V18AUMLA1812NH [LITTELFUSE]
Varistor, 18V, 6J, Surface Mount, CHIP, ROHS COMPLIANT;
| 型号： | V18AUMLA1812NH |
| 厂家： | 
LITTELFUSE |
| 描述： | Varistor, 18V, 6J, Surface Mount, CHIP, ROHS COMPLIANT 电阻器 |
| 文件： | 总9页 (文件大小：61K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AUML Series
Data Sheet
July 1999
File Number 3387.5
Multilayer Surface Mount Automotive
Transient Surge Suppressors
Features
[ /Title
(AUML
Series)
/Sub-
ject
(Multi-
layer
Sur-
• Load Dump Energy Rated per SAE Specification J1113
• Leadless, Surface Mount Chip Form
• “Zero” Lead Inductance
The AUML Series of Multilayer Transient Surge Suppressors
was specifically designed to suppress the destructive
transient voltages found in an automobile. The most
common transient condition results from large inductive
energy discharges. The electronic systems in the
• Variety of Energy Ratings Available
o
• No Temperature Derating up to 125 C Ambient
automobile, e.g. antilock brake systems, direct ignition
systems, engine control, airbag control systems, wiper motor
controls, etc., are susceptible to damage from these voltage
transients and thus require protection. The AUML transient
suppressors have temperature independent suppression
• High Peak Surge Current Capability
face
• Low Profile, Compact Industry Standard Chip Size; (1206,
1210, 1812 and 2220 Sizes)
Mount
Auto-
motive
Tran-
sient
Surge
Sup-
pres-
sors)
/Author
()
/Key-
words
(Harris
Corpo-
ration,
Sup-
o
o
• Inherent Bidirectional Clamping
characteristics affording protection from -55 C to 125 C.
• No Plastic or Epoxy Packaging Assures Better than 94V-0
Flammability Rating
The AUML suppressor is manufactured from semiconducting
ceramics which offer rugged protection and excellent
transient energy absorption in a small package. The devices
are in ceramic leadless chip form, eliminating lead
inductance and assuring fast speed of response to transient
surges. These Suppressors require significantly smaller
space and land pads than silicon TVS diodes, offering
greater circuit board layout flexibility for the designer.
Packaging
AUML SERIES
Also see the Harris ML, MLN and MLE Series of Multilayer
Suppressors.
pres-
sion
Prod-
ucts,
TVS,
Tran-
sient
Sup-
pres-
sion,
Protec-
tion,
Auto-
motive,
Load
Dump,
1-800-4-HARRIS or 407-727-9207 | Copyright © Harris Corporation 1999
5-31
AUML Series
Absolute Maximum Ratings For ratings of individual members of a series, see Device Ratings and Specifications chart
AUML SERIES
UNITS
Continuous:
Steady State Applied Voltage:
DC Voltage Range (V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
V
M(DC)
Transient:
Load Dump Energy, (W ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LD
1.5 to 25
24.5
J
V
Jump Start Capability (5 minutes), (V
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JUMP
o
Operating Ambient Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
-55 to 125
-55 to 150
<0.01
C
A
o
Storage Temperature Range (T
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
STG
C
o
Temperature Coefficient (αv) of Clamping Voltage (V ) at Specified Test Current. . . . . . . . . . . . . .
%/ C
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Device Ratings and Specifications
o
o
MAXIMUM RATINGS (125 C)
SPECIFICATIONS (25 C)
JUMP
MAXIMUM
STANDBY
LEAKAGE
(AT 13VDC)
MAXIMUM CLAMPING
MAXIMUM
CONTINUOUS
DC VOLTAGE
START
VOLTAGE
(5 MIN)
LOAD DUMP
ENERGY
(10 PULSES)
NOMINAL VARISTOR
VOLTAGE AT 10mA
DC TEST CURRENT
VOLTAGE (V )
C
AT TEST CURRENT
(8/20µs)
V
V
N(DC)
N(DC)
MIN
V
V
W
MAX
(V)
32
I
V
I
P
M(DC)
JUMP
(V)
LD
L
C
PART
NUMBER
(V)
(J)
(V)
23
23
23
23
(µA)
50
(V)
40
40
40
40
(A)
1.5
1.5
5
V18AUMLA1206
V18AUMLA1210
V18AUMLA1812
V18AUMLA2220
NOTES:
18
18
18
18
24.5
24.5
24.5
24.5
1.5
3
32
50
6
32
100
200
25
32
10
1. Average power dissipation of transients not to exceed 0.1W, 0.15W, 0.3W and 1W for model sizes 1206, 1210, 1812 and 2220 respectively.
