LTSN-C190QF

更新时间:2025-06-30 01:40:50
品牌:LITEON
描述:ULTRA BRIGHT AlINGaP CHIP LED

LTSN-C190QF 概述

ULTRA BRIGHT AlINGaP CHIP LED 超高亮的AlInGaP LED芯片 可见光 LED

LTSN-C190QF 规格参数

生命周期:ObsoleteReach Compliance Code:unknown
HTS代码:8541.40.20.00风险等级:5.77
其他特性:IC COMPATIBLE, SUPPORTS INFRARED颜色:ORANGE
配置:SINGLE最大正向电流:0.03 A
透镜类型:WATER CLEAR标称发光强度:130.0 mcd
安装特点:SURFACE MOUNT功能数量:1
端子数量:2最高工作温度:85 °C
最低工作温度:-55 °C光电设备类型:SINGLE COLOR LED
总高度:0.8 mm包装方法:TAPE AND REEL 7"
峰值波长:611 nm形状:RECTANGULAR
尺寸:1.1 mm表面贴装:YES
端子节距:1.5 mm视角:130 deg
Base Number Matches:1

LTSN-C190QF 数据手册

通过下载LTSN-C190QF数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Features  
* Ultra bright AlInGaP Chip LED.  
* Package in 8mm tape on 7" diameter reels.  
* Compatible with automatic placement equipment.  
* Compatible with infrared and vapor phase reflow solder process.  
* EIA STD package.  
* I.C. compatible.  
Package Dimensions  
Part No.  
Lens  
Source Color  
Water Clear  
AllnGaP Orange  
LTSN-C190QF  
Notes:  
1. All dimensions are in millimeters (inches).  
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
Page :  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Absolute Maximum Ratings At Ta= 25  
Parameter  
LTSN-C190QF  
75  
Unit  
mW  
Power Dissipation  
Peak Forward Current  
(1/10 Duty Cycle, 0.1ms Pulse Width)  
80  
mA  
mA  
DC Forward Current  
30  
0.4  
5
°
°
Derating Linear From 25 C  
mA/ C  
Reverse Voltage  
V
°
°
Operating Temperature Range  
Storage Temperature Range  
-55 C to + 85 C  
°
°
-55 C to + 85 C  
°
Wave Soldering Condition  
260 C For 5 Seconds  
°
Infrared Soldering Condition  
Vapor Phase Soldering Condition  
Suggest IR Reflow Condition :  
260 C For 5 Seconds  
°
215 C For 3 Minutes  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Electrical Optical Characteristics At Ta= 25  
Part No.  
LTSN-  
Symbol  
IV  
Parameter  
Min.  
71.0  
Typ.  
130.0  
130  
611  
605  
17  
Max.  
Unit  
mcd  
deg  
nm  
nm  
nm  
V
Test Condition  
IF = 20mA  
Note 1  
Luminous Intensity  
Viewing Angle  
C190QF  
C190QF  
C190QF  
C190QF  
C190QF  
C190QF  
C190QF  
C190QF  
θ
2
1/2  
Note 2 (Fig.6)  
Measurement  
@Peak (Fig.1)  
λ
Peak Emission Wavelength  
Dominant Wavelength  
Spectral Line Half-Width  
Forward Voltage  
Reverse Current  
P
d
λ
Note 3  
Δλ  
VF  
IR  
2.0  
2.4  
IF = 20mA  
VR = 5V  
μ
100  
A
VF = 0  
f = 1MHZ  
Capacitance  
C
40  
PF  
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the  
CIE eye-response curve.  
θ
2.  
1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.  
λ
3. The dominant wavelength,  
d is derived from the CIE chromaticity diagram and represents the  
single wavelength which defines the color of the device.  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Bin Code List  
Luminous Intensity  
Bin Code  
Unit : mcd @20mA  
Min.  
71.0  
Max.  
112.0  
180.0  
280.0  
Q
R
S
112.0  
180.0  
Tolerance on each Intensity bin is +/-15%  
Dominant Wavelength  
Bin Code  
Unit : nm @20mA  
Max.  
Min.  
600.0  
603.0  
606.0  
609.0  
P
Q
R
S
603.0  
606.0  
609.0  
612.0  
Tolerance for each Dominate Wavelength bin is +/- 1nm  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Typical Electrical  
/
Optical Characteristics Curves  
(25 °C Ambient Temperature Unless Otherwise Noted)  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Cleaning  
Do not use unspecified chemical liquid to clean LED they could harm the package.  
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature  
for less one minute.  
Suggest Soldering Pad Dimensions  
Package Dimensions Of Tape And Reel  
Notes:  
1. All dimensions are in millimeters (inches).  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Notes:  
1. Empty component pockets sealed with top cover tape.  
2. 7 inch reel-3000 pieces per reel.  
3. Minimum packing quantity is 500 pcs for remainders.  
4. The maximum number of consecutive missing lamps is two.  
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
CAUTIONS  
1. Application  
The LEDs described here are intended to be used for ordinary electronic equipment (such as office  
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance  
for information on applications in which exceptional reliability is required, particularly when the failure  
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,  
traffic control equipment, medical and life support systems and safety devices).  
2. Storage  
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.  
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.  
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a  
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.  
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C  
for at least 24 hours before solder assembly.  
3. Cleaning  
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.  
4. Soldering  
Recommended soldering conditions:  
Reflow soldering  
Wave Soldering  
Pre-heat 100°C Max.  
Soldering iron  
Temperature 300°C Max.  
