V26MLA1206NT [LITTELFUSE]
Varistor, 26V, 0.6J, Surface Mount, CHIP, 1206, ROHS COMPLIANT;型号: | V26MLA1206NT |
厂家: | LITTELFUSE |
描述: | Varistor, 26V, 0.6J, Surface Mount, CHIP, 1206, ROHS COMPLIANT 电阻器 |
文件: | 总9页 (文件大小:945K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
ꢀoHS
MLA Varistor Series
Description
The MLA Series family of transient voltage surge
suppression devices is based on the Littelfuse Multilayer
fabrication technology. These components are designed
to suppress a variety of transient events, including those
specified in IEC 61000-4-2 or other standards used for
Electromagnetic Compliance (EMC). The MLA Series is
typically applied to protect integrated circuits and other
components at the circuit board level.
The wide operating voltage and energy range make the
MLA Series suitable for numerous applications on power
supply, control and signal lines.
The MLA Series is manufactured from semiconducting
ceramics, and is supplied in a leadless, surface mount
package. The MLA Series is compatible with modern
reflow and wave soldering procedures.
SizeTable
Metric
1005
1608
2012
3216
3225
EIA
0402
0603
0805
1206
1210
It can operate over a wider temperature range than Zener
diodes, and has a much smaller footprint than plastic-
housed components.
Littelfuse Inc. manufactures other multilayer series
products. See the MLE Series data sheet for ESD
applications, MHS Series data sheet for high-speed ESD
applications, the MLN Series for multiline protection and
the AUML Series for automotive applications.
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
ML Series Units
Steady State Applied Voltage:
Features
DC Voltage Range (VM(DC)
AC Voltage Range (VM(AC)RMS
Transient:
Non-Repetitive Surge Current, 8/20µs
)
3.5 to 120
2.5 to 107
V
V
•
Halogen-Free and
RoHS compliant
•
•
•
•
Rated for surge
)
current (8 x 20µs)
•
Leadless 0402,
0603, 0805, 1206
and 1210 chip sizes
Rated for energy
(10 x 1000µs)
Inherent bi-directional
clamping
Standard low
capacitance
types available
4 to 500
A
J
Waveform, (ITM
)
Non-Repetitive Surge Energy,
10/1000µs Waveform, (WTM
0.02 to
2.5
•
Multilayer ceramic
construction
technology
)
-55 to
+125
Operating AmbientTemperature Range (TA)
ºC
•
•
-55°C to +125°C
operating temp. range
•
ESD rated to IEC
-55 to
+150
Operating voltage
61000-4-2, Level 4: Air
Discharge 15KV and
Contact Discharge 8KV
StorageTemperature Range (TSTG
)
ºC
range V
=
5.5V toM1(2DC0)V
Temperature Coefficient (αV) of Clamping
Voltage (VC) at Specified Test Current
<0.01
%/º C
Applications
Additional Information
•
Suppression of
inductive switching
or other transient
events such as EFT
and surge voltage at
the circuit board level
ESD protection for IEC
61000-4-2 (Level 4),
MIL-STD-883 method
3015.7, and other
•
•
•
Provides on-board
transient voltage
protection for ICS
and transistors
Used to help achieve
electromagnetic
compliance of
Datasheet
ꢀesoꢁrꢂes
ꢀaꢁꢂles
•
end products
Replace larger surface
mountTVS Zeners in
many applications
industry specifications
(see also the MLE
or MLN Series)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Device Ratings and Specifications