2. Load dump energy rating (into the suppressor) of a voltage transient with a resultant time constant of 115ms to 230ms.
o
o
o
3. Thermal shock capability per Mil-Std-750, Method 1051: -55 C to 125 C, 5 minutes at 25 C, 25 Cycles: 15 minutes at each extreme.
4. For application specific requirements, please contact Harris sales office.
1.
Power Dissipation Ratings
When transients occur in rapid succession, the average
100
90
power dissipation is the energy (watt-seconds) per pulse
80
times the number of pulses per second. The power so
70
developed must be within the specifications shown on the
Device Ratings and Characteristics table for the specific
device. Certain parameter ratings must be derated at high
temperatures as shown in Figure 1.
60
50
40
30
20
10
0
-55
50 60
70
80
90 100 110 120 130 140 150
o
AMBIENT TEMPERATURE ( C)
FIGURE 1. CURRENT, ENERGY AND POWER DERATING
CURVE
5-32
AUML Series
V-I Characteristics Curves
MAXIMUM LEAKAGE
MAXIMUM CLAMPING VOLTAGE
100
10
1
1210/1206
1812
2220
1210/1206
1812
2220
100mA
CURRENT
100A
10µA
100µA
1mA
1A
10A
10mA
o
FIGURE 2. MAXIMUM LEAKAGE CURRENT/CLAMPING VOLTAGE CURVE FOR AUML SERIES AT 25 C
100
o
-40 C
10
o
25 C
o
85 C
o
125 C
1
1mA
10mA
100mA
1A
10A
o
100A
o
1000A
1µA
10µA
100µA
CURRENT
o
o
FIGURE 3. TYPICAL V-I CHARACTERISTICS OF THE V18AUMLA2220 at -40 C, 25 C, 85 C AND 125 C
Temperature Effects
In the leakage region of the AUML suppressor, the device
characteristics approaches a linear (ohmic) relationship and
shows a temperature dependent affect. In this region the
suppressor is in a high resistance mode (approaching 10 Ω)
and appears as a near open-circuit. Leakage currents at
maximum rated voltage are in the microamp range. When
clamping transients at higher currents (at and above the ten
milliamp range), the AUML suppressor approaches a 1-10Ω
characteristic. In this region the characteristics of the AUML
are virtually temperature independent. Figure 3 shows the
typical effect of temperature on the V-I characteristics of the
AUML suppressor.
6
5-33
AUML Series
dissipate the load dump energy. Hence, the peak
Load Dump Energy Capability
temperatures generated by the load dump transient are
significantly lower and evenly dissipated throughout the
complete device (Figure 4). This even energy dissipation
ensures that there are lower peak temperatures generated
at the P-N grain boundaries of the AUML suppressor.
A Load dump transient occurs when the alternator load in the
automobile is abruptly reduced. The worst case scenario of
this transient occurs when the battery is disconnected while
operating at full rated load. There are a number of different
load dump specifications in existence in the automotive
industry, with the most common one being that recommended
by the Society of Automotive Engineers, specification #SAE
J1113. Because of the diversity of these load dump
There are a number of different size devices available in the
AUML series, each one with a load dump energy rating,
which is size dependent.
Experience has shown that while the effects of a load dump
transient is of real concern, its frequency of occurrence is
much less than those of low energy inductive spikes. Such low
energy inductive spikes may be generated as a result of
motors switching on and off, from ESD occurrences, fuse
blowing, etc. It is essential that the suppression technology
selected also has the capability to suppress such transients.