Pre-heat  
Pre-heat time  
120~150°C  
120 sec. Max. Pre-heat time  
60 sec. Max. Soldering time 3 sec. Max.  
260°C Max.  
10 sec. Max.  
Peak temperature 240°C Max.  
Solder wave  
Soldering time  
(one time only)  
Soldering time  
10 sec. Max.  
5. Drive Method  
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs  
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated  
in the drive circuit, in series with each LED as shown in Circuit A below.  
Circuit model A  
Circuit model B  
LED  
LED  
(A) Recommended circuit.  
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics  
of those LEDs.  
6. ESD (Electrostatic Discharge)  
Static Electricity or power surge will damage the LED.  
Suggestions to prevent ESD damage:  
„ Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.  
„ All devices, equipment, and machinery must be properly grounded.  
„ Work tables, storage racks, etc. should be properly grounded.  
„ Use ion blower to neutralize the static charge which might have built up on surface of the LED’s  
plastic lens as a result of friction between LEDs during storage and handling.  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward  
voltage, or “ no lightup ” at low currents.  
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.  
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.  
Chip ESD level  
InGaN / Sapphire  
AlInGaP  
Machine Mode  
100 V  
Human Body Mode  
300 V  
200 V  
500 V  
InGaN / SiC  
600 V  
1000 V  
7. Reliability Test  
Classification  
Test Item  
Test Condition  
Reference Standard  
MIL-STD-750D:1026 (1995)  
MIL-STD-883D:1005 (1991)  
JIS C 7021:B-1 (1982)  
Ta= Under Room Temperature As Per Data Sheet  
Maximum Rating  
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.  
Operation Life  
High Temperature  
High Humidity  
Storage  
IR-Reflow In-Board, 2 Times  
Ta= 65±5,RH= 9095%  
*Test Time= 240HRS±2HRS  
MIL-STD-202F:103B(1980)  
JIS C 7021:B-11(1982)  
Endurance  
Test  
Ta= 105±5℃  
*Test Time= 1000HRS (-24HRS,+72HRS)  
High Temperature  
Storage  
MIL-STD-883D:1008 (1991)  
JIS C 7021:B-10 (1982)  
Ta= -55±5℃  
*Test Time=1000HRS (-24HRS,+72H RS)  
Low Temperature  
Storage  
JIS C 7021:B-12 (1982)  
MIL-STD-202F:107D (1980)  
MIL-STD-750D:1051(1995)  
MIL-STD-883D:1010 (1991)  
JIS C 7021:A-4(1982)  
105℃ 〜 25℃ 〜 -55℃ 〜 25℃  
Temperature  
Cycling  
30mins 5mins  
10 Cycles  
30mins 5mins  
IR-Reflow In-Board, 2 Times  
MIL-STD-202F:107D(1980)  
MIL-STD-750D:1051(1995)  
MIL-STD-883D:1011 (1991)  
Thermal  
Shock  
85 ± 5℃ 〜 -40± 5℃  
10mins  
10mins 10 Cycles  
MIL-STD-202F:210A(1980)  
MIL-STD-750D:2031(1995)  
JIS C 7021:A-1(1982)  
T.sol= 260 ± 5℃  
Solder  
Resistance  
Dwell Time= 10 ± 1secs  
Environmental  
Test  
Ramp-up rate(183to Peak) +3/ second max  
Temp. maintain at 125(±25)120 seconds max  
Temp. maintain above 18360-150 seconds  
Peak temperature range 235+5/-0℃  
Time within 5°C of actual Peak Temperature (tp)  
10-30 seconds  
MIL-STD-750D:2031.2(1995)  
J-STD-020(1999)  
IR-Reflow  
Ramp-down rate +6/second max  
MIL-STD-202F:208D(1980)  
MIL-STD-750D:2026(1995)  
MIL-STD-883D:2003(1991)  
IEC 68 Part 2-20  
T.sol= 235 ± 5℃  
Immersion time 2±0.5 sec  
Solderability  
Immersion rate 25±2.5 mm/sec  
Immersion rate 25±2.5 mm/sec  
Coverage 95% of the dipped surface  
JIS C 7021:A-2(1982)  
8. Others  
The appearance and specifications of the product may be modified for improvement without prior notice.  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
9. Suggested Checking List  
Training and Certification  
1. Everyone working in a static-safe area is ESD-certified?  
2. Training records kept and re-certification dates monitored?  
Static-Safe Workstation & Work Areas  
1. Static-safe workstation or work-areas have ESD signs?  
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?  
3. All ionizer activated, positioned towards the units?  
4. Each work surface mats grounding is good?  
Personnel Grounding  
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel  
strap or conductive shoes with conductive flooring?  
2. If conductive footwear used, conductive flooring also present where operator stand or walk?  
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?  
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?  
5. All wrist strap or heel strap checkers calibration up to date?  
Note: *50V for Blue LED.  
Device Handling  
1. Every ESDS items identified by EIA-471 labels on item or packaging?  
2. All ESDS items completely inside properly closed static-shielding containers when not at  
static-safe workstation?  
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?  
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?  
Others  
1. Audit result reported to entity ESD control coordinator?  
2. Corrective action from previous audits completed?  
3. Are audit records complete and on file?  
Part No. : LTSN-C190QF  
BNS-OD-C131/A4  
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