Maximum Ratings (125º C)
Specifications (25ºC)
Maximum
Maximum Non-
repetitive Surge
Maximum Non-
repetitive Surge
Maximum Clamping Nominal Voltage
Typical
Capacitance
at f = 1MHz
Continuous
Voltage at 1A (or as
at 1mA DCTest
Current
Part Number
Working Voltage Current (8/20µs) Energy (10/1000µs)
Noted) (8/20µs)
VM(DC)
VM(AC)
ITM
WTM
VC
VN(DC) Min VN(DC) Max
C
(V)
3.5
3.5
3.5
3.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
9.0
9.0
(V)
2.5
2.5
2.5
2.5
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
9.0
10.0
10.0
10.0
10.0
10.0
10.0
10.0
14.0
14.0
14.0
14.0
14.0
14.0
14.0
14.0
14.0
20.0
20.0
20.0
20.0
20.0
20.0
25.0
25.0
25.0
25.0
25.0
25.0
(A)
30
120
40
100
20
20
20
20
30
30
30
120
40
150
20
20
4
4
30
30
30
40
40
20
20
30
30
120
40
150
20
20
30
30
120
40
150
500
1000
30
30
100
40
(J)
(V)
13.0
13.0
13.0
13.0
21.0
21.0
39.0
39
17. 5
17. 5
17.5
17. 5
17. 5
17. 5
30.0
30.0
35.0
35.0
25.5
25.5
25.5
25.5
29.0
39.0
39.0
34.5
34.5
32.0
32.0
32.0
50.0
50.0
(V)
3.7
3.7
3.7
3.7
7. 1
7.1
15.9
15.9
7. 1
(V)
7. 0
7. 0
7. 0
7. 0
10.8
10.8
21.5
21.5
9.3
(pF)
1270
1760
1380
5800
220
220
70
V3.5MLA0603N5
V3.5MLA0805N
V3.5MLA0805LN
V3.5MLA1206N
V5.5MLA0402N
V5.5MLA0402F8
V5.5MLA0402LN
V5.5MLA0402LF8
V5.5MLA0603N5
V5.5MLA0603LN4
V5.5MLA0603LF8
V5.5MLA0805N
V5.5MLA0805LN
V5.5MLA1206N
V9MLA0402N
V9MLA0402F8
V9MLA0402LN
V9MLA0402LF8
V9MLA0603N5
V9MLA0603LN4
V9MLA0603LF8
V9MLA0805LN
V12MLA0805LN
V14MLA0402N
V14MLA0402F8
V14MLA0603N
V14MLA0603F8
V14MLA0805N
V14MLA0805LN
V14MLA1206N
V18MLA0402N
V18MLA0402F8
V18MLA0603N
V18MLA0603F8
V18MLA0805N
V18MLA0805LN
V18MLA1206N
V18MLA1210N
V18MLA1812N7
V26MLA0603N
V26MLA0603F8
V26MLA0805N
V26MLA0805LN
V26MLA1206N
V26MLA1210N
V30MLA0603N
V30MLA0603F8
V30MLA0805LN
V30MLA1206N
V30MLA1210N
V30MLA1210LN
0.100
0.300
0.100
0.300
0.050
0.050
0.050
0.05
70
0.100
0.100
0.100
0.300
0.100
0.400
0.050
0.050
0.020
0.020
0.100
0.100
0.100
0.100
0.100
0.050
0.050
0.100
0.100
0.300
0.100
0.400
0.050
0.050
0.100
0.100
0.300
0.100
0.400
2.500
2.900
0.100
0.100
0.300
0.100
0.600
1.200
0.100
0.100
0.100
1.000
1.200
0.900
960
450
450
1200
660
2800
120
120
33
7. 1
7.1
7. 1
7. 1
9.3
9.3
9.3
9.3
7. 1
9.3
11.0
11.0
11.0
11.0
11.0
11.0
11.0
11.0
14.0
15.9
15.9
15.9
15.9
15.9
15.9
15.9
22.0
22.0
22.0
22.0
22.0
22.0
22.0
22.0
22.0
31.0
31.0
29.5
29.5
29.5
29.5
37.0
37.0
37.0
35.0
35.0
35.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
18.5
21.5
21.5
21.5
21.5
20.3
20.3
20.3
28.0
28.0
28.0
28.0
28.0
28.0
28.0
28.0
28.0
38.0
38.0
38.5
38.5
38.5
38.5
46.0
46.0
46.0
43.0
43.0
43.0
9.0
9.0
9.0
9.0
9.0
9.0
33
490
360
360
320
220
70
12.0
14.0
14.0
14.0
14.0
14.0
14.0
14.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
26.0
26.0
26.0
26.0
26.0
26.0
30.0
30.0
30.0
30.0
30.0
30.0
70
80
180
360
200
800
40
40
60
50.0
50.0
44.0
44.0
120
260
170
1030
2500
4050
55
110
110
90
630
1250
45
90
85
44.0
44.0 at 2.5
44.0 at 5
60.0
60.0
60.0
60.0
60.0
150
300
30
30
30
180
280
220
60.0 at 2.5
74.0
74.0
72.0
67.0
400
685
500
68.0 at 2.5
68.0 at 2.5
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Device Ratings and Specifications (Continue...)
