MICROSMD380LR-2 [LITTELFUSE]

PTC RESET FUSE 6V 3.8A 1206;


型号：	MICROSMD380LR-2
厂家：	LITTELFUSE
描述：	PTC RESET FUSE 6V 3.8A 1206
文件：	总7页 (文件大小：579K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

POLYSWITCH RESETTABLE DEVICES

Low Resistivity SMD Devices

The low resistivity SMD (surface-mount device) series

is well suited to space-constrained mobile applications.

The devices can help provide both overcurrent and

overtemperature protection for battery pack PCMs

(protection circuit modules) used in compact consumer

devices such as smartphones and MP3/MP4 media

players. In particular, the low resistivity SMD series helps

battery pack suppliers achieve their design goals and

simplify their installation methods.

The low resistivity SMD series comprises eleven devices.

In the model number descriptions, the “micro” prefix

refers to the 1210 form factor and the “nano” prefix refers

to the 1206 form factor.

BENEFITS

APPLICATIONS

• Helps save board space and power consumption,

and therefore costs, in space-constrained mobile

electronics

• Mobile and smart phones

• Media players (MP3/MP4)

• Digital still and video cameras

• Mini notebooks

• Are more compact in comparison with similar

offerings and are available in an industry-standard

form factor

• Tablets

• Can be assembled with a reflowable soldering

technique, as opposed to the spot welding process

required by many other components

• Maximum electrical rating: Voltage 6V_DCand short

circuit current 50A

• Industry-standard form factor of 1210

(3.0mmx2.54mm, or 0.12inx0.10in), or 1206

(3.0mmx1.52mm; or 0.12inx0.060in)

• Useful for an operating current of 2A and above

• Useful for and packaged for surface mounting on

the PCB

FEATURES

• Agency recognition: UL, CSA, TÜV

• Small footprint

• RoHS compliant

• Halogen free

≥

(refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm)

• Fast time-to-trip

• Current ratings from 1.75 to 5.0A

RoHS Compliant, ELV Compliant

Halogen Free

147

PolySwitch Resettable Devices

Radial-Leaded Devices

Table LR1 —Thermal Derating [Hold Current (A) at AmbientTemperature (°C)]

Maximum AmbientTemperature

Part

Number

-40ºC

-20ºC

0ºC

20ºC

25ºC

40ºC

50ºC

60ºC

70ºC

80ºC

85ºC

nanoSMDLR Series

Size 3216mm/1206mils

nanoSMD175LR

nanoSMD200LR

nanoSMD270LR

nanoSMD350LR

nanoSMD500LR

3.00

3.60

4.00

5.50

7.40

2.60

3.20

3.50

4.80

6.60

2.20

2.80

3.00

4.00

6.00

1.75

2.00

2.70

3.50

5.00

1.70

1.90

2.60

3.30

4.90

1.40

1.80

2.20

2.70

4.60

1.20

1.60

2.00

2.30

4.20

1.00

1.40

1.60

1.90

3.70

0.80

1.20

1.40

1.60

3.30

0.60

1.00

1.20

1.40

3.00

0.50

0.80

1.10

1.30

2.80

microSMDLR Series

Size 3225mm/1210mils

microSMD190LR

microSMD200LR

microSMD250LR

microSMD350LR

microSMD450LR

3.40

3.50

4.40

5.40

7.00

2.90

3.00

3.80

4.75

6.20

2.40

2.50

3.20

4.00

5.50

1.90

2.00

2.50

3.50

4.50

1.80

1.90

2.40

3.20

4.40

1.40

1.50

1.90

2.70

3.80

1.15

1.25

1.60

2.40

3.50

0.90

1.00

1.30

2.00

3.20

0.65

0.75

1.00

1.70

2.75

0.40

0.50

0.65

1.35

2.35

0.28

0.38

0.50

1.20

2.16

Figure LR1 —Thermal Derating Curve

Figure LR1

Table LR2 — Electrical Characteristics for low resistivity SMD Devices at

RoomTemperature

I_H

I_T

V_MAX

I_MAX

(A)

P_{D MAX}

(W)

