SG350 [LITTELFUSE]
Gas Discharge Tube (GDT) Products;
| 型号： | SG350 |
| 厂家： | 
LITTELFUSE |
| 描述： | Gas Discharge Tube (GDT) Products |
| 文件： | 总4页 (文件大小：750K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Gas DischargeTube (GDT) Products
SG Series
SG Series
Description
Littelfuse SG series GDT offers high surge ratings
in a miniature package. It’s designed for surface
mounting on PCB with small size 4.5x3.2x2.7mm.
Low insertion loss is perfectly suited to broadband
equipment applications. The capacitance does not vary
with voltage, and will not cause operational problems
with ADSL2+, where capacitance variation acrossTip
and Ring is undesirable. These devices are extremely
robust and are able to divert a 1000A pulse without
destruction.
Features
Agency Approvals
•ꢀRoHSꢀcompliantꢀandꢀ
Lead-free
•ꢀUltraꢀsmallꢀdevicesꢀ
offered in a variety of
mounting lead forms
AGENCY
AGENCY FILE NUMBER
•ꢀGHzꢀworkingꢀfrequencyꢀ
E128662
•ꢀNon-Radioactive
•ꢀExcellentꢀstabilityꢀonꢀ
multiple pulse duty cycle •ꢀLowꢀcapacitanceꢀ(<1pF)
•ꢀExcellentꢀresponseꢀtoꢀ
fast rising transients.
•ꢀVoltageꢀRangesꢀ75Vꢀtoꢀ
600V
2 Electrode GDT Graphical Symbol
•ꢀUltraꢀLowꢀInsertionꢀLoss •ꢀULꢀrecognizedꢀ
•ꢀ1-2KAꢀsurgeꢀcapabilityꢀ
tested with 8/20μS
pulseꢀasꢀdefinedꢀbyꢀIECꢀ
61000-4-5
•ꢀConformsꢀtoꢀITU-TꢀK12,ꢀ
IECꢀ1000-4-5
•ꢀSquareꢀOutline
Applications
•ꢀBroadbandꢀequipment
• Communication
equipment
•ꢀADSLꢀequipment,ꢀ
including ADSL2+
•ꢀCATVꢀequipment
•ꢀTestꢀequipment
•ꢀDataꢀlines
•ꢀXDSLꢀequipment
•ꢀSatelliteꢀandꢀCATVꢀ
equipment
•ꢀPowerꢀsupplies
•ꢀGeneralꢀtelecomꢀ
equipment
•ꢀTelecomꢀSLICꢀ
protection
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
Gas DischargeTube (GDT) Products
SG Series
Electrical Characteristics
Device Specificationsꢀ(atꢀ25°C)
Life Ratings
DC Breakdown Impulse
Impulse Insulation Capaci-
Arc
Glow
to Arc
Transition
Current
Glow
Voltage
Nominal Nominal Nominal
in Volts
Breakdown Breakdown Resistance tance Voltage
AC Impulse Impulse
in Volts
In Volts
Discharge Discharge Discharge
(@100V/s)
(@1MHz)
(@1A)
Current
Current
(x10ꢀ@8/20µs) (10/1000µsꢀꢀ
(@100V/µs)
(@1ꢀKv/µsec)
Current
Part
(x10ꢀ@50Hz)
Number
MIN TYP MAX
MAX
500
500
500
650
700
580
750
600
800
800
650
680
950
1100
MIN
MAX
100ꢀcycles)
SG75
52 75
98
650
600
600
800
850
650
900
700
950
1000
750
750
1050
1200
SG90
63 90 117
105 150 195
172 230 288
225 300 375
2kA
~10ꢀV
~1.0 A
~60ꢀV
SG150
SG230
SG300
2 A
<1ꢀpf
~12ꢀV
~20ꢀV
~0.5 A
~0.8 A
~90ꢀV
~140ꢀV
~90ꢀV
~140ꢀV
~90ꢀV
~60ꢀV
>1GΩ
SG300Q 210 300 390
SG350 263 350 437
SG350Q 263 350 437
NA*
2 A
(atꢀ50VDC)
10 A
<0.8ꢀpf ~12ꢀV
~10ꢀV
~0.5 A
NA*
2 A
SG400
SG420
300 400 500
315 420 525
1kA
2 A
SG420Q 315 420 525
SG450Q 370 450 550
SG500Q 400 500 600
SG600Q 450 600 750
<1ꢀpf
~20ꢀV
~20ꢀV
<1.0ꢀA
NA*
1 A
>1GΩ
(atꢀ
100VDC)
~140ꢀV
<0.5ꢀpf ~16ꢀV
<1ꢀpf ~20ꢀV
~0.1 A
2 A
<0.5ꢀA
*ꢀSpecificationꢀisꢀnotꢀapplicableꢀforꢀquickꢀresponseꢀ(SGxxxQ)ꢀversionꢀofꢀproduct
Product Characteristics
Voltage vs.Time Characteristic
DeviceꢀTinꢀPlatedꢀ17.5±12.5ꢀMicronsꢀ
Construction Ceramic Insulator.