Testing on the V18AUMLA2220 has shown that after being
subjected to a repetitive energy pulse of 2 joules, over 6000
times, no characteristic changes have occurred (Figure 7.)
specifications Harris defines the load dump energy capability
of the AUML suppressor range as that energy dissipated by
the device itself, independent of the test circuit setup. The
resultant load dump energy handling capability serves as an
excellent figure of merit for the AUML suppressor.
Standard load dump specifications require a device
capability of 10 pulses at rated energy, across a temperature
o
o
range of -40 C to 125 C. This capability requirement is well
within the ratings of all of the AUML series (Figure 5).
Further testing on the AUML series has concentrated on
extending the number of load dump pulses, at rated energy,
which are applied to the devices. The reliability information thus
generated gives an indication of the inherent capability of these
devices. As an example of device durability the 1210 size has
been subjected to over 2000 pulses at its rated energy of 3
joules; the 1812 size have been pulsed over 1000 times at 6
joules and 2220 size has been pulsed at its rated energy of 25
joules over 300 times. In all cases there has been little or no
change in the device characteristics (Figure 6).
Speed of Response
The clamping action of the AUML suppressor depends on a
conduction mechanism similar to that of other
semiconductor devices (i.e. P-N Junctions). The apparent
slow response time often associated with transient voltage
suppressors (Zeners, MOVs) is often due to parasitic
inductance in the package and leads of the device and less
dependent of the basic material (silicon, zinc oxide). Thus,
the single most critical element affecting the response time
of any suppressor is its lead inductance. The AUML
suppressor is a surface mount device, with no leads or
external packaging, and thus, it has virtually zero
The very high energy absorption capability of the AUML
suppressor is achieved by means of a highly controlled
manufacturing process. This technology ensures that a large
volume of suppressor material, with an interdigitated layer
construction, is available for energy absorption in an
extremely small package. Unlike equivalent rated silicon
TVS diodes, the entire AUML device volume is available to
inductance. The actual response time of a AUML surge
suppressor is in the 1 to 5 nanosecond range, more than
sufficient for the transients which are likely to be
encountered in an automotive environment.
FIRED CERAMIC
DIELECTRIC
METAL
ELECTRODES
DEPLETION
REGION
DEPLETION
REGION
GRAINS
FIGURE 4. INTERDIGITATED CONSTRUCTION OF AUML SUPPRESSOR
5-34
AUML Series
V(10mA)
35
30
25
20
2220 = 25J
1812 = 6J
1210 = 3J
15
10
5
0
0
1
2
3
4
5
6
7
8
9
10
11
o
12
# OF LOAD DUMPS
o
FIGURE 5. AUML LOAD DUMP PULSING OVER A TEMPERATURE RANGE OF -55 C TO 125 C
V(10mA)
35
2220 = 25J
1812 = 6J
30
1210 = 3J
25
20
15
10
5
0
0
50
100
150
200
250
300
350
1,000
2,000
# OF LOAD DUMPS
FIGURE 6. REPETITIVE LOAD DUMP PULSING AT RATED ENERGY
V AT 10mA
100
V18AUMLA2220
10
1000
2000
3000
4000
5000
6000
7000
NUMBER OF PULSES
FIGURE 7. REPETITIVE ENERGY TESTING OF THE V18AUMLA2220 AT AN ENERGY LEVEL OF 2 JOULES
5-35
AUML Series
Soldering Recommendations
300
250
200
150
100
50
o
The principal techniques used for the soldering of components
in surface mount technology are Infra Red (IR) Reflow, Vapour
Phase Reflow, and Wave Soldering. When wave soldering, the
suppressor is attached to the circuit board by means of an
adhesive. The assembly is then placed on a conveyor and run
through the soldering process to contact the wave. With IR and
Vapour Phase Reflow, the device is placed in a solder paste on
the substrate. As the solder paste is heated, it reflows and
solders the unit to the board.
MAXIMUM WAVE 260 C
SECOND PREHEAT
FIRST PREHEAT
The recommended solder is a 62/36/2 (Sn/Pb/Ag), 60/40
(Sn/Pb), or 63/37 (Sn/Pb). Harris also recommends an
RMA solder flux.
