V18MLE1206WA [LITTELFUSE]
Varistor, 18V, Surface Mount, CHIP, 1206;
| 型号： | V18MLE1206WA |
| 厂家： | 
LITTELFUSE |
| 描述： | Varistor, 18V, Surface Mount, CHIP, 1206 电阻器 |
| 文件： | 总6页 (文件大小：821K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
ꢀoHS
MLE Varistor Series
Description
The MLE Series family of transient voltage suppression
devices are based on the Littelfuse multilayer fabrication
technology. These components are designed to suppress
ESD events, including those specified in IEC 61000-4-2
or other standards used for Electromagnetic Compliance
testing. The MLE Series is typically applied to protect
integrated circuits and other components at the circuit
board level operating at 18VDC, or less.
The fabrication method and materials of these devices
result in capacitance characteristics suitable for high
frequency attenuation/low-pass filter circuit functions,
thereby providing suppression and filtering in a single
device.
SizeTable
Metric
1005
1608
2012
EIA
The MLE Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MLE Series is compatible with modern reflow
and wave soldering procedures.
0402
0603
0805
1206
Littelfuse Inc. manufactures other Multilayer Series
products. See the ML Series data sheet for higher energy/
peak current transient applications. See the AUML Series
for automotive applications and the MLN Quad Array. For
high–speed applications see the MHS Series.
3216
Applications
Features
•
•
•
Halogen-Free and
RoHS Compliant
operating temp. range
•
Protection of
compliance (EMC)
components and
circuits sensitive
to ESDTransients
occurring on power
supplies, control
and signal lines
•
•
•
Leadless 0402, 0603,
0805, and 1206 sizes
•
Used in mobile
communications,
computer/EDP
products, medical
products, hand held/
portable devices,
industrial equipment,
including diagnostic
port protection and
I/O interfaces
Rated for ESD
(IEC-61000-4-2)
Operating voltages
up to 18VM(DC)
Characterized for
impedance and
capacitance
Multilayer ceramic
construction technology
•
Suppression of
•
-55ºC to +125ºC
ESD events such as
specified in IEC-61000-
4-2 or MIL-STD-883
Method-3015.7, for
electromagnetic
Additional Information
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
MLE Series
Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC)
)
≤18
V
ºC
C
Datasheet
ꢀesoꢁrꢂes
ꢀaꢁꢂles
Operating AmbientTemperature
Range (TA)
-55 to +125
-55 to +150
StorageTemperature Range (TSTG
)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Device Ratings and Specifications
Performance Specifications (25ºC)
Maximum Clamping
Max Continuous
Working Voltage
-55ºC to 125ºC
Nominal
Voltage
Maximum ESD Clamp
Voltage at Specified
Typical
Capacitance
at 1MHz
Voltage (Note 2)
Current (8/20µs)
Part Number
(Note 1)
VNOM at
1mA DC
8kV Contact
15kV Air
VC
VM(DC)
(Note 3)
(Note 4)
(V)
MIN (V) MAX (V)
(V)
(V)
<125
<125
<75
Clamp (V)
<110
(pF)
<55
V18MLE0402N
V18MLE0402F (Note 8)
V18MLE0603N
V18MLE0603F (Note 8)
V18MLE0603LN
V18MLE0805N
18
18
18
18
18
18
18
18
22
22
22
22
22
22
22
22
28
28
28
28
28
28
28
28
50 at 1A
50 at 1A
50 at 1A
50 at 1A
50 at 1A
50 at 1A
50 at 1A
50 at 1A
<110
<110
<110
<55
<125
<125
<100
<500
<290
<1700
<75
<100
<70
<140
<75
V18MLE0805LN
V18MLE1206N
<75
<65
<135
<65
NOTES:
1. For applications of 18VDC or less. Higher voltages available, contact your Littelfuse Sales Representative.
2. Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
3. Direct discharge to device terminals (IEC preferred test method).
4. Corona discharge through air (represents actual ESD event).
5. Capacitance may be customized, contact your Littelfuse Sales Representative.
6. Leakage current ratings are at 18 VDC and 25µA maximum.
7. The typical capacitance rating is the discrete component test result.
8. Items are lead free, and available as "R" packing option only.
NominalVoltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
Peak Current and Energy Derating Curve
For applications exceeding 125ºC ambient temperature, the peak
surge current and energy ratings must be reduced as shown
below.
