MHS [LITTELFUSE]
Multilayer High Speed Transient Voltage Surge Suppressor; 多层高速瞬态电压浪涌抑制器
| 型号： | MHS |
| 厂家： | 
LITTELFUSE |
| 描述： | Multilayer High Speed Transient Voltage Surge Suppressor |
| 文件： | 总4页 (文件大小：306K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
The Multilayer High-Speed MHS Series is a very-low capacitance
extension to the Littelfuse ML family of Transient Voltage Surge
Suppression devices available in an 0402 and 0603-size surface
mount chip.
The MHS series provides protection from ESD and EFT in high-speed
data-line and other high frequency applications. The low capacitance of
the MHS Series permits usage in analog or digital circuits where it will
not attenuate or distort the desired signal or data.
Their small size is ideal for high-density printed circuit boards, being
typically applied to protect intergrated circuits and other sensitive
components. They are particularly well suited to suppress ESD events
including those specified in IEC 61000-4-2 or other standards used for
ElectroMagnetic Compliance (EMC) testing.
The MHS series is manufactured from semiconducting ceramics and is
supplied in a leadless, surface mount package. The MHS Series is also
compatible with modern reflow and wave soldering processes.
Littelfuse Inc. manufactures other Multilayer Varistor Series products,
see the ML, MLE, MLN and AUML series data sheets.
Features
• 3pF & 12pF Capacitance Versions Suitable for High Speed
Data-Rate Lines
• ESD Rated to IEC 61000-4-2 (Level 4)
• EFT/B Rated to IEC 61000-4-4 (Level 4)
• Low Leakage Currents
• -55oC to +125oC Operating Temperature Range
• Inherently Bi-directional
Applications
• Data, Diagnostic I/O Ports
• Universal Serial Bus (USB)
• Video & Audio Ports
• Portable/Hand-Held Products
• Mobile Communications
• Computer/DSP Products
• Industrial Instruments Including Medical
Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table.
MHS SERIES
UNITS
Continuous:
Steady State Applied Voltage: DC Voltage Range (V
):V0402/0603MHS03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 42
V0402/0603MHS12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤ 18
Operating Ambient Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
V
V
OC
OC
M(DC)
A
Storage Temperature Range (T
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
STG
1
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Device Ratings and Specifications
MAX RATINGS
PERFORMANCE SPECIFICATIONS (25°C)
(125°C)
MAXIMUM NON-
REPETITIVE
SURGE ENERGY
(10/1000µS)
MAXIMUM
ESD CLAMP
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM LEAKAGE CURRENT AT
SPECIFIED DC VOLTAGE
TYPICAL
CAPACITANCE
AT 1MHz
TYPICAL
INDUCTANCE
(from Impedance
Analysis)
(NOTE 1)
AT 1A (8X20µs)
(1V p-p)
(Note 2)
8kV
(Note 3)
15kV
3.5V
5.5V
9V
(NOTE 4)
C
15V
CONTACT
AIR
PART
NUMBER
L
WTM
(J)
Clamp Clamp
P
IL
IL
IL
(Vc)
(V)
(V)
(µA)
(nH)
(µA)
(µA)
(µA)
(pF)
0.15
0.15
V0402MHS03
V0603MHS03
0.010
0.010
110
110
300
300
400
400
0.1
0.1
0.25
0.25
0.50
0.50
3
3
<1.0
<1.0
0.15
0.15
V0402MHS12
V0603MHS12
0.025
0.025
55
55
125
125
160
160
0.1
0.1
1.00
1.00
5.00
5.00
12
12
<1.0
<1.0
NOTES:
1.
2.
3.
4.
Tested to IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
Direct discharge to device terminals (IEC preferred test method).
Corona discharge through air (represents actual ESD event).
Capacitance may be customized, contact your Littelfuse Sales Representative.