Maximum Ratings (125º C)
Specifications (25ºC)
Maximum
Maximum Non-
repetitive Surge
Maximum Non-
repetitive Surge
Maximum Clamping Nominal Voltage
Typical
Capacitance
at f = 1MHz
Continuous
Voltage at 1A (or as
at 1mA DCTest
Current
Part Number
Working Voltage Current (8/20µs) Energy (10/1000µs)
Noted) (8/20µs)
VM(DC)
VM(AC)
ITM
WTM
VC
VN(DC) Min VN(DC) Max
C
(V)
30.0
33.0
38.0
42.0
45.0
48.0
48.0
48.0
56.0
60.0
68.0
85.0
120.0
(V)
25.0
26.0
30.0
30.0
35.0
40.0
40.0
40.0
40.0
50.0
50.0
67.0
(A)
800
180
800
180
500
180
250
220
180
250
180
250
125
(J)
(V)
65.0 at 5
75.0
77.0 at 5
92.0
90.0 at 5
100.0
105.0 at 2.5
105.0 at 2.5
120.0
130.0 at 2.5
140.0
(V)
35.0
38.0
43.0
46.0
50.4
54.5
54.5
54.5
61.0
67.0
(V)
43.0
49.0
52.0
60.0
61.6
66.5
66.5
66.5
77.0
(pF)
1900
390
1450
345
1200
185
400
380
180
230
130
160
70
V30MLA1812N7
V33MLA1206N
V38MLA1812N7
V42MLA1206N
V45MLA1812N7
V48MLA1206N
V48MLA1210N
V48MLA1210LN
V56MLA1206N
V60MLA1210N
V68MLA1206N
V85MLA1210N
V120MLA1210N
3.700
0.800
4.500
0.800
4.000
0.900
1.200
0.900
1.000
1.500
1.000
2.500
2.000
83.0
90.0
115.0
165.0
76.0
95.0
135.0
180.0 at 2.5
260.0 at 2.5
107.0
NOTES:
1
'L' suffix is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requirements.
2
Typical leakage at 25ºC<25µA, maximum leakage 100µA at VM(DC); for 0402 size, typical leakage <5µA, maximum leakage <20µA at VM(DC).
3
4
5
Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively.
Item is available as 'R' packing option only. All 0402 size items available as 'R' packaging option only. See Packaging section for additional information.
Item is available in 'H','T'and 'A' packing option only. All 0805, 1206 and 1210 parts come as 'H','T'and 'A' packing option only. See Packaging section for additional information.
6. The typical capacitance rating is the discrete component test result.
7. Item is available in "T" packing option only.
8. Item is available in "R" packing option only, and lead free.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Peak Current and Energy Derating Curve
Peak Pulse CurrentTest Waveform for ClampingVoltage
When transients occur in rapid succession, the average
power dissipation is the energy (watt-seconds) per pulse
times the number of pulses per second. The power so
developed must be within the specifications shown
on the Device Ratings and SpecificationsTable for the
specific device. For applications exceeding 125°C ambient
temperature, the peak surge current and energy ratings
must be derated as shown below.
