SP1312-01WTG [LITTELFUSE]

Trans Voltage Suppressor Diode,;
SP1312-01WTG
型号: SP1312-01WTG
厂家: LITTELFUSE    LITTELFUSE
描述:

Trans Voltage Suppressor Diode,

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TVS Diode Arrays (SPA® Diodes)  
General Purpose ESD Protection - 
SP1312  
RoHS  
GREEN  
Pb  
SP1312 11pF 24kV Bidirectional Discrete TVS  
Description  
The SP1312 bidirectionalTVS is fabricated in a proprietary  
silicon avalanche technology. These diodes provide a high  
ESD (electrostatic discharge) protection level for electronic  
equipment. The SP1312TVS can safely absorb repetitive  
ESD strikes of 2ꢀ kV (contact and air discharge as defined  
in IEC 61000-ꢀ-2) without any performance degradation.  
Additionally, eachTVS can safely dissipate a 3A 8/20 surge  
event as defined in IEC 61000-ꢀ-5 2nd Edition.  
Pinout  
Features  
• ESD, IEC 61000-4-2,  
• Low leakage current of  
2ꢀkV contact, 30kV air  
0.02μA(TYP) at 12V  
• EFT, IEC 61000-4-4, 40A  
• Industries smallest ESD  
(5/50ns)  
footprint available (01005)  
1
2
• Lightning, 3A (8/20 as  
defined in IEC 61000-ꢀ-5  
2nd edition)  
• Halogen free, lead free  
and RoHS compliant  
Note: Drawing not to scale  
• Low capacitance of 11pF  
(@ VR=0V)  
Functional Block Diagram  
Applications  
• Mobile Phones  
• Smart Phones  
• Camcorders  
• WearableTechnology  
• Portable Navigation  
Components  
2
1
Tablets  
• Portable Medical  
• Digital Cameras  
• Point of SaleTerminals  
Life Support Note:  
Not Intended for Use in Life Support or Life Saving Applications  
The products shown herein are not designed for use in life sustaining or life saving  
applications unless otherwise expressly indicated.  
©2018 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 06/06/18  
TVS Diode Arrays (SPA® Diodes)  
General Purpose ESD Protection -
SP1312  
Absolute Maximum Ratings  
Symbol  
Parameter  
Value  
3 1  
Units  
A
IPP  
Peak Current (tp=8/20μs)  
OperatingTemperature  
TOP  
-ꢀ0 to 125  
°C  
TSTOR  
StorageTemperature  
-55 to 150  
°C  
Notes:  
1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and  
operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Electrical Characteristics (TOP=25ºC)  
Parameter  
Symbol  
VRWM  
VBR  
Test Conditions  
IR≤1μA  
Min  
Typ  
Max  
Units  
V
Reverse Standoff Voltage  
Breakdown Voltage  
12  
IR=1mA  
13  
15  
V
Reverse Leakage Current  
ILEAK  
VR=12V  
0.02  
18.5  
0.5  
22  
27  
μA  
V
IPP=1A, tp=8/20µs, Fwd  
IPP=3A, tp=8/20µs, Fwd  
Clamp Voltage1  
VC  
RDYN  
VESD  
CD  
22.5  
0.ꢀ8  
V
Dynamic Resistance2  
ESD Withstand Voltage1  
Diode Capacitance1  
TLP, tP=100ns, I/O to I/O  
IEC 61000-ꢀ-2 (Contact Discharge)  
IEC 61000-ꢀ-2 (Air Discharge)  
Reverse Bias=0V  
2ꢀ  
30  
kV  
kV  
pF  
11  
1ꢀ  
Note:  
1 Parameter is guaranteed by design and/or component characterization.  
2Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns  
Clamp voltage vs. IPP for 8/20μsWaveshape  
Capacitance vs. Reverse Bias  
12.0  
25.0  
20.0  
15.0  
10.0  
5.0  
9.0  
6.0  
3.0  
0.0  
0.0  
1
1.5  
2
2.5  
3
0
1
2
3
4
5
6
7
8
9
10 11 12  
Peak Pulse Current-IPP (A)  
Reverse Bias Voltage (V)  
©2018 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 06/06/18  
TVS Diode Arrays (SPA® Diodes)  