Temperature De-rating
For applications exceeding 125oC ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
60
50
40
30
20
V0402MHS03
V0603MHS03
100
80
60
40
20
0
V0402MHS12
V0603MHS12
10
1
10
1000
100
10000
CURRENT (A)
-55
50 60
70
80
90 100 110 120 130 140 150
o
FIGURE 3. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
AMBIENTTEMPERATURE ( C)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
30
25
0
20
V0402MHS12
V0603MHS12
-10
V0402MHS03
V0603MHS03
15
25o
85o
125o
10
-20
-30
5
0
0.0001
0.001
0.01
0.1
1
10
1000
100
10000
CURRENT (mA)
FREQUENCY (MHz)
FIGURE 2: STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
FIGURE 4. INSERTION LOSS (S21) CHARACTERISTICS
2
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Soldering Recommendations
The principal techniques used for the soldering of components in
surface mount technology are infared (IR) re-flow, vapour phase re-flow
and wave soldering. Typical profiles are shown in Figures 5, 6 and 7.
When wave soldering, the MHS suppressor is attached to the circuit
board by means of an adhesive. The assembly is then placed on a
conveyor and run through the soldering process to contact the wave.
With IR and vapour phase re-flow, the device is placed in a solder paste
on a substrate. As the solder paste is heated, it re-flows and solders the
unit to the board.
The recommended solder for the MHS suppressor is a 63/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402-size devices,
IR reflow is recommended.
6.
When using a re-flow process, care should be taken to ensure that the
MHS chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating within 100 degrees of the solder’s peak
temperature is essentail to minimize thermal shock. Examples of the sol-
dering conditions for the MHS suppressor are given in the tables below.
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually to less than
50oC before cleaning.
7.
Recommended Pad Outline
5.
TABLE 1: PAD LAYOUT DIMENSIONS
C
DIMENSION
A
B
mm
in
mm
mm
0.067 0.510
0.760
in
in
0402 1.70
0603 2.54
0.024
0.035
0.020
0.030
0.610
0.890
0.100
3
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Ordering Information
Multilayer High Speed - MHS Series
Mechanical Dimensions
V
0402 MHS
03
W
H
E
DEVICE FAMILY
PACKING OPTIONS
Littelfuse TVSS Device
H: 7in (178mm) Diameter Reel (Note)
END TERMINATION OPTION
D
DEVICE SIZE
i.e. 40Mil x 20Mil
(1.0mm x 0.5mm)
L
No Letter:
W: Ag/Pd
Ag/Pt (Standard)
W
N: Nickel Barrier termination subject to availibility.
SERIES DESIGNATOR
Multilayer Hi-Speed
Please contact a Littelfuse sales representative
CAPACITANCE DESIGNATION
03 = 3PF
12 = 12PF
DEVICE DIMENSIONS
0402 SIZE
MM
0603 SIZE
MM
DIMENSION
INCH
INCH
Standard Shipping Quantities
D Max.
0.024
0.60
0.035
0.9
13 IN REEL
E
L
0.25±0.15
0.10±0.006
0.4±0.2
1.6±1.5
0.8±1.5
0.015±0.008
0.063±0.006
0.032±0.006
SIZE
0402
0603
7 INCH REEL ("H" OPTION)
"T" OPTION
0.039±0.004 1.00±0.10
0.020±0.004 0.50±0.10
10,000
2,500
––
W
10,000
Tape and Reel Specifications
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
SYMBOL
DESCRIPTION
DIMENSIONS IN MILLIMETERS
Dependant on chip size to minimize rotation
Dependant on chip size to minimize rotation
A
B
K
Width of Cavity
Length of Cavity
Depth of Cavity
Width of Tape
0
0
0
Dependant on chip size to minimize rotation
W
F
8 ±0.2
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers and Tape Edge
Distance Between Cavity Center
3.5±0.05
1.75±0.1
2±0.05
E
1
P
P
P
1
2
0
Axial Drive Distance Between Drive Hole Centers & Cavity Hole Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
2 ±0.1
4 ±0.1
D
D
1.55 ±0.05
0.61
0
1
Nominal Paper Thickness
T
Top & Bottom Tape Thickness
0.10 Max
1
PRODUCT
IDENTIFYING
LABEL
D
P
0
0
P
EMBOSSED PAPER CARRIER
2
T
E
F
W
B
0
8mm
NOMINAL
TOP TAPE
P
A
0
1
178mm
t
1
DIA. REEL
4
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