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TIME (MINUTES)
Wave soldering is the most strenuous of the processes. To
avoid the possibility of generating stresses due to thermal
shock, a preheat stage in the soldering process is
recommended, and the peak temperature of the solder
process should be rigidly controlled.
FIGURE 8. WAVE SOLDER PROFILE
250
200
150
100
50
When using a reflow process, care should be taken to
ensure that the chip is not subjected to a thermal gradient
steeper than 4 degrees per second; the ideal gradient
being 2 degrees per second. During the soldering process,
preheating to within 100 degrees of the solders peak
temperature is essential to minimize thermal shock.
Examples of the soldering conditions for the AUML Series
of suppressors are given in the tables below.
MAXIMUM
TEMPERATURE 222 C
o
40-80
SECONDS
o
ABOVE 183 C
RAMP RATE
o
>50 C/s
PREHEAT ZONE
Once the soldering process has been completed, it is still
necessary to ensure that any further thermal shocks are
avoided. One possible cause of thermal shock is hot printed
circuit boards being removed from the solder process and
subjected to cleaning solvents at room temperature. The
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
o
TIME (MINUTES)
boards must be allowed to gradually cool to less than 50 C
before cleaning.
FIGURE 9. VAPOR PHASE SOLDER PROFILE
Termination Options
Harris offers two types of electrode termination finish for the
Multilayer product series:
250
200
150
100
50
MAXIMUM
TEMPERATURE 222 C
o
1. Silver/Platinum (standard)
2. Silver/Palladium (optional)
40-80
SECONDS
ABOVE 183 C
o
RAMP RATE
o
<2 C/s
PREHEAT DWELL
PREHEAT ZONE
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
TIME (MINUTES)
FIGURE 10. REFLOW SOLDER PROFILE
5-36
AUML Series
Leakage Current (I )
Recommended Pad Outline
L
In the nonconducting mode, the device is at a very high
impedance (approaching 10 Ω at its rated working voltage)
C
6
and appears as an almost open circuit in the system. The
leakage current drawn at this level is very low (<25µA at
ambient temperature) and, unlike the zener diode, the
multilayer TVS has the added advantage that, when
operated up to its maximum temperature, its leakage current
will not increase above 500µA.
NOTE: Avoid metal
runs in this area.
B
NOTE
Nominal Voltage (V
)
A
N(DC)
This is the voltage at which the AUML enters its conduction
state and begins to suppress transients. In the automotive
environment this voltage is defined at the 10mA point and
CHIP SIZE
1210 1812
IN MM IN MM
1206
IN MM
2220
IN MM
has a minimum (V
voltage specified.
) and maximum (V
)
N(DC) MIN
N(DC) MAX
SYMBOL
A
B
C
0.203 5.15 0.219 5.51 0.272 6.91 0.315 8.00
0.103 2.62 0.147 3.73 0.172 4.36 0.240 6.19
0.065 1.65 0.073 1.85 0.073 1.85 0.073 1.85
Mechanical Dimensions
E
Explanation of Terms
L
Maximum Continuous DC Working Voltage (V
)
M(DC)
D
This is the maximum continuous DC voltage which may be
applied, up to the maximum operating temperature (125 C),
W
o
to the ML suppressor. This voltage is used as the reference
test point for leakage current and is always less than the
breakdown voltage of the device.
CHIP SIZE
1210 1812
IN MM IN MM
D MAX 0.071 1.80 0.070 1.80 0.07 1.8 0.118 3.00
0.5 0.03 0.75
1206
IN MM
2220
Load Dump Energy Rating (W
)
LD
SYMBOL
IN
MM
This is the actual energy the part is rated to dissipate under
load dump conditions (not to be confused with the “source
energy” of a load dump test specification).
E
L
0.02 0.50 0.02 0.50 0.02
±0.01 ±0.25 ±0.01 ±0.25 ±0.01 ±0.25 ±0.01 ±0.25
Maximum Clamping Voltage (V )
C
0.125 3.20 0.125 3.20 0.18 4.5 0.225 5.7
This is the peak voltage appearing across the suppressor
when measured at conditions of specified pulse current and
specified waveform (8/20µs). It is important to note that the
peak current and peak voltage may not necessarily be
coincidental in time.
