SP1014-01WTG [LITTELFUSE]
TVS DIODE 5V 11V 2FLIPCHIP;
| 型号： | SP1014-01WTG |
| 厂家： | 
LITTELFUSE |
| 描述： | TVS DIODE 5V 11V 2FLIPCHIP PC 电视 |
| 文件： | 总4页 (文件大小：773K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TVS Diode Array (SPA® Diodes)
General Purpose Protection - SP1014 Series
RoHS
GREEN
Pb
SP1014 Series 6pF 12kV Bidirectional Discrete TVS
6/10/2020
ESU270-51
SP1021-01WTG
Description
The SP1014 includes back-to-back Zener diodes which
provides protection for electronic equipment that may
experience destructive electrostatic discharges (ESD). It
measures 0.52 x 0.27mm permitting use of the standard
0201 footprints, but offering a 30% reduction in occupied
board space. The SP1014 can safely absorb repetitive ESD
strikes above the maximum level specified in IEC 61000-4-
2 international standard (Level 4, ±±kꢀ contact discharge)
without performance degradation, and the back-to-back
configuration provides symmetrical standoff voltage which
makes the component appropriate for use when AC signals
are present on the data or signal line.
Pinout
Features
• ESD, IEC 61000-4-2,
±12kꢀ contact, ±15kꢀ air
• Low capacitance of 6pF
(@ ꢀR=0ꢀ)
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Low leakage current of
5nA at 1.5ꢀ
1
2
• Lightning, IEC 61000-
4-5 2nd edition, 2A
(tP=±/20μs)
• RoHS compliant,
Halogen-free, and Lead-
free
Pin1
Pin2
Note: Drawing not to scale
Functional Block Diagram
Applications
• Mobile Phones
• Smart Phones
•Tablets
• Digital Cameras
• MP3/PMP
• Portable Navigation
Devices
2
1
• WearableTechnology
• Portable Medical
• Point of SaleTerminals
Additional Information
Datasheet
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
1
Revision: 09/16/20
TVS Diode Array (SPA® Diodes)
General Purpose Protection - SP1014 Series
Absolute Maximum Ratings
Symbol
Parameter
ꢀalue
2.0 1
Units
A
IPP
Peak Current (tp=±/20μs)
OperatingTemperature
TOP
-40 to 125
°C
TSTOR
StorageTemperature
-55 to 150
°C
Notes:
1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
-55 to 150
150
Units
°C
StorageTemperature Range
Maximum JunctionTemperature
Maximum LeadTemperature (Soldering 20-40s)
°C
260
°C
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
ꢀRWM
Test Conditions
Min
7. 0
Typ
Max
5.0
Units
ꢀ
Reverse Standoff ꢀoltage
IR≤1μA with 1 pin to GND
IT=1mA with 1 pin at GND
ꢀR=1.5ꢀ with 1 pin at GND1
ꢀR=3.3ꢀ with 1 pin at GND1
ꢀR=5ꢀ with 1 pin at GND1
IPP=1A, tp=±/20µs, Fwd
Reverse Breakdown ꢀoltage
ꢀBR
ꢀ
5
nA
nA
nA
ꢀ
Leakage Current
ILEAK
10
100
10
11
Clamp ꢀoltage1
ꢀC
RDYN
ꢀESD
CD
IPP=2A, tp=±/20µs, Fwd
TLP tp=100ns, 1 Pin to GND
IEC 61000-4-2 (Contact Discharge)
IEC 61000-4-2 (Air Discharge)
Reverse Bias=0ꢀ, f=1MHz
ꢀ
Dynamic Resistance2
ESD Withstand ꢀoltage1
Diode Capacitance1
0.5
Ω
±12
±15
kꢀ
kꢀ
pF
6
7
Note:
1Parameter is guaranteed by design and/or component characterization.
2Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and ꢀTLP averaging window: star t1=70ns to end t2=±0ns
8/20μS PulseWaveform
Capacitance vs. Reverse Bias (1 Pin to GND)
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
15.0
10.0
5.0
0.0
5.0
10.0
15.0
20.0
25.0
30.0
0.0
Time (μs)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
2
Revision: 09/16/20
TVS Diode Array (SPA® Diodes)
General Purpose Protection - SP1014 Series
Transmission Line Pulsing(TLP) Plot(1 Pin to GND)
20
18
16
14
12
10
8
6
4
2
0
0
5
10
15
20
25
30
TLP Volts (V)
Soldering Parameters
Reflow Condition
Pb – Free assembly
tP
TP
Critical Zone
TL to TP
-Temperature Min (Ts(min)
)
150°C
Ramp-up
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
-Time (min to max) (ts)
)
200°C
tL
60 – 1±0 secs
Ramp-down
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
3°C/second max
217°C
25
-Temperature (TL) (Liquidus)
Reflow
time to peak temperature
Time
-Temperature (tL)
60 – 150 seconds
260+0/-5 °C
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
± minutes Max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Part Marking System
Part Numbering System
–
SP 1014 01 W T G
TVS Diode Arrays
G= Green
®
(SPA Diodes)
T= Tape & Reel
Series
Package
W: Flipchip
Number of
Channels
Ordering Information
Part Number
Package
Flipchip
Marking
Min. Order Qty.
15000
SP1014-01WTG
•
•
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
3
Revision: 09/16/20
TVS Diode Array (SPA® Diodes)
General Purpose Protection - SP1014 Series
Package Dimensions — Flipchip
TOP VIEW
BOTTOM VIEW
0.20
0.20
0.01
0.16
F
E
0.25
G
0.14
D
Stencil opening
(0.20x0.16)
Solder Pad
(0.20x0.14)
Recommended Solder Pad Footprint
and Stencil opening
A2
A
Thickness of Stencil opening is 0.08mm
*Sizes in mm
A1
Flipchip
Min
Symbol
Millimeters
Typ
Inches
Typ
Min
0.1±3
0.00±
0.175
0.2±0
0.530
-
Max
0.239
0.014
0.225
0.300
0.550
-
Max
A
A1
A2
D
0.211
0.0072 0.00±3 0.0094
0.0003 0.0004 0.0006
0.0069 0.0079 0.00±9
0.0110 0.0114 0.011±
0.0209 0.0213 0.0217
0.011
0.200
0.290
0.540
0.100
0.200
E
F
-
-
0.0039
0.0079
-
-
G
-
-
Embossed CarrierTape & Reel Specification — Flipchip
Symbol
Millimeters
A0
B0
K0
F
0.34+/-0.03
0.60+/-0.03
0.25 + 0.03
3.50 +/- 0.05
2.00+/-0.10
±.00+/-0.10
P1
W
©2018 Littelfuse, Inc.
Specifications are subject to change without notice.
4
Revision: 09/16/20
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