MaxTime-to-Trip

R_MIN

R_1MAX

Figure for

Dimensions

Part

Number

(A)

(V_DC

)

(A)

(S)

(Ω)

nanoSMDLR Series

Size 3216mm/1206mils

nanoSMD175LR

nanoSMD200LR

nanoSMD270LR

nanoSMD350LR

nanoSMD500LR

1.75

2.00

2.70

3.50

5.00

6.00

6.30

10.00

1.00

9.50

8.00

25.00

1.00

3.00

5.00

2.00

0.008

0.006

0.005

0.004

0.002

0.034

0.024

0.018

0.008

LR2

microSMDLR Series

Size 3225mm/1210mils

microSMD190LR

microSMD200LR

microSMD250LR

microSMD350LR

microSMD450LR

1.90

2.00

2.50

3.50

4.50

4.90

5.00

5.20

9.00

1.00

9.50

25.00

4.00

5.00

10.00

2.00

0.006

0.005

0.0025

0.002

0.021

0.018

0.011

0.008

LR3

LR2

LR3

148

Halogen Free

RoHS Compliant, ELV Compliant

PolySwitch Resettable Devices

Radial-Leaded Devices

Figures LR2-LR3 — Dimensions Figures

Figure LR2

Figure LR3

Table LR3 — Dimensions in Millimeters (Inches)

Part

Number

Figure

Min

Max

Min

Max

Min

Max

Min

Max

Min

nanoSMDLR Series

Size 3216mm/1206mils

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

1.37

(0.054)

1.85

(0.073)

0.25

(0.010)

0.75

(0.030)

nanoSMD175LR

nanoSMD200LR

nanoSMD270LR

nanoSMD350LR

nanoSMD500LR

—

LR2

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

1.37

(0.054)

1.85

(0.073)

0.25

(0.010)

0.75

(0.030)

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

1.37

(0.054)

1.85

(0.073)

0.25

(0.010)

0.75

(0.030)

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

1.37

(0.054)

1.85

(0.073)

0.25

(0.010)

0.75

(0.030)

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

0.80

(0.031)

1.37

(0.054)

1.85

(0.073)

0.25

(0.010)

0.75

(0.030)

microSMDLR Series

Size 3225mm/1210mils

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

2.35

(0.092)

2.80

(0.110)

0.25

(0.010)

0.75

(0.030)

0.076

(0.003)

microSMD190LR

microSMD200LR

microSMD250LR

microSMD350LR

microSMD450LR

LR3

LR2

LR3

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

2.35

(0.092)

2.80

(0.110)

0.25

(0.010)

0.75

(0.030)

0.076

(0.003)

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

2.35

(0.092)

2.80

(0.110)

0.25

(0.010)

0.75

(0.030)

0.076

(0.003)

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

2.35

(0.092)

2.80

(0.110)

0.25

(0.010)

0.75

(0.030)

—

3.00

(0.118)

3.43

(0.135)

0.50

(0.019)

1.00

(0.039)

2.35

(0.092)

2.80

(0.110)

0.25

(0.010)

0.75

(0.030)

0.076

(0.003)

Table LR4 — Physical Characteristics Operating Temperature Range -40°C to 85°C

Physical Characteristics

Terminal Pad Material

Gold with Nickel Underplate

Soldering Characteristics

Solder Heat Withstand

ANSI/J-STD-002 Category 3

per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A

per IEC 695-2-2 Needle Flame Test for 20 sec.

Flammability Resistance

Recommended Storage Conditions

40°C max, 70% R.H. max; Devices May Not Meet Speciﬁed Ratings if Storage Conditions

Are Exceeded.

