CONMHF1-SMD-T [LINX]
U.FL-Type Jack PCB Surface-Mount Connector;
| 型号： | CONMHF1-SMD-T |
| 厂家： | 
Linx Technologies |
| 描述： | U.FL-Type Jack PCB Surface-Mount Connector PC |
| 文件： | 总6页 (文件大小：654K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
CONMHF1-SMD
U.FL-Type Jack PCB Surface-Mount Connector
The CONMHF1-SMD is an U.FL-type jack (male
pin) PCB surface-mount connector designed
for reflow-solder mounting directly to a printed
circuit board. Operating from 0 GHz to 6 GHz, the
CONMHF1-SMD combines superior performance,
compact size, and a convenient snap-on mating
interface to provide a reliable, easy-to-use connector.
Additionally, all Linx connectors meet RoHS lead
free standards and are tested to meet requirements
for corrosion resistance, vibration, mechanical and
thermal shock.
Features
• 0 to 6 GHz operation
Applications
• LPWA
• Gold plating
― LoRaWAN®, Sigfox®, WiFi HaLow™ (802.11ah)
― Superior corrosion resistance
• MHF1/U.FL-type jack (male pin) connection
― Gold plated brass center contact
• Direct PCB attachment
• Reflow- or hand-solder assembly
• Cellular IoT
― LTE-M (Cat-M1), NB-IoT
• Cellular
― 5G/4G LTE/3G/2G
• GNSS
― GPS, Galileo, GLONASS, BeiDou, QZSS
• Industrial/Commercial/Enterprise
• ISM
Table 1. Electrical Specifications
Impedance
50 Ω
0 to 6 GHz
Frequency Range
Voltage Rating
60 V RMS
Contact Resistance
Insulation Resistance
Dielectric Withstanding Voltage
Select Frequencies
Insertion Loss (dB max)
VSWR (max)
Center: ≤ 6.0 mΩ Outer: ≤ 1.0 mΩ
100 MΩ min.
0.5 mA max.
2.4 GHz
0.10
5 GHz
0.81
2.0
1.1
Ordering Information
Part Number
Description
MHF1/U.FL-type nickel plated jack (male pin) PCB surface-mount connector in tape and reel
(4500 per reel)
CONMHF1-SMD-T
MHF1/U.FL-type gold plated jack (male pin) PCB surface-mount connector in tape and reel
(4500 per reel)
CONMHF1-SMD-G-T
Available from Linx Technologies and select distributors and representatives.
CONMHF1-SMD
Datasheet
Product Dimensions
1.25 mm
(0.05 in)
2.6 mm (0.10 in)
0.52 mm
(0.02 in)
0.06 mm
(0.002 in)
max.
3.1 mm
(0.12 in)
2.6 mm
(0.10 in)
1.8 mm
(0.07 in)
Ø2.0 mm
(0.08 in)
0.52 mm
(0.02 in)
0.35 mm
(0.01 in)
Figure 1. Product Dimensions for the CONMHF1-SMD Connector
Table 2. Connector Components
Model
CONMHF1-SMD
Material
CONMHF1-SMD-G
Connector Part
Connector Body
Outer Contact
Center Contact (male pin)
Signal Contact
Ground Contact
Finish
–
Material
LCP, UL94V-0
Brass
Finish
–
LCP, UL94V-0
Brass
Nickel
Gold
Gold
Gold
Gold
Gold
Gold
Gold
Brass
Brass
Phosphor Bronze
Phosphor Bronze
Phosphor Bronze
Phosphor Bronze
Recommended PCB Footprint
Figure 2 shows the connectors recommended PCB footprint for the CONMHF1-SMD connector.
3.0 mm (0.12 in)
1.85 mm (0.07 in)
2.6 mm
(0.10 in)
1.05 mm
(0.04 in)
3.1 mm
Signal
GND
(0.12 in)
1.8 mm
(0.07 in)
1.0 mm
(0.04 in)
Figure 2. Recommended PCB Dimensions for the CONMHF1-SMD
2
Datasheet
CONMHF1-SMD
Connector Performance
Table 3 shows insertion loss and VSWR values for the CONMHF1-SMD connector at commonly used
frequencies.
Insertion loss is the loss of signal power (gain) resulting from the insertion of a device in a transmission line.
VSWR describes how efficiently power is transmitted through the connector. A lower VSWR value indicates
better performance at a given frequency.
Table 3. Insertion Loss and VSWR for the CONMHF1-SMD Connector
Low-Band Cellular/
Band
GNSS
Midband Cellular
WiFi/ISM
ISM/LPWA
400 MHz to 960 MHz
0.04
Frequency Range
Insertion Loss (dB max)
VSWR (max)
1164 MHz to 1609 MHz 1427 MHz to 5000 MHz
2.4 GHz
0.10
0.07
1.1
0.85
2.0
1.1
1.1
Table 4. Mechanical Specifications
Model
CONMHF1-SMD
PCB Surface-Mount
Snap-on Coupling
EIA-364
Mounting Type
Fastening Type
Interface in Accordance with
Connector Durability
Weight
30 cycles min.
0.8 g (0.03 oz)
Table 5. Environmental Specifications
STD, Test Condition
Corrosion (Salt spray)
EIA 364-26
EIA 364-32
EIA 364-28
EIA 364-27
-40 °C to +90 ° C
RoHS
Thermal Shock
Vibration
Mechanical Shock
Temperature Range
Environmental Compliance
3
CONMHF1-SMD
Datasheet
Reflow Solder Profile
Figure 3 shows the time and temperature data for reflow soldering the connector to a PCB.
300
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
255°C
250
200
150
100
50
235°C
217°C
185°C
180°C
125°C
0
30
60
90
120
150
180
210
240
270
300
330
360
Time (Seconds)
Figure 3. CONMHF1-SMD Recommended Reflow Solder Profile
Packaging Information
Figure 4 shows the tape dimensions for the CONMHF1-SMD connector. The reel specifications are provided
in Figure 5.
Ø1.5 mm
(0.06 in)
2.0 mm
(0.08 in)
4.0 mm
(0.16 in)
1.75 mm
(0.07 in)
5.5 mm
(0.22 in)
Signal contact
12.0 mm
(0.47 in)
8.0 mm
(0.31 in)
Figure 4. Tape Specifications for the CONMHF1-SMD Connector
4
Datasheet
CONMHF1-SMD
Packaging Information (Continued)
W1
Reel Dimensions
Qty
Symbol
Unit
pcs
mm
mm
mm
mm
mm
mm
mm
E
QTY per reel
Tape width
4,500
12.00
A
B
C
E
W
W1
Ø 330 1
Ø 100 0.5
Ø 13.00 0.2
2.2 0.5
12 0.5
16.4 0.2
B
C
A
W
Figure 5. Reel Specifications for the CONMHF1-SMD Connector
5
CONMHF1-SMD
Datasheet
Website:
Linx Offices:
Phone:
http://linxtechnologies.com
159 Ort Lane, Merlin, OR, US 97532
+1 (541) 471-6256
E-MAIL:
info@linxtechnologies.com
Linx Technologies reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use
or application. No rights under any patent accompany the sale of any such product(s) or information.
Wireless Made Simple is a registered trademark of Linx Acquisitions LLC. LoRaWAN is a registered trademark of Semtech Corporation. Sigfox is a registered
trademark of SIGFOX. Other product and brand names may be trademarks or registered trademarks of their respective owners.
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