±0.012 ±0.03 ±0.012 ±0.30 ±0.014 ±0.35 ±0.016 ±0.4
0.06 1.60 0.10 2.54 0.125 3.2 0.197
W
5
±0.011 ±0.28 ±0.012 ±0.30 ±0.012 ±0.30 ±0.016 ±0.4
5-37
AUML Series
Ordering Information
V18AUMLAXXXX TYPES
V
18 AUML A 2220
X
X
AUML SERIES
DEVICE FAMILY
PACKING OPTIONS
Harris TVSS Device
A: <100 pc Bulk Pack
H: 7in (178mm) Diameter Reel (Note)
T: 13in (330mm) Diameter Reel (Note)
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
No Letter: Ag/P (Standard)
t
AUTOMOTIVE
MULTILAYER DESIGNATOR
W: Ag/P
d
N: Ni/Sn (1206/1210 Only)
LOADDUMPENERGYRATING
INDICATOR
DEVICE SIZE:
i.e., 220 mil x 200 mil
NOTE: See quantity table.
Standard Shipping Quantities
DEVICE SIZE
1206
“13” INCH REEL (“T” OPTION)
“7” INCH REEL (“H” OPTION)
BULK PACK (“A” OPTION)
10,000
8,000
4,000
4,000
2,500
2,000
1,000
1,000
100
100
100
100
1210
1812
2220
Tape and Reel Specifications
t
P
0
D
1
0
• Conforms to EIA - 481, Revision A
P
2
• Can be Supplied to IEC Publication 286 - 3
E
TAPE
8mm WIDE TAPE
1206 1210
12mm WIDE TAPE
1812 2220
F
W
Chip Size
K
B
0
0
P
A
0
1
D
t
1
2
5-38
AUML Series
TAPE WIDTH
SYMBOL
DESCRIPTION
8mm
12mm
A
B
K
Width of Cavity
Length of Cavity
Depth of Cavity
Width of Tape
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
0
0
0
W
F
8 ± 0.2
12 ± 0.2
5.4 ± 0.5
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers and Tape Edge
Distance Between Cavity Center
3.5 ± 0.5
E
1.75 ± 0.1
P
P
P
4 ± 0.1
8 ± 0.1
1
2
0
Axial Distance Between Drive Hole Centers and Cavity Centers
Axial Distance Between Drive Hole Centers
Drive Hole Diameter
2 ± 0.1
8 ± 0.1
D
D
1.55 ± 0.05
0
1
Diameter of Cavity Piercing
1.05 ± 0.05
1.55 ± 0.05
t
t
Embossed Tape Thickness
0.3 Max
0.4 Max
1
Top Tape Thickness
0.1 Max
2
NOTE: Dimensions in millimeters.
Standard Packaging
PRODUCT
IDENTIFYING
LABEL
Tape and reel is the standard packaging method of the
AUML series. The standard 330 millimeter (13 inch) reel
utilized contains 4000 pieces for the 2220 and 1812 chips,
8000 pieces for the 1210 chip and 10,000 pieces for the
1206 size. To order add “T” to the standard part number, e.g.
V18AUMLA2220T.
PLASTIC CARRIER TAPE
Special Packaging
Option 1: 178 millimeter (7 inch) reels containing 1000
(2220, 1812), 2000 (1210), 2500 (1206), pieces
are available. To order add “H” to the standard
part number, e.g. V18AUMLA2220H.
EMBOSSMENT
TOP TAPE
8MM
NOMINAL
178MM
OR 330MM
DIA. REEL
Option 2: For small sample quantities (less than 100
pieces) the units are shipped bulk pack. To order
add “A” to the standard part number, e.g.
V18AUMLA2220A.
All Harris semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Harris semiconductor products are sold by description only. Harris Semiconductor Communications Division reserves the right to make changes in circuit design and/or
specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris
is believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other rights
of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries.
For information regarding Harris’ Semiconductor Communications Division and its products, call 1-800-4-HARRIS or see web site http://www.semi.harris.com
5-39
相关型号：
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LITTELFUSE
V18AUMLA2220H23
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RENESAS
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