Max dynamic breakover
voltage
Materials
Storage and
Operational
Temperature
-40ꢀtoꢀ+90ꢀ°C
Typical Insertion Loss
Hold-over voltage
ꢀꢀꢀꢀꢀ@ꢀ1.0ꢀGHzꢀ=ꢀ0.01ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ1.4GHzꢀ=ꢀ0.1ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ1.8ꢀGHzꢀ=ꢀ0.53ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ2.1ꢀGHzꢀ=ꢀ0.81ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ2.45ꢀGHz=ꢀ1ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ2.8ꢀGHzꢀ=ꢀ1.2ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ3.1ꢀGHzꢀ=ꢀ1.5ꢀdB
ꢀꢀꢀꢀꢀ@ꢀ3.5ꢀGHzꢀ=ꢀ2.1ꢀdBꢀ
On-State voltage
0
200
400
600
800
1000
1200
Time (ns)
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
Gas DischargeTube (GDT) Products
SG Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
tP
Reflow Condition
-Temperature Min (Ts(min)
Pbꢀ–ꢀFreeꢀassembly
TP
Critical Zone
L to TP
Ramp-up
T
)
150°Cꢀ
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
)
200°C
tL
-Time (Min to Max) (ts)
60 – 180 secs
Ramp-down
Average ramp up rate (LiquidusTemp
(TL) to peak
Preheat
3°C/secondꢀmax
TS(min)
tS
TS(max) toTL - Ramp-up Rate
5°C/secondꢀmax
217°Cꢀ
-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
(t 25ºC to peak)
-Temperature (tL)
60 – 150 seconds
260+0/-5ꢀ°C
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Ramp-down Rate
6°C/secondꢀmax
8ꢀminutesꢀMax.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Device Marking
Device Dimensions
Production
Year Code
(last digit)
Type
Code
Dimensions in Millimeters.
3.2 +/- 0.3
A3A
Production
Month Code
0.5 +/- 0.1
2.7 +/- 0.3
4.5 +/- 0.3
Type Code
Month Code
A
B
C
D
E
F
SG75
A
January
February
March
April
SG90
B
C
D
E
F
G
H
I
5.2
2.8
SG150
4
SG230
SG300
SG300Q
SG350
SG350Q
SG400
SG420
SG420Q
SG450Q
SG500Q
SG600Q
May
June
G
H
I
July
August
Recommended Soldering Pad Layout
September
October
J
J
K
L
K
L
November
December
M
N
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
Gas DischargeTube (GDT) Products
SG Series
Part Numbering System and Ordering Information
Tape and Reel Dimensions (IECꢀ60286-3,ꢀdimensionꢀinꢀmm)
Tape Specifications
SG xxx Q
IEC 60286-3
section
B-B
Dimensions in mm
Series
Square GDT
section
A-A
Breakdown Voltage
2
4
Ø 1.55
Ø 1.6
0.1
0.1
0.10
0.05
0.4
0.05
75 = 75V
90 = 90V
A
150 = 150V
230 = 230V
300 = 300V
350 = 350V
400 = 400V
420 = 420V
450 = 450V
500 = 500V
600 = 600V
5°
B
B
3.65
3
0.1
8
0.1
0.1
A
R0.5 typical
SMD-Tape has to withstand
a minimum Force of
F > 20 N / pocket
2 Kg / pocket
minimum vertical load
(minimum checking
quantity:10 pockets)
Device Option Code
(Blank) = Standard device
Q
= Quick Response Version
(300V, 350V, 420V, 450V,
500V, 600V only)
Reel Specifications
IEC 60286-3
Packaging
Dimensions in mm
Quantity and Packaging
Description
Part Number and DeviceType
SGxxx Surface mount
2000pcs/reel in tape and reel
1.5 min.
12.8 min.
R0.75
18.4 max.
12.4 +2/-0
11.9 min.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
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