
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into  
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series  
with the LED.  
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd  
current should not be allowed to change by more than 40 % of its desired value.  
Circuit model A  
LED  
Circuit model B  
LED  
(A) Recommended circuit.  
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.  
Cleaning:  
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.  
ESD(Electrostatic Discharge):  
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic  
glove is recommended when handing these LED. All devices, equipment and machinery must be properly  
grounded.  
LIGITEK ELECTRONICS CO.,LTD.  
Property of Ligitek Only  
Page  
6/6  
PART NO. : LVG9353  
Reliability Test:  
Reference  
Standard  
Description  
Test Item  
Test Condition  
1.Under Room Temperature  
2.If=20mA  
3.t=1000 hrs (-24hrs, +72hrs)  
This test is conducted for the purpose  
of detemining the resisance of a part  
in electrical and themal stressed.  
MIL-STD-750: 1026  
MIL-STD-883: 1005  
JIS C 7021: B-1  
Operating Life Test  
The purpose of this is the resistance of  
the device which is laid under ondition  
of high temperature for hours.  
High Temperature  
Storage Test  
1.Ta=105±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
MIL-STD-883:1008  
JIS C 7021: B-10  
The purpose of this is the resistance  
of the device which is laid under  
condition of low temperature for hours.  
Low Temperature  
Storage Test  
1.Ta=-40±5℃  
2.t=1000 hrs (-24hrs, +72hrs)  
JIS C 7021: B-12  
1.Ta=65±5℃  
2.RH=90%~95%  
3.t=240hrs ±2hrs  
High Temperature  
High Humidity Test  
The purpose of this test is the resistance  
of the device under tropical for hous.  
MIL-STD-202:103B  
JIS C 7021: B-11  
The purpose of this is the resistance of  
the device to sudden extreme changes  
in high and low temperature.  
1.Ta=105±5&-40±5℃  
(10min) (10min)  
2.total 10 cycles  
MIL-STD-202: 107D  
MIL-STD-750: 1051  
MIL-STD-883: 1011  
Thermal Shock Test  
This test intended to determine the  
thermal characteristic resistance  
of the device to sudden exposures  
at extreme changes in temperature  
when soldering the lead wire.  
MIL-STD-202: 210A  
MIL-STD-750: 2031  
JIS C 7021: A-1  
Solder Resistance  
Test  
1.T.Sol=260 ±5℃  
2.Dwell time= 10 ±1sec.  
MIL-STD-202: 208D  
MIL-STD-750: 2026  
MIL-STD-883: 2003  
JIS C 7021: A-2  
This test intended to see soldering well  
performed or not.  
1.T.Sol=230 ±5℃  
2.Dwell time=5 ±1sec  
Solderability Test  

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