LTPA-S38FUMWE [LITEON]
SMD LED;
| 型号： | LTPA-S38FUMWE |
| 厂家： | 
LITE-ON TECHNOLOGY CORPORATION |
| 描述： | SMD LED 光电 |
| 文件： | 总15页 (文件大小：715K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMD LED
Product Data Sheet
LTPA-S38FUMWE
Spec No.：
Created Date: 2016/09/30
Revision: (PRELIMINARY) – 1.2
BNS-OD-FC001/A
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
LTPA-S38FUMWE (PRELIMINARY)
SMD LED
LTPA-S38FUMWE
Rev
Description
By
Date
1.0
1.1
1.2
New data sheet
Update 3.1
Thomas
Thomas
Thomas
05/30/2016
09/30/2016
10/20/2016
Update 1200mA for 5.4,5.5,5.6,5.7
Above data for PD and Customer tracking only
Customer Name:
Customer Signature:
LiteON Sales Signature:
Print Name:
Print Name:
Part No. :LTPA-S38FUMWE
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SMD LED
LTPA-S38FUMWE (PRELIMINARY)
1. Description
S3838 is a new small size high flux LED for slim designs. The black package stands for high stability.
1.1 Features
1.2 Applications
Meet ROHS.
Aftermarket :accessary application
SMD ceramic package.
Package in 16mm tape on 7" diameter reels
Preconditioning: accelerate to JEDEC level 2
EIA STD package
I.C. compatible
Compatible with automatic placement equipment
Compatible with infrared reflow solder process
2. Package Dimensions
Part No.
Lens Color
Source Color
LTPA-S38FUMWE
Yellow
InGaN White
1.
2.
All dimensions are in millimeters and dimension tolerances are ±0.3mm.
Dimensions without tolerances are for reference only.
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3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Rating
Unit
Power Dissipation
Po
6
W
Min DC Forward Current
Max DC Forward Current
Peak Plus Current
IF
IF
50
mA
mA
1,200
Ip
2,000
mA
(1/100 duty cycle, 0.1ms pules width)
ESD Sensitivity(HBM)
VHBM
Tj
8
kV
°C
°C
°C
Junction Temperature
150
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-40’c~+125’c
-40’c~+125’c
Notes :
1. ESD spec is reference to AEC-Q101-001 HBM.
2. The unit of Rth is °C/W electrical and driving current is 700mA.
3. The package LEDs are not designed to be driven in reverse bias.
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3.2 Electrical / Optical Characteristics at Ta=25°C
Test
Values
Parameter
Symbol
Unit
Condition
Min
--
Typ.
Max
--
Correlated Color
Temperature
CCT
6000
K
Color Rendering Index
Viewing Angle
CRI
2θ1/2
VF
--
--
70
--
--
-
120
3.25
deg
V
IF = 700mA
Forward Voltage
2.75
3.75
Luminous Flux
ΦV
180
280
lm
Thermal Resistance,
Junction-Solder
Rth, J-S
5.5
°C / W
Notes
1. All of the VF value are typical and the real bin range please refer ”VF Binning Parameter”.
2. All of the Flux value are typical and the real Bin range please refer ”Flux Binning Parameter”.
3. Tolerance of Flux is ±10%, Tolerance of VF is ±5%, and tolerance of CRI is ±3.
4. Thermal resistance measurement tolerance is ± 10%,and with 11x 9 cm heat sink.
5. Reverse voltage(VR) condition is applied to IR test only. The device is not designed for reverse operation
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4. Bin Rank
Batch Description on Label: Vf / Iv / Color ( Ex. 8G/6N/57 )
4.1 VF Binning Parameter;
Forward Voltage
Unit : V@700mA
Max.
Bin Code
Min.
2.75
3.00
3.25
3.50
3.00
3.25
3.50
3.75
8E
8F
8G
8H
Tolerance on each Voltage bin is +/-0.1V
4.2 Flux Binning Parameter;
Luminous Flux
Unit : lm @700mA
Bin Code
5M
Min.