100
50
0
T
O
TIME
1
T
1
Figure 2
T
2
100
80
01 = Virtual Origin of Wave
T =Time from 10% to 90% of Peak
T1 = RiseTime = 1.25 xT
60
40
T2 = DecayTime
20
0
Example - For an 8/20 µs Current Waveform:
8µs =T1 = RiseTime
-55
50 60
70
80
90 100 110 120 130 140 150
o
20µs =T2 = DecayTime
AMBIENTTEMPERATURE ( C)
Figure 1
LimitV-I Characteristic forV5.5MLA0402 toV18MLA0402
LimitV-I Characteristic forV9MLA0402L
100
100
10
10
V18MLA0402
V14MLA0402
V9MLA0402
V5.5MLA0402
V9MLA0402L
V5.5MLA0402L
1
1µA
1
10µA
100µA
1mA
10mA
1A
10A
100A
1µA
10µA
100µA
1mA
10mA
1A
10A
100A
Current (A)
Figure 3
Figure 4
Current (A)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
LimitV-I Characteristic forV3.5MLA0603 toV30MLA0603
LimitV-I Characteristic forV3.5MLA0805L toV30MLA0805L
1000
100
10
1000
V30MLA0805L
V26MLA0805L
V18MLA0805L
V30MLA0603
V26MLA0603
V18MLA0603
V14MLA0805L
100
V14MLA0603
10
V12MLA0805L
V9MLA0603, V9MLA0603L
V5.5MLA0603, V5.5MLA0603L
V3.5MLA0603
V9MLA0805L
V5.5MLA0805L
V3.5MLA0805L
1
1
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
10µA
100µA
1mA
10mA
Current (A)
100mA
1A
10A
100A
Current (A)
Figure 5
Figure 6
LimitV-I Characteristic forV3.5MLA0805 toV26MLA0805
LimitV-I Characteristic forV3.5MLA1206 toV68MLA1206
1000
1000
100
100
V68MLA1206
V56MLA1206
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
V14MLA1206
V5.5MLA1206
V3.5MLA1206
V26MLA0805
10
V18MLA0805
V14MLA0805
V5.5MLA0805
10
V3.5MLA0805
1
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
1
10µA
Current (A)
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
Current (A)
Figure 7
Figure 8
LimitV-I Characteristic forV18MLA1210 toV120MLA1210
1000
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
100
V120MLA1210
10
V85MLA1210
V60MLA1210
V48MLA1210, V48MLA1210L
V30MLA1210, V30MLA1210L
V26MLA1210
V18MLA1210
1
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
Figure 9
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Device Characteristics
ClampingVoltage OverTemperature (VC at 10A)
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance modex (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100µA, typically 25µA;
for 0402 size below 20µA, typically 5µA.
100
V26MLA1206
V5.5MLA1206
TypicalTemperature Dependance of the Haracteristic
Curve in the Leakage Region
100%
10
-60
-40
-20
0
20
40
60
80
100 120 140
o
TEMPERATURE ( C)
Figure 11
Energy Absorption/Peak Current Capability
Energy dissipated within the MLA Series is calculated
by multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
(see Speed of Response). This dramatically reduces peak
temperature; thermal stresses and enhances device
reliability.
o
o
o
o
o
C
25 50 75
-8 -7
100 125
10%
1E
-9
-6
-5
-4
-3
-2
1E
1E
1E
1E
1E
1E
1E
SUPPRESSOR CURRENT (A
DC
)
Figure 10
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the MLA can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
multiple pulses at its peak current rating (3A, 8/20µs). At
the end of the test,10,000 pulses later, the device voltage
characteristics are still well within specification.
Repetitive Pulse Capability
Multilayer Internal Construction
100
PEAK CURRENT = 3A
8/20 s DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
V26MLA1206
METAL
ELECTRODES
METAL END
TERMINATION
10
DEPLETION
REGION
0
2000
4000
6000
8000
10000
12000
NUMBER OF PULSES
Figure 13
DEPLETION
REGION
Figure 12
GRAINS
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
250
200
150
100
MAXIMUM TEMPERATURE
230°C
The recommended solder for the MLA suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
40-80
SECONDS
ABOVE 183°C
RAMP RATE
<2°C/s
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
PREHEAT DWELL
PREHEAT ZONE
50
0
When using a reflow process, care should be taken to
ensure that the MLA chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Figure 14
TIME (MINUTES)
Wave Solder Profile
300
250
200
150
100
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
MAXIMUMWAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TIME (MINUTES)
Figure 15
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel BarrierTermination option (see
"N" suffix in Part Numbering System for ordering) for the
optimum Lead–free solder performance, consisting of a
MatteTin outer surface plated on Nickel underlayer, plated
on Silver base metal.
Lead–free Re-flow Solder Profile
300
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
250
200
150
100
50
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
PREHEAT ZONE
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7. 0
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Figure 16
TIME (MINUTES)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Product Dimensions (mm)
PAD LAYOUT DIMENSIONS
CHIP LAYOUT DIMENSIONS
C
E
B
NOTE
D
L
W
A
NOTE : Avoid metal runs in this area, parts not recommended for use in applications using
Silver (Ag) epoxy paste.
