V5.5MLN41206LWA [LITTELFUSE]

RESISTOR, VOLTAGE DEPENDENT;
V5.5MLN41206LWA
型号: V5.5MLN41206LWA
厂家: LITTELFUSE    LITTELFUSE
描述:

RESISTOR, VOLTAGE DEPENDENT

电阻器
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中文:  中文翻译
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Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLN Series  
RoHS  
MLN SurgeArray™ Suppressor  
Description  
The MLN SurgeArray™ Suppressor is designed to  
help protect components from transient voltages that  
exist at the circuit board level. This device provides four  
independent suppressors in a single leadless chip in order  
to reduce part count and placement time as well as save  
space on printed circuit boards.  
SurgeArray™ devices are intended to suppress ESD, EFT  
and other transients in order to protect integrated circuits  
or other sensitive components operating at any voltage  
up to 18VDC. SurgeArray™ devices are rated to the IEC  
61000-4-2 human body model ESD to help products attain  
EMC compliance. The array offers excellent isolation and  
low crosstalk between sections.  
SizeTable  
Metric  
EIA  
The inherent capacitance of the SurgeArray™ Suppressor  
permits it to function as a filter/suppressor, thereby  
replacing separate Zener/capacitor combinations.  
3216  
1206  
The MLN array is manufactured using the Littelfuse  
Multilayer technology process and is similar to the  
Littelfuse ML and MLE Series of discrete leadless chips.  
Applications  
Features  
Data, Diagnostic  
I/O Ports  
Communications/  
Cellular Phones  
RoHS Compliant  
Low leakage  
Four individual  
devices in one chip  
Operating voltage  
up to 18VM(DC)  
Analog Signal/  
Sensor Lines  
Computer/DSP  
Products  
ESD rated to IEC  
61000-4-2 (Level 4)  
-55ºC to 125ºC  
operating temp range  
Portable/Hand-  
Held Products  
Industrial Instruments  
Including Medical  
AC characterized  
for impedance and  
capacitance  
Low-profile, PCMCIA  
compatible  
Mobile  
Low adjacent channel  
crosstalk, -55dB  
at 10MHz (Typ)  
Absolute Maximum Ratings  
• For ratings of individual members of a series, see device ratings and specifications table.  
Continuous  
MLN Series  
Units  
Steady State Applied Voltage:  
DC Voltage Range (VM(DC)  
)
5.5 - 18  
V
Operating AmbientTemperature Range (TA)  
-55 to +125  
-55 to +150  
ºC  
ºC  
StorageTemperature Range (TSTG  
)
© 2013 Littelfuse, Inc.  
Specifications are subject to change without notice.  
63  
Revised: October 9, 2013  
MLN SurgeArray™ Suppressor  
Please refer to www.littelfuse.com/series/MLN.html for current information.  
Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLN Series  
Device Ratings and Specifications Any Single Section  
Maximum Ratings (125ºC)  
Specifications (25ºC)  
Typical ESD Nominal Voltage  
Maximum  
Non-  
Maximum  
Maximum  
Clamping  
Voltage (at  
Maximum  
Continuous  
Working  
Non-  
Capacitance  
at 1 MHz  
(1V p-p)  
repetitive  
repetitive  
Supression Voltage at 1mA DCTest  
Surge Current Surge Energy Noted 8/20μs)  
(Note1)  
Current  
Voltage  
Part Number  
(8/20μs)  
(10/1000μs)  
Current  
(Note 2) (Note 3)  
8kV Contact 15kV Air  
Peak Clamp Peak  
(Note 4)  
C
VN(DC) VN(DC)  
VM(DC)  
ITM  
WTM  
VC  
Min  
Max  
TYP  
(pF)  
430  
MAX  
(pF)  
520  
(V)  
(A)  
(J)  
(V)  
(V)  
(V)  
(V)  
(V)  
(V)  
V5.5MLN41206  
V9MLN41206  
V14MLN41206  
V18MLN41206  
V18MLN41206L  
5.5  
30  
0.10  
15.5 at 2A  
60  
35  
45  
7.10  
10.8  
9.0  
30  
30  
30  
30  
0.10  
0.10  
0.10  
0.05  
23.0 at 2A  
30.0 at 2A  
40.0 at 2A  
50.0 at 1A  
95  
50  
55  
63  
95  
75  
85  
11.0  
15.9  
22.0  
25.0  
16.0  
20.3  
28.0  
35.0  
250  
140  
100  
45  
300  
175  
125  
75  
14.0  
18.0  
18.0  
110  
165  
200  
100  
130  
NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit.  
