V5.5MLA1206HX3078 [LITTELFUSE]
Varistor, 5.5V, 0.4J, Surface Mount, CHIP, 1206, ROHS COMPLIANT;
| 型号： | V5.5MLA1206HX3078 |
| 厂家： | 
LITTELFUSE |
| 描述： | Varistor, 5.5V, 0.4J, Surface Mount, CHIP, 1206, ROHS COMPLIANT |
| 文件： | 总8页 (文件大小：207K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
RoHS
ML Varistor Series
Description
The ML Series family of transient voltage surge
suppression devices is based on the Littelfuse Multilayer
fabrication technology. These components are designed
to suppress a variety of transient events, including those
specified in IEC 61000-4-2 or other standards used for
Electromagnetic Compliance (EMC). The ML Series is
typically applied to protect integrated circuits and other
components at the circuit board level.
The wide operating voltage and energy range make the ML
Series suitable for numerous applications on power supply,
control and signal lines.
The ML Series is manufactured from semiconducting
ceramics, and is supplied in a leadless, surface mount
package. The ML Series is compatible with modern reflow
and wave soldering procedures.
SizeTable
Metric
1005
1608
2012
3216
3225
EIA
0402
0603
0805
1206
1210
It can operate over a wider temperature range than Zener
diodes, and has a much smaller footprint than plastic-
housed components.
Littelfuse Inc. manufactures other multilayer series
products. See the MLE Series data sheet for ESD
applications, MHS Series data sheet for high-speed ESD
applications, the MLN Series for multiline protection and
the AUML Series for automotive applications.
Applications
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switching or other
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electromagnetic
compliance of
end products
Features
transient events such as
EFT and surge voltage at
the circuit board level
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0805, 1206 and
(10 x 1000μs)
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mountTVS Zeners in
many applications
clamping
1210 chip sizes
883c method 3015.7,
and other industry
specifications (see also
the MLE or MLN Series)
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packaging assures
better than UL94V-0
flammability rating
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construction technology
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operating temp. range
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transient voltage
protection for ICS
and transistors
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types available
V
M(DC) = 5.5V to 120V
current (8 x 20μs)
Absolute Maximum Ratings
For ratings of individual members of a series, see device ratings and specifications table.
Continuous
ML Series
Units
Steady State Applied Voltage:
DC Voltage Range (VM(DC)
AC Voltage Range (VM(AC)RMS
Transient:
Non-Repetitive Surge Current, 8/20μs Waveform, (ITM
Non-Repetitive Surge Energy, 10/1000μs Waveform, (WTM
Operating AmbientTemperature Range (TA)
)
3.5 to 120
2.5 to 107
V
V
)
)
4 to 500
A
J
ºC
ºC
)
0.02 to 2.5
-55 to +125
-55 to +150
StorageTemperature Range (TSTG
)
Temperature Coefficient (αV) of Clamping Voltage (VC) at
Specified Test Current
<0.01
%/º C
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
37
Revision: January 9, 2009
MLVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
Device Ratings and Specifications