30
25
20
15
10
5
100
80
60
40
20
0
0
1
10
1000
100
10000
CURRENT (A)
Figure 2
-55
50 60
70
80
90 100 110 120 130 140 150
o
AMBIENTTEMPERATURE ( C)
Figure 1
Standby Current at NormalizedVaristorVoltage and
Temperature
Impedance (Z) vs FrequencyTypical Characteristic
100
1.2
1.0
0.8
-0402
-0603
10
-0805
25O
85O
-1206
0.6
1
0.4
0.1
125O
0.2
0.0
0.01
0.0001
0.001
0.01
0.1
1
10
1000
100
10000
CURRENT (mA)
FREQUENCY (MHz)
Figure 3
Figure 4
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Device Characteristics
ClampingVoltage OverTemperature (VC at 10A)
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
100
V26MLA1206
V5.5MLA1206
TypicalTemperature Dependance of the Characteristic
Curve in the Leakage Region
100%
10
-60
-40
-20
0
20
40
60
80
100 120 140
o
TEMPERATURE ( C)
Figure 6
Energy Absorption/Peak Current Capability
Energy dissipated within the MLE is calculated by
multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
(see Speed of Response). This dramatically reduces peak
temperature; thermal stresses and enhances device
reliability.
o
o
o
o
o
C
25 50 75
-8 -7
100 125
10%
1E
-9
-6
-5
-4
-3
-2
1E
1E
1E
1E
1E
1E
1E
SUPPRESSOR CURRENT (A
DC
)
Figure 5
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the MLE can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
multiple pulses at its peak current rating (3A, 8/20µs). At
the end of the test, 10,000 pulses later, the device voltage
characteristics are still well within specification.
Repetitive Pulse Capability
Multilayer Internal Construction
100
PEAK CURRENT = 3A
8/20 s DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
V26MLA1206
METAL
ELECTRODES
METAL END
TERMINATION
DEPLETION
REGION
10
0
2000
4000
6000
8000
10000
12000
NUMBER OF PULSES
DEPLETION
REGION
Figure 8
GRAINS
Figure 7
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
The recommended solder for the MLE suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
230
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLE chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Figure 9
Wave Solder Profile
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Figure 10
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel BarrierTermination finish for the
optimum Lead–free solder performance.
Lead–free Re-flow Profile
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free Wave
soldering, the Wave Solder Profile still applies.
PREHEAT ZONE
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
5.0
6.0
7. 0
Figure 11
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
C
CHIP LAYOUT DIMENSIONS
E
B
NOTE
D
L
A
W
NOTE: Avoid metal runs in this area.
Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.
1206 Size
0805 Size
0603 Size
0402 Size
Dimension
IN
MM
4.06
1.65
1.02
1.80
IN
MM
3.05
1.27
1.02
1.10
IN
MM
2.54
0.76
0.89
1.00
IN
MM
1.70
0.51
0.61
0.60
A
0.160
0.065
0.040
0.071
0.120
0.050
0.040
0.043
0.100
0.030
0.035
0.040
0.067
0.020
0.024
0.024
B
C
D (max.)
0.015 -/+
0.008
0.063 -/+
0.006
0.032 -/+
0.006
0.010 -/+
0.006
0.039 -/+
0.004
0.020 -/+
0.004
E
L
0.02 -/+ 0.01 0.50 -/+ 0.25 0.02 -/+ 0.01 0.50 -/+ 0.25
0.4 -/+ 0.2
1.6 -/+ 0.15
0.8 -/+ 0.15
0.25 -/+ 0.15
1.0 -/+ 0.1
0.125 -/+
0.012
0.079 -/+
0.008
3.20 -/+ 0.03
2.01 -/+ 0.2
1.25 -/+ 0.2
0.049 -/+
0.008
W
0.06 -/+ 0.011 1.60 -/+ 0.28
0.5 -/+ 0.1
Part Numbering System
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ꢎꢏVꢉꢇꢏ ꢒꢆMꢉꢓꢔ
ꢋꢀꢌꢌꢂꢈꢍꢎsꢂꢏVꢐꢐ ꢑꢂꢒꢀꢓꢂ
ꢅꢆꢇꢈꢉꢊꢋ OꢅꢌꢉOꢊꢍ (see Packaging section for quantities)
ꢏꢗ ꢄꢞꢀꢙ (ꢞꢞꢆꢇꢇ) ꢑꢀꢘꢇꢂꢌꢂꢖ ꢥꢂꢂꢈꢃ ꢦꢈꢘsꢌꢀꢓ ꢜꢘꢖꢖꢀꢂꢖꢏꢘꢝꢂ
ꢧꢗ ꢨꢀꢙ (ꢄꢨꢩꢇꢇ) ꢑꢀꢘꢇꢂꢌꢂꢖ ꢥꢂꢂꢈꢃ ꢦꢈꢘsꢌꢀꢓ ꢜꢘꢖꢖꢀꢂꢖꢏꢘꢝꢂ
ꢥꢗ ꢨꢀꢙ (ꢄꢨꢩꢇꢇ) ꢑꢀꢘꢇꢂꢌꢂꢖ ꢥꢂꢂꢈꢃ ꢦꢘꢝꢂꢖ ꢜꢘꢖꢖꢀꢂꢖꢏꢘꢝꢂ
MꢆꢕꢉMꢖM ꢎꢇ
ꢗOꢘꢈꢉꢊꢋ VOꢓꢌꢆꢋꢏ
ꢏꢊꢎ ꢌꢏꢘMꢉꢊꢆꢌꢉOꢊ OꢅꢌꢉOꢊ
ꢔꢗ ꢔꢀꢓꢠꢂꢈ ꢡꢘꢖꢖꢀꢂꢖ(ꢔꢀꢢꢐꢙ)
ꢣꢗ ꢋꢂꢘꢚ ꢍꢖꢂꢂ ꢛꢀꢌꢤ ꢔꢀꢓꢠꢂꢈ ꢡꢘꢖꢖꢀꢂꢖ(ꢔꢀꢢꢐꢙ)
Mꢖꢓꢌꢉꢓꢆꢔꢏꢘ ꢍꢏꢘꢉꢏꢍ
ꢎꢏꢍꢉꢋꢊꢆꢌOꢘ
ꢎꢏVꢉꢇꢏ ꢍꢉꢐꢏꢑ
ꢀꢁꢂꢁꢃ ꢄꢅꢆ ꢇꢀꢈꢉ ꢊꢆ ꢇꢀꢈ
(ꢞꢇꢇ ꢉ ꢄꢁꢟꢇꢇ)
ꢇꢆꢅꢆꢇꢉꢌꢆꢊꢇꢏ OꢅꢌꢉOꢊ
ꢔꢕ ꢋꢂꢌꢌꢂꢖꢗ ꢐꢌꢘꢙꢚꢘꢖꢚ
ꢋꢗ ꢋꢕꢛ ꢜꢘꢝꢘꢓꢀꢌꢘꢙꢓꢂVꢂꢖsꢀꢕꢙ
Packaging*
Quantity
7” Inch Reel
('H' Option)
Device Size
13” Inch Reel
('T' Option)
7” Inch Reel
('R' Option)
Bulk Pack
('A' Option)
1206
0805
0603
0402
10,000
10,000
10,000
N/A
2,500
N/A
N/A
2500
2500
2500
N/A
2,500
2,500
4,000
10,000
N/A
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Tape and Reel Specifications
PRODUCT
IDENTIFYING
LABEL
D
0
P
0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P
2
E
F
W
K
0
B
0
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
P
A
0
1
t
D
1
1
Dimensions in Millimeters
0402 Size 0603, 0805 & 1206 Sizes
Symbol
Description
A0
B0
K0
W
F
Width of Cavity
Length of Cavity
Depth of Cavity
Width ofTape
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
8 -/+ 0.2
3.5 -/+ 0.05
1.75 -/+ 0.1
2 -/+ 0.05
2 -/+ 0.1
8 -/+ 0.3
3.5 -/+ 0.05
1.75 -/+ 0.1
4 -/+ 0.1
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers andTape Edge
Distance Between Cavity Centers
E
P1
P2
P0
D0
D1
T1
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
2 -/+ 0.1
4 -/+ 0.1
4 -/+ 0.1
1.55 -/+ 0.05
N/A
1.55 -/+ 0.05
1.05 -/+ 0.05
0.1 Max
Diameter of Cavity Piercing
TopTapeThickness
0.1 Max
Notes :
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
相关型号：
V18MLN40805NH
RESISTOR, VOLTAGE DEPENDENT, 18V, 0.05J, SURFACE MOUNT, CHIP, 0805, ROHS COMPLIANT
LITTELFUSE
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