1210 Size
IN
1206 Size
IN
0805 Size
IN
0603 Size
0402 Size
IN
Dimension
MM
4.06
2.54
1.02
2.87
MM
4.06
1.65
1.02
1.80
MM
3.05
1.27
1.02
1.10
IN
MM
2.54
0.76
0.89
1.00
MM
1.70
0.51
0.61
0.60
A
0.160
0.100
0.040
0.113
0.160
0.065
0.040
0.071
0.120
0.050
0.040
0.043
0.100
0.030
0.035
0.040
0.067
0.020
0.024
0.024
B
C
D (max.)
0.020
0.50
0.020
0.50
0.020 -/+
0.010
0.50 -/+
0.25
0.015
0.4
0.010
0.25
E
L
-/+0.010
-/+0.25
-/+0.010
-/+0.25
-/+0.008
-/+0.20
-/+0.006
-/+0.15
0.125
-/+0.012
3.20
-/+0.30
0.125
-/+0.012
3.20
-/+0.30
0.079
-/+0.008
2.01
-/+0.20
0.063
-/+0.006
1.6
-/+0.15
0.039
-/+0.004
1.00
-/+0.10
0.100
-/+0.012
2.54
-/+0.30
0.060
-/+0.011
1.60
-/+0.28
0.049
-/+0.008
1.25
-/+0.20
0.032
-/+0.060
0.8
-/+0.15
0.020
-/+0.004
0.50
-/+0.10
W
Part Numbering System
V ꢀꢁ Mꢓꢆ ꢀꢂꢃꢄ ꢕ ꢕ ꢕ
ꢅꢆꢇꢈꢉꢊꢋ OꢅꢌꢉOꢊꢍ (see Packaging table for quantities)
ꢇꢏ ꢝꢞꢁꢑ (ꢞꢞꢟꢜꢜ) ꢉꢁꢐꢜꢃꢂꢃꢎ ꢠꢃꢃꢄꢖ ꢡꢄꢐsꢂꢁꢋ ꢔꢐꢎꢎꢁꢃꢎꢇꢐꢕꢃ
ꢢꢏ ꢣꢁꢑ (ꢝꢣꢤꢜꢜ) ꢉꢁꢐꢜꢃꢂꢃꢎ ꢠꢃꢃꢄꢖ ꢡꢄꢐsꢂꢁꢋ ꢔꢐꢎꢎꢁꢃꢎꢇꢐꢕꢃ
ꢠꢏ ꢣꢁꢑ (ꢝꢣꢤꢜꢜ) ꢉꢁꢐꢜꢃꢂꢃꢎ ꢠꢃꢃꢄꢖ ꢡꢐꢕꢃꢎ ꢔꢐꢎꢎꢁꢃꢎꢇꢐꢕꢃ
ꢥꢏ ꢙꢆꢄꢘ ꢡꢐꢋꢘ
ꢎꢏVꢉꢇꢏ ꢒꢆMꢉꢓꢔ
ꢀꢁꢂꢂꢃꢄꢅꢆsꢃꢇVꢈ ꢉꢃꢊꢁꢋꢃ
MꢆꢕꢉMꢖMꢎꢇ
ꢗOꢘꢈꢉꢊꢋ VOꢓꢌꢆꢋꢏ
ꢏꢊꢎ ꢌꢏꢘMꢉꢊꢆꢌꢉOꢊ OꢅꢌꢉOꢊ
Mꢖꢓꢌꢉꢓꢆꢔꢏꢘ ꢍꢏꢘꢉꢏꢍ
ꢎꢏꢍꢉꢋꢊꢆꢌOꢘ
ꢌꢖ ꢗ ꢍꢎ ꢌꢍ ꢄꢃꢂꢂꢃꢎꢏ
ꢌꢁꢋꢘꢃꢄ ꢙꢐꢎꢎꢁꢃꢎ Oꢕꢂꢁꢍꢑ
(Mꢐꢂꢂꢃꢇꢁꢑ ꢍꢆꢂꢃꢎ sꢆꢎꢅꢐꢋꢃꢖ ꢕꢄꢐꢂꢃꢒ ꢍꢑ ꢌꢁꢋꢘꢃꢄ ꢆꢑꢒꢃꢎꢄꢐꢚꢃꢎ
ꢕꢄꢐꢂꢃꢒ ꢍꢑ sꢁꢄꢊꢃꢎ ꢛꢐsꢃ ꢜꢃꢂꢐꢄ)
ꢎꢏVꢉꢇꢏ ꢍꢉꢐꢏꢑ
ꢟꢦꢟꢝ ꢧ ꢨꢟꢦꢩ ꢁꢑꢋꢪ ꢫ ꢨꢟꢝꢦ ꢁꢑꢋꢪ (ꢟꢨꢬ ꢜꢜ ꢫ ꢟꢨꢞ ꢜꢜ)
ꢟꢩꢟꢦ ꢧ ꢨꢟꢩ ꢁꢑꢋꢪ ꢫ ꢨꢟꢦ ꢁꢑꢋꢪ (ꢝꢨꢟ ꢜꢜ ꢫ ꢟꢨꢭ ꢜꢜ)
ꢟꢬꢟꢞ ꢧ ꢨꢟꢬꢞ ꢁꢑꢋꢪ ꢫ ꢨꢟꢞꢝ ꢁꢑꢋꢪ (ꢝꢨꢬ ꢜꢜ ꢫ ꢟꢨꢤ ꢜꢜ)
ꢟꢤꢟꢭ ꢧ ꢨꢟꢤ ꢁꢑꢋꢪ ꢫ ꢨꢟꢤ ꢁꢑꢋꢪ (ꢦꢨꢟ ꢜꢜ ꢫ ꢝꢨꢦꢭ ꢜꢜ)
ꢝꢦꢟꢬ ꢧ ꢨꢝꢦꢬ ꢁꢑꢋꢪ ꢫ ꢨꢟꢬꢞ ꢁꢑꢋꢪ (ꢞꢨꢦ ꢜꢜ ꢫ ꢝꢨꢬ ꢜꢜ)
ꢝꢦꢝꢟ ꢧ ꢨꢝꢦꢬ ꢁꢑꢋꢪ ꢫ ꢨꢝ ꢁꢑꢋꢪ (ꢞꢨꢦ ꢜꢜ ꢫ ꢦꢨꢭ ꢜꢜ)
ꢇꢆꢅꢆꢇꢉꢌꢆꢊꢇꢏ OꢅꢌꢉOꢊ
ꢌꢍ ꢀꢃꢂꢂꢃꢎꢏ ꢈꢂꢐꢑꢒꢐꢎꢒ
ꢀꢏ ꢀꢍꢓ ꢔꢐꢕꢐꢋꢁꢂꢐꢑꢋꢃVꢃꢎsꢁꢍꢑ