Maximum Ratings (125º C)
Maximum Non- Maximum Non- Maximum Clamping Nominal Voltage
Specifications (25ºC)
Typical
Maximum
Continuous
repetitive Surge repetitive Surge Voltage at 1A (or as at 1mA DCTest Capacitance
Working Voltage Current (8/20μs) Energy (10/1000μs)
Noted) (8/20μs)
Current
at f = 1MHz
Part Number
VN(DC)
Min
(V)
3.7
3.7
3.7
3.7
7.1
15.9
7.1
7.1
7.1
7.1
7.1
VN(DC)
Max
(V)
7.0
7.0
7.0
VM(DC)
VM(AC)
ITM
WTM
VC
C
(V)
3.5
3.5
3.5
3.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
9.0
9.0
9.0
9.0
9.0
12.0
14.0
14.0
14.0
14.0
14.0
18.0
18.0
18.0
18.0
18.0
18.0
26.0
26.0
26.0
26.0
26.0
30.0
30.0
30.0
30.0
33.0
42.0
48.0
48.0
56.0
60.0
68.0
85.0
120.0
(V)
2.5
2.5
2.5
2.5
4.0
4.0
4.0
4.0
4.0
4.0
4.0
6.5
6.5
6.5
6.5
6.5
(A)
30
120
40
100
20
20
30
30
120
40
150
20
4
30
30
40
40
20
30
120
40
150
20
30
120
40
150
500
30
100
40
150
300
30
(J)
(V)
13.0
13.0
13.0
13.0
21.0
39.0
17.5
17.5
17.5
17.5
17.5
30.0
35.0
25.5
25.5
25.5
29.0
39.0
34.5
32.0
32.0
32.0
50.0
50.0
(pF)
1270
2530
1380
6000
220
70
760
450
1840
990
3500
120
33
490
360
520
410
70
180
560
320
1400
40
120
520
290
1270
1440
110
220
140
600
1040
90
V3.5MLA0603N5
V3.5MLA0805N
V3.5MLA0805LN
V3.5MLA1206N
V5.5MLA0402N
V5.5MLA0402LN
V5.5MLA0603N5
V5.5MLA0603LN4
V5.5MLA0805N
V5.5MLA0805LN
V5.5MLA1206N
V9MLA0402N
0.100
0.300
0.100
0.300
0.050
0.050
0.100
0.100
0.300
0.100
0.400
0.050
0.020
0.100
0.100
0.100
0.100
0.050
0.100
0.300
0.100
0.400
0.050
0.100
0.300
0.100
0.400
2.500
0.100
0.300
0.100
0.600
1.200
0.100
0.100
1.200
0.900
0.800
0.800
1.200
0.900
1.000
1.500
1.000
2.500
2.000
7.0
10.8
21.5
9.3
9.3
9.3
9.3
9.3
11.0
11.0
11.0
11.0
11.0
14.0
15.9
15.9
15.9
15.9
15.9
22.0
22.0
22.0
22.0
22.0
22.0
31.0
29.5
29.5
29.5
29.5
37.0
37.0
35.0
35.0
38.0
46.0
54.5
54.5
61.0
67.0
76.0
95.0
135.0
16.0
16.0
16.0
16.0
16.0
18.5
21.5
21.5
20.3
20.3
20.3
28.0
28.0
28.0
28.0
28.0
28.0
38.0
38.5
38.5
38.5
38.5
46.0
46.0
43.0
43.0
49.0
60.0
66.5
66.5
77.0
83.0
90.0
115.0
165.0
V9MLA0402LN
V9MLA0603N5
V9MLA0603LN4
V9MLA0805LN
V12MLA0805LN
V14MLA0402N
V14MLA0603N
V14MLA0805N
V14MLA0805LN
V14MLA1206N
V18MLA0402N
V18MLA0603N
V18MLA0805N
V18MLA0805LN
V18MLA1206N
V18MLA1210N
V26MLA0603N
V26MLA0805N
V26MLA0805LN
V26MLA1206N
V26MLA1210N
V30MLA0603N
V30MLA0805LN
V30MLA1210N
V30MLA1210LN
V33MLA1206N
V42MLA1206N
V48MLA1210N
V48MLA1210LN
V56MLA1206N
V60MLA1210N
V68MLA1206N
V85MLA1210N
V120MLA1210N
9.0
10.0
10.0
10.0
10.0
10.0
14.0
14.0
14.0
14.0
14.0
14.0
20.0
20.0
20.0
20.0
20.0
25.0
25.0
25.0
25.0
26.0
30.0
40.0
40.0
40.0
50.0
50.0
67.0
107.0
44.0
44.0
44.0
44.0 at 2.5
60.0
60.0
60.0
60.0
60.0 at 2.5
74.0
30
72.0
90
280
220
180
180
250
220
180
250
180
250
125
68.0 at 2.5
68.0 at 2.5
75.0
1820
1760
500
425
520
500
180
440
100
260
80
92.0
105.0 at 2.5
105.0 at 2.5
120.0
130.0 at 2.5
140.0
180.0 at 2.5
260.0 at 2.5
NOTES:
1
2
3
4
5
'L' suffix is a low capacitance and energy version; Contact your Littelfuse sales representative for custom capacitance requirements
Typical leakage at 25ºC<25μA, maximum leakage 100μA at VM(DC); for 0402 size, typical leakage <5μA, maximum leakage <20μA at VM(DC)
Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively
Only available in 'R' packing option
Only available in 'H','T'and 'A' packing options
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
38
MLVaristor Series
Please refer to www.littelfuse.com/series/ML.html for current information.