RoHS Compliant, ELV Compliant

Halogen Free

149

PolySwitch Resettable Devices

Radial-Leaded Devices

Table LR5 — Packaging and Marking Information

Recommended Pad Layout Figures [mm (in)]

Part

Number

Tape & Reel

Quantity

Standard

Package

Part

Marking

Dimension

A (Nom)

Dimension

B (Nom)

Dimension

C (Nom)

Agency

Recognition

nanoSMDLR Series

Size 3216mm/1206mils

nanoSMD175LR

nanoSMD200LR

nanoSMD270LR

nanoSMD350LR

nanoSMD500LR

3,000

15,000

1.75 (0.069)

1.10 (0.043)

2.00 (0.079)

UL, CSA, TÜV

UL, CSA

UL, CSA, TÜV

microSMDLR Series

Size 3225mm/1210mils

microSMD190LR

microSMD200LR

microSMD250LR

microSMD350LR

microSMD450LR

3,000

15,000

None

2.65 (0.104)

1.00 (0.039)

1.10 (0.043)

1.00 (0.039)

2.00 (0.079)

UL, CSA

Figure LR4 — Recommended Pad Layout

Agency Recognition

File # E74889 for all low resistivity SMD Devices

File # CA78165 for all low resistivity SMD Devices

CSA

TÜV

Certiﬁcate Number Available Upon Request (Certiﬁed to IEC 60730-1)

150

Halogen Free

RoHS Compliant, ELV Compliant

PolySwitch Resettable Devices

Radial-Leaded Devices

Solder Reflow Recommendation

Classiﬁcation Reﬂow Proﬁles

Proﬁle Feature

Pb-Free Assembly

Figure LR5

Average Ramp-up Rate (Ts_MAXtoTp)

Preheat

3°C/s max

• Temperature min (Ts_MIN

• Temperature max (Ts_MAX

• Time (ts_MINto ts_MAX

)

150°C

)

200°C

60-120s

)

Time Maintained Above:

• Temperature (T_L)

217°C

• Time (t_L)

60-150s

260°C

Peak/ClassiﬁcationTemperature (Tp)

Time within 5°C of Actual PeakTemperature

Time (tp)

30s max

Ramp-down Rate

2°C/s max

8 mins max

Time 25°C to PeakTemperature

Note: All temperatures refer to topside of the package measured on the package

body surface.

Solder Reflow

•

Recommended reﬂow methods:

- IR

- Hot air

- Nitrogen

•

Recommended maximum paste thickness: 0.25mm (0.010 inch)

Devices can be cleaned using standard methods and aqueous solvents.

Experience has shown the optimum conditions for forming acceptable solder ﬁllets occur when a reasonable amount of solder paste is placed

underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.

•

Customer should validate that the solder paste amount and reﬂow recommendations meet its application.

We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch

devices. It is possible that raised features could negatively impact solderability performance of our devices.

Table LR6 —Tape and Reel Specifications in Millimeters

nanoSMDLR Series

EIA 481-1

microSMDLR Series

EIA 481-1

Description

8.0 0.30

4.0 0.10

2.0 0.05

1.95 0.10

3.50 +0.1/-0.08

4.35

8.0 0.30

4.0 0.10

2.0 0.05

2.9 0.10

3.55 0.10

4.35

P₀

P₁

P₂

A₀

B₀

B₁^mAx

D₀

1.55 0.05

3.50 0.05

1.75 0.10

6.25

1.55 0.05

3.50 0.05

1.75 0.10

6.25

E₁

E₂^min

T mAx

T₁^mAx

K₀

0.3

0.1

0.89 0.10

185

1.27 0.10

185

A mAx

n min

W₁

12.4 + 2.0/-.00

14.4

12.4 + 2.0/-.00

14.4

W₂^mAx

RoHS Compliant, ELV Compliant

Halogen Free

151

PolySwitch Resettable Devices

Radial-Leaded Devices

Figure LR6 — EIA ReferencedTaped Component Dimensions

Figure LR7 — EIA Referenced Reel Dimensions

152

Halogen Free

RoHS Compliant, ELV Compliant

PolySwitch Resettable Devices

Radial-Leaded Devices

Part Numbering System

Warning :

• Users should independently evaluate the suitability of and test each product selected for their own application.

• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and ﬂame.

• These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used

when repeated fault conditions or prolonged trip events are anticipated.

•

Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical

procedures for electronic components.

• PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example

in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.

• Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device.

Notice:

Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own

applications. Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, military, aerospace, medical, life-saving, life-sustaining

or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may

result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall

be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising

out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to

Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse.

RoHS Compliant, ELV Compliant

Halogen Free

153

MICROSMD380LR-2 [LITTELFUSE]

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