*NOTES:
1 V120MLA1210 standard shipping quantities are 1000 pieces per reel for the "H" option and 4000 pieces per reel for "T" option.
2 V3.5 MLA0603, V5.5MLA0603 and V9MLA0603 only available in "H," "T" and "A" packing options.
Packaging*
Quantity
Device Size
13” Inch Reel
("T" Option)
7” Inch Reel
("H" Option)
7” Inch Reel
("R" Option)
Bulk Pack
("A" Option)
1812
1210
1206
0805
0603
0402
4,000
8,000
10,000
10,000
10,000
N/A
N/A
2,000
2,500
2,500
2,500
N/A
N/A
N/A
N/A
N/A
4,000
10,000
N/A
2,000
2,500
2,500
2,500
N/A
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
Metal-OxideVaristors (MOVs)
Surface Mount Multilayer Varistors (MLVs) > MLA Series
Tape and Reel Specifications
PRODUCT
IDENTIFYING
LABEL
D
0
P
0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P
2
E
F
W
K
0
B
0
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
P
A
0
1
t
D
1
1
Dimensions in Millimeters
0402 Size 0603, 0805, 1206 & 1210 Sizes
Symbol
Description
A0
B0
K0
W
F
Width of Cavity
Length of Cavity
Depth of Cavity
Width ofTape
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
8 -/+0.2
3.5 -/+0.05
1.75 -/+0.1
2-/+0.05
2 -/+0.1
8 -/+0.3
3.5 -/+0.05
1.75 -/+0.1
4 -/+0.1
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers andTape Edge
Distance Between Cavity Centers
E
P1
P2
P0
D0
D1
T1
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
2 -/+0.1
4 -/+0.1
4 -/+0.1
1.55 -/+0.05
N/A
1.55 -/+0.05
1.05 -/+0.05
0.1 Max
Diameter of Cavity Piercing
TopTapeThickness
0.1 Max
NOTES:
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/14/17
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