General Purpose ESD Protection -
SP1312  
PositiveTransmission Line Pulsing (TLP) Plot  
NegativeTransmission Line Pulsing (TLP) Plot  
40  
35  
30  
25  
20  
15  
10  
5
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
0
-60  
-50  
-40  
-30  
-20  
-10  
0
0
10  
20  
30  
40  
50  
60  
TLP Voltage (V)  
TLP Voltage (V)  
8/20μs PulseWaveform  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
30%  
20%  
10%  
0%  
0.0  
5.0  
10.0  
15.0  
20.0  
25.0  
30.0  
Time (μs)  
Soldering Parameters  
Reflow Condition  
Pb – Free assembly  
tP  
TP  
-Temperature Min (Ts(min)  
)
150°C  
Critical Zone  
T
L
to T
P  
Ramp-up  
Pre Heat -Temperature Max (Ts(max)  
)
200°C  
TL  
TS(max)  
tL  
-Time (min to max) (ts)  
60 – 180 secs  
Average ramp up rate (Liquidus) Temp (TL)  
to peak  
Ramp-down  
3°C/second max  
Preheat  
TS(min)  
TS(max) toTL - Ramp-up Rate  
3°C/second max  
217°C  
tS  
-Temperature (TL) (Liquidus)  
Reflow  
25  
-Temperature (tL)  
60 – 150 seconds  
260+0/-5 °C  
time to peak temperature  
Time  
PeakTemperature (TP)  
Time within 5°C of actual peak  
Temperature (tp)  
20 – ꢀ0 seconds  
Ramp-down Rate  
6°C/second max  
8 minutes Max.  
260°C  
Time 25°C to peakTemperature (TP)  
Do not exceed  
©2018 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 06/06/18  
TVS Diode Arrays (SPA® Diodes)  
General Purpose ESD Protection -
SP1312  
Part Marking System  
Product Characteristics  
Lead Plating  
Tin plating  
Copper bump  
Silicon  
Lead Material  
Substrate material  
UL Recognized compound meeting  
flammability rating V-0  
Flammability  
Ordering Information  
Part Numbering System  
Part Number  
Package  
Min. Order Qty.  
SP 1312 01 W T G  
TVS Diode Arrays  
SP1312-01WTG  
01005 Flipchip  
15000  
G= Green  
®
(SPA Diodes)  
T= Tape & Reel  
Series  
Package  
Number of  
Channels  
W:01005 Flipchip  
Package Dimensions — 01005 Flipchip  
D
e
01005 Flipchip  
Symbol  
Millimeters  
Inches  
Min  
Typ  
0.181  
Max  
Min  
Typ  
Max  
A
A1  
A2  
e
0.168  
0.008  
0.160  
0.194 0.0066 0.0071 0.0076  
0.01ꢀ 0.0003 0.000ꢀ 0.0006  
0.180 0.0063 0.0067 0.0071  
0.0110 BSC  
Pin 1  
P
L1  
0.011  
Top View  
Bottom View  
0.170  
0.280 BSC  
0.230  
0.ꢀ30  
0.130  
E
0.200  
0.ꢀ00  
0.110  
0.180  
0.150  
0.260 0.0079 0.0091 0.0102  
0.ꢀ60 0.0157 0.0169 0.0181  
0.150 0.00ꢀ3 0.0051 0.0059  
0.220 0.0071 0.0079 0.0087  
0.190 0.0059 0.0067 0.0075  
D
F
Side View  
0.15mm  
G
P
0.200  
0.170  
0.15mm  
0.15mm  
0.30mm  
0.30mm  
Recommended soldering pad layout  
Stencil apertures  
Stencil thickness : 80um  
Drawing# : W01-A  
©2018 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 06/06/18  
TVS Diode Arrays (SPA® Diodes)  
General Purpose ESD Protection -
SP1312  
Embossed CarrierTape & Reel Specification — 01005 Flipchip  
,Ref.  
,Ref.  
,Ref.  
Disclaimer Noꢀce - Informaꢀon furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and  
test each product selected for their own applicaꢀons. Liꢁelfuse products are not designed for, and may not be used in, all applicaꢀons.  
Read complete Disclaimer Noꢀce at hꢁp://www.liꢁelfuse.com/disclaimer-electronics.  
©2018 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 06/06/18  

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