Revision: January 9, 2009
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
Peak Current and Energy Derating Curve
Peak Pulse CurrentTest Waveform for ClampingVoltage
When transients occur in rapid succession, the average
power dissipation is the energy (watt-seconds) per pulse
times the number of pulses per second. The power so
developed must be within the specifications shown
on the Device Ratings and SpecificationsTable for the
specific device. For applications exceeding 125°C ambient
temperature, the peak surge current and energy ratings
must be derated as shown below.
100
50
0
T
O
TIME
1
T
1
Figure 2
T
2
100
80
01 = Virtual Origin of Wave
T =Time from 10% to 90% of Peak
T1 = RiseTime = 1.25 xT
60
40
T2 = DecayTime
20
0
Example - For an 8/20 μs Current Waveform:
8μs =T1 = RiseTime
-55
50 60
70
80
90 100 110 120 130 140 150
o
20μs =T2 = DecayTime
AMBIENTTEMPERATURE ( C)
Figure 1
LimitV-I Characteristic forV5.5MLA0402 toV18MLA0402
LimitV-I Characteristic forV9MLA0402L
100
100
10
10
V18MLA0402
V14MLA0402
V9MLA0402
V5.5MLA0402
V9MLA0402L
V5.5MLA0402L
1
1μA
1
10μA
100μA
1mA
10mA
1A
10A
100A
1μA
10μA
100μA
1mA
10mA
1A
10A
100A
Current (A)
Figure 3
Figure 4
Current (A)
LimitV-I Characteristic forV3.5MLA0603 toV30MLA0603
LimitV-I Characteristic forV3.5MLA0805L toV30MLA0805L
1000
1000
V30MLA0805L
V26MLA0805L
V18MLA0805L
V30MLA0603
V26MLA0603
V18MLA0603
V14MLA0805L
100
100
V14MLA0603
10
10
V12MLA0805L
V9MLA0603, V9MLA0603L
V9MLA0805L
V5.5MLA0603, V5.5MLA0603L
V3.5MLA0603
V5.5MLA0805L
V3.5MLA0805L
1
1
10μA
100μA
1mA
10mA
100mA
1A
10A
100A
10μA
100μA
1mA
10mA
Current (A)
100mA
1A
10A
100A
Current (A)
Figure 5
Figure 6
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
39
Revision: January 9, 2009
MLVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
LimitV-I Characteristic forV3.5MLA0805 toV26MLA0805
LimitV-I Characteristic forV3.5MLA1206 toV68MLA1206
1000
100
10
1000
100
10
V68MLA1206
V56MLA1206
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
V14MLA1206
V5.5MLA1206
V3.5MLA1206
V26MLA0805
V18MLA0805
V14MLA0805
V5.5MLA0805
V3.5MLA0805
1
10μA
100μA
1mA
10mA
100mA
1A
10A
100A
1000A
Current (A)
Figure 7
1
10μA
100μA
1mA
10mA
100mA
1A
10A
100A
1000A
Current (A)
Figure 8
LimitV-I Characteristic forV18MLA1210 toV120MLA1210
1000
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
100
V120MLA1210
10
V85MLA1210
V60MLA1210
V48MLA1210, V48MLA1210L
V30MLA1210, V30MLA1210L
V26MLA1210
V18MLA1210
1
10μA
100μA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
Figure 9
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
40
Revision: January 9, 2009
MLVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
Device Characteristics
ClampingVoltage OverTemperature (VC at 10A)
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance modex (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100μA, typically 25μA;
for 0402 size below 20μA, typically 5μA.
100
V26MLA1206
V5.5MLA1206
TypicalTemperature Dependance of the Haracteristic
Curve in the Leakage Region
100%
10
-60
-40
-20
0
20
40
60
80
100 120 140
o
TEMPERATURE ( C)
Figure 11
Energy Absorption/Peak Current Capability
Energy dissipated within the ML Series is calculated
by multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
(see Speed of Response). This dramatically reduces peak
temperature; thermal stresses and enhances device
reliability.
o
o
o
o
o
C
25 50 75
-8 -7
100 125
10%
1E
-9
-6
-5
-4
-3
-2
1E
1E
1E
1E
1E
1E
1E
SUPPRESSOR CURRENT (A
DC
)
Figure 10
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZNO dielectric material is less
than 1ns and the ML can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
multiple pulses at its peak current rating (150A, 8/20μs). At
the end of the test,10,000 pulses later, the device voltage
characteristics are still well within specification.
Repetitive Pulse Capability
Multilayer Internal Construction
100
PEAK CURRENT = 150A
8/20 s DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
V26MLA1206
METAL
ELECTRODES
METAL END
TERMINATION
10
DEPLETION
REGION
0
2000
4000
6000
8000
10000
12000
NUMBER OF PULSES
Figure 13
DEPLETION
REGION
Figure 12
GRAINS
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
41
Revision: January 9, 2009
MLVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
250
200
150
100
The recommended solder for the ML suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
MAXIMUM TEMPERATURE
230°C
40-80
SECONDS
ABOVE 183°C
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
RAMP RATE
<2°C/s
PREHEAT DWELL
PREHEAT ZONE
50
When using a reflow process, care should be taken to
ensure that the ML chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Figure 14
TIME (MINUTES)
Wave Solder Profile
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
300
250
200
150
100
MAXIMUMWAVE 260°C
SECOND PREHEAT
FIRST PREHEAT
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Figure 15
TIME (MINUTES)
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel BarrierTermination option (see
"N" suffix in Part Numbering System for ordering) for the
optimum Lead–free solder performance, consisting of a
MatteTin outer surface plated on Nickel underlayer, plated
on Silver base metal.
Lead–free Re-flow Solder Profile
300
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
250
200
150
100
50
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
PREHEAT ZONE
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Figure 16
TIME (MINUTES)
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
42
Revision: January 9, 2009
MLVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
Product Dimensions (mm)
PAD LAYOUT DIMENSIONS
CHIP LAYOUT DIMENSIONS
C
E
B
NOTE
D
L
W
A
NOTE : Avoid metal runs in this area, parts not recommended for use in applications using
Silver (Ag) epoxy paste.
1210 Size
IN
1206 Size
IN
0805 Size
IN
0603 Size
IN
0402 Size
IN
Dimension
MM
4.06
2.54
1.02
2.87
MM
4.06
1.65
1.02
1.80
MM
3.05
1.27
1.02
1.10
MM
2.54
0.76
0.89
1.00
MM
1.70
0.51
0.61
0.60
A
0.160
0.100
0.040
0.113
0.160
0.065
0.040
0.071
0.120
0.050
0.040
0.043
0.100
0.030
0.035
0.040
0.067
0.020
0.024
0.024
B
C
D (max.)
0.020
0.50
0.020
0.50
0.020 -/+
0.010
0.50 -/+
0.25
0.015
0.4
0.010
0.25
E
L
-/+0.010
-/+0.25
-/+0.010
-/+0.25
-/+0.008
-/+0.20
-/+0.006
-/+0.15
0.125
-/+0.012
3.20
-/+0.30
0.125
-/+0.012
3.20
-/+0.30
0.079
-/+0.008
2.01
-/+0.20
0.063
-/+0.006
1.6
-/+0.15
0.039
-/+0.004
1.00
-/+0.10
0.100
-/+0.012
2.54
-/+0.30
0.060
-/+0.011
1.60
-/+0.28
0.049
-/+0.008
1.25
-/+0.20
0.032
-/+0.060
0.8
-/+0.15
0.020
-/+0.004
0.50
-/+0.10
W
Part Numbering System
V 18 MLA1206 X X X
PACKING OPTIONS (see Packaging table for quantities)
T: 13in (330mm) Diameter Reel, Plastic Carrier Tape
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
R: 7in (178mm) Diameter Reel, Paper Carrier Tape
DEVICE FAMILY
Littelfuse TVSS Device
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
No Letter: Standard
N: Nickel Barrier Option
MULTILAYER SERIES
DESIGNATOR
(Matte Tin outer surface, plated on Nickel underlayer
plated on silver base metal)
DEVICE SIZE:
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
i.e., 120 mil x 60 mil
(3mm x 1.5mm)
*NOTES:
1 V120MLA1210 standard shipping quantities are 1000 pieces per reel for the "H" option and 4000 pieces per reel for "T" option.
2 V3.5 MLA0603, V5.5MLA0603 and V9MLA0603 only available in "H," "T" and "A" packing options.
Packaging*
Quantity
Device Size
13” Inch Reel
("T" Option)
7” Inch Reel
("H" Option)
7” Inch Reel
("R" Option)
Bulk Pack
("A" Option)
1210
1206
0805
0603
0402
8,000
10,000
10,000
10,000
N/A
2,000
2,500
2,500
2,500
N/A
N/A
N/A
N/A
4,000
10,000
2,000
2,500
2,500
2,500
N/A
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
43
MLVaristor Series
Revision: January 9, 2009
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > ML Series
Tape and Reel Specifications
PRODUCT
IDENTIFYING
LABEL
D
P
0
0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P
2
E
F
W
K
0
B
0
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
P
A
0
1
t
D
1
1
Dimensions in Millimeters
0402 Size 0603, 0805, 1206 & 1210 Sizes
Symbol
Description
A0
B0
K0
W
F
Width of Cavity
Length of Cavity
Depth of Cavity
Width ofTape
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
8 -/+0.2
3.5 -/+0.05
1.75 -/+0.1
2-/+0.05
2 -/+0.1
8 -/+0.3
3.5 -/+0.05
1.75 -/+0.1
4 -/+0.1
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers andTape Edge
Distance Between Cavity Centers
E
P1
P2
P0
D0
D1
T1
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
2 -/+0.1
4 -/+0.1
4 -/+0.1
1.55 -/+0.05
N/A
1.55 -/+0.05
1.05 -/+0.05
0.1 Max
Diameter of Cavity Piercing
TopTapeThickness
0.1 Max
NOTES:
tꢀ$POGPSNTꢀUPꢀ&*"ꢇꢂꢋꢊꢇꢊꢄꢀ3FWJTJPOꢀ"
tꢀ$BOꢀCFꢀTVQQMJFEꢀUPꢀ*&$ꢀQVCMJDBUJPOꢀꢃꢋꢅꢇꢆ
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/ML.html for current information.
44
MLVaristor Series
Revision: January 9, 2009
相关型号：
V5.5MLN40805NA
RESISTOR, VOLTAGE DEPENDENT, 5.5V, 0.05J, SURFACE MOUNT, CHIP, 0805, ROHS COMPLIANT
LITTELFUSE
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