180
201
224
Max.
201
224
250
6M
7M
8M
250
280
Tolerance on each Intensity bin is +/-10%
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4.3 Color Rank
Color Bin Table
Test @700mA
Color Bin Limits
Color Bin Limits
Bin
Bin
Code
Code
CIE- Point1 Point2 Point3 Point4
CIE- Point1 Point2 Point3 Point4
x
y
x
y
0.3241 0.3248 0.3350 0.3355
0.3534 0.3370 0.3460 0.3633
0.3145 0.3163 0.3246 0.3253
0.3330 0.3181 0.3424 0.3266
x
y
x
y
0.3190 0.3203 0.3298 0.3299
0.3430 0.3274 0.3526 0.3361
0.3104 0.3127 0.3199 0.3212
0.3234 0.3093 0.3325 0.3175
55
60
57
65
Tolerance on each Hue bin (x, y) bin is +/- 0.01.
4.4 Chromaticity Coordinate
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5. Typical Electrical / Optical Characteristics Curves.
5.1 Relative Spectral Power Distribution at 700mA, 25°C Ambient Temperature
5.2 Radiation Characteristics
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5.3 Maximum Forward Current vs. Ambient Temperature
5.4 Forward Current vs. Forward Voltage at 25°C
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5.5 Relative CIE-x v.s. Forward Current at 25°C
5.6 Relative CIE-y v.s. Forward Current at 25°C
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5.7 Relative Flux vs. Current
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6. Reflow Soldering Characteristics
Profile Feature
Lead Free Assembly
3°C / second max
150°C
Average Ramp-Up Rate (TSmax to TP)
Preheat Temperature Min (TSmin
Preheat Temperature Max (TSmax
Preheat Time (tSmin to tSmax
)
)
200°C
)
60 – 180 seconds
217°C
Time Maintained Above Temperature (TL)
Time Maintained Above Time (tL)
Peak / Classification Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp – Down Rate
80 – 100 seconds
260°C
5 seconds
6°C / second max
8 minutes max
Time 25°C to Peak Temperature
Notes
1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended hand
soldering condition is 350°C max. and 2secs max. for one time only, and the recommended reflow soldering
condition is 260°C max. and 5secs max. for three times max.
2. All temperatures refer to topside of the package, measured on the package body surface.
The soldering profile could be further referred to different soldering grease material characteristic. The grease
vendor will provide this information.
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7. Package Dimensions of Tape and Reel
8. Recommend Soldering Pad Layout
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9. Cautions
9.1 An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in
parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive
circuit, in series with each LED as shown in Circuit below.
LED
LED
Circuit model A
Circuit model B
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of
those LEDs.
9.2 Do not put any pressure on the light emitting surface either by finger or any hand tool and do not stack the
COB products. Stress or pressure may cause damage to the wires of the LED array.
9.3 This product is not designed for the use under any of the following conditions, please confirm the
performance and reliability are well enough if you use it under any of the following conditions
・Do not use sulfur-containing materials in commercial products including the materials such as seals and
adhesives that may contain sulfur.
・Do not put this product in a place with a lot of moisture (over 85% relative humidity), dew condensation,
briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.), exposure to a corrosive environment may
affect silver plating.
9.4 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic
lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “no light up” at low currents.
To verify for ESD damage, check for “light up” and VF of the suspect LEDs at low currents.
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9.5 Storage
This product is qualified as Moisture sensitive Level 2 per JEDEC J-STD-020 Precaution when handing
this moisture sensitive product is important to ensure the reliability of the product.
The package is sealed: The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are
limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants
inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity. It is
recommended that LEDs out of their original packaging are IR-reflowed within one year. For extended
storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container
with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original
packaging for more than one year should be baked at about 60 deg C for at least 20 hours before solder
assembly.
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