2. Direct discharge to device terminals (IEC preffered test method).  
3. Corona discharge through air (represents actual ESD event)  
4. Capacitance may be customized, contact Sales.  
Peak Current and Energy Derating Curve  
Peak Pulse CurrentTestWaveform for ClampingVoltage  
For applications exceeding 125ºC ambient temperature, the  
peak surge current and energy ratings must be reduced.  
100  
90  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
50  
10  
O
t
t
1
TIME  
1
Figure 2  
t
2
01 = Virtual Origin of Wave  
Example:  
-55  
50 60  
70  
80  
90 100 110 120 130 140 150  
o
T =Time from 10% to 90% of Peak  
T1 = RiseTime = 1.25 xT  
T2 = DecayTime  
For an 8/20 μs Current Waveform:  
8μs =T1 = RiseTime  
20μs =T2 = VirtualTime  
to Half Value  
AMBIENTTEMPERATURE ( C)  
Figure 1  
(Impulse Duration)  
Typical Performance Curves  
Equivalent Series Resistance  
Impedance vs Frequency, 1206 Size  
10000  
1000  
100  
10  
1000  
100  
V5.5  
V9  
10  
1
V14  
1
V18  
V18L  
0.1  
1MHz  
10MHz  
100MHz  
1GHz  
10GHz  
Frequency  
0.1  
Figure 3  
0.1  
1
10  
Frequency (MHz)  
100  
1000  
Figure 4  
64  
Revised: October 9, 2013  
© 2013 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/MLN.html for current information.  
MLN SurgeArray™ Suppressor  
Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLN Series  
Typical Performance Curves (continued)  
NominalVoltage Stability to IEC 1000-4-2 (8kV Contact  
Method, One Section)  
1206 Size Pulse Rating for Long Duration Surges  
(Any Single Section)  
100  
25  
V18  
NUMBER OF SURGES  
20  
1
100  
V14  
103  
10  
15  
10  
V9  
10  
V5.5  
1
5
0
104  
105  
106  
0
10  
100  
1000  
10000  
0.1  
10  
100  
1000  
10000  
NUMBER OF DISCHARGES  
Figure 5  
Square Wave Impulse Duration (µs)  
Figure 6  
V-I Characteristic, 1206 size  
Capacitance vs Frequency, 1206 Size  
500  
100  
V18L  
V5.5  
MAXIMUM CLAMP VOLTAGE  
V18  
MAXIMUM STANDBY  
V14  
V9  
400  
V5.5  
V18L  
300  
V18  
V14  
V9  
10  
V9  
200  
V5.5  
V14  
V18  
100  
V18L  
1
10μA  
100μA  
1mA  
10mA  
100mA  
1A  
10A  
100A  
0
0.1  
1
10  
100  
1000  
Current (A)  
Frequency (MHz)  
Figure 8  
Figure 7  
Adjacent Channel Crosstalk  
0
-20  
-40  
-60  
V18L  
V18  
V14  
V9  
-80  
V5.5  
VIN  
=
1VRMS  
Z
=
50Ω  
-100  
-120  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Frequency (MHz)  
Figure 9  
© 2013 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/MLN.html for current information.  
65  
Revised: October 9, 2013  
MLN SurgeArray™ Suppressor  
Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLN Series  
Lead (Pb) Soldering Recommendations  
The principal techniques used for the soldering of  
components in surface mount technology are IR Re-flow  
and Wave soldering. Typical profiles are shown on the right.  
Reflow Solder Profile  
250  
200  
150  
100  
The recommended solder for the MLN suppressor is  
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).  
Littelfuse also recommends an RMA solder flux.  
MAXIMUM TEMPERATURE  
230°C  
40-80  
SECONDS  
ABOVE 183°C  
Wave soldering is the most strenuous of the processes.  
To avoid the possibility of generating stresses due to  
thermal shock, a preheat stage in the soldering process  
is recommended, and the peak temperature of the solder  
process should be rigidly controlled.  
RAMP RATE  
<2°C/s  
PREHEAT DWELL  
PREHEAT ZONE  
50  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
When using a reflow process, care should be taken to  
ensure that the MLN chip is not subjected to a thermal  
gradient steeper than 4 degrees per second; the ideal  
gradient being 2 degrees per second. During the soldering  
process, preheating to within 100 degrees of the solder's  
peak temperature is essential to minimize thermal shock.  
TIME (MINUTES)  
Figure 10  
Wave Solder Profile  
300  
250  
200  
150  
100  
50  
Once the soldering process has been completed, it is  
still necessary to ensure that any further thermal shocks  
are avoided. One possible cause of thermal shock is hot  
printed circuit boards being removed from the solder  
process and subjected to cleaning solvents at room  
temperature. The boards must be allowed to cool gradually  
to less than 50ºC before cleaning.  
MAXIMUMWAVE 260°C  
SECOND PREHEAT  
FIRST PREHEAT  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
Figure 11  
TIME (MINUTES)  
66  
Revised: October 9, 2013  
© 2013 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/MLN.html for current information.  
MLN SurgeArray™ Suppressor  
Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLN Series  
Product Dimensions (mm)  
PAD LAYOUT DEMENSIONS  
CHIP LAYOUT DIMENSIONS  
T
W
E
D
X
A
P
L
B
C
BW  
S
BL  
1206 Size  
Dimension  
IN  
0.035  
MM  
0.890  
A
B
0.065  
1.650  
C
0.100  
2.540  
D
0.018  
0.460  
E
0.030  
0.790  
L
0.126 -/+0.008  
0.063 -/+0.008  
0.053 Max  
0.016 -/+0.004  
0.007 +0.01/- 0.002  
0.030 Ref  
3.200 -/+0.200  
1.600 -/+0.200  
1.350 Max  
0.410 -/+0.100  
0.180 +0.25/-0.050  
0.760 Ref  
W
T
BW  
BL  
P
X
0.045 -/+0.004  
0.015 -/+0.004  
1.140 -/+0.100  
0.380 -/+0.100  
S
Part Numbering System  
V 18 ML N 4 1206 L W T  
DEVICE FAMILY  
TVSS Device  
PACKING OPTIONS*  
A: Bulk Pack, 2500 pieces  
H: 7in (178mm) Diameter Reel, 2500 pieces  
T: 13in (330mm) Diameter Reel, 10,000 pieces  
MAXIMUM DC  
WORKING VOLTAGE  
END TERMINATION  
W: Ag/P /P (Silver/Platinum/Palladium)  
d
t
MULTILAYER DESIGNATOR  
SERIES DESIGNATOR  
N: Array  
CAPACITANCE OPTION  
(no letter): Standard  
L: Low Capacitance Version  
NUMBER OF SECTIONS  
DEVICE SIZE: 1206: 120mil x 60mil  
Packaging*  
Quantity  
Device Size  
13” Inch Reel  
("T" Option)  
7” Inch Reel  
("H" Option)  
Bulk Pack  
("A" Option)  
1206  
10,000  
2,500  
2,500  
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.  
© 2013 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/MLN.html for current information.  
67  
MLN SurgeArray™ Suppressor  
Revised: October 9, 2013  
Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MLN Series  
Tape and Reel Specifications  
t
D
P
0
PRODUCT  
IDENTIFYING  
LABEL  
1
0
P
2
PLASTIC CARRIER TAPE  
E
F
W
K
0
B
0
EMBOSSMENT  
TOP TAPE  
P
A
0
1
178mm  
OR 330mm  
DIA. REEL  
8mm  
NOMINAL  
t
D
1
2
Symbol  
A0  
B0  
Description  
Dimensions in Millimeters  
Width of Cavity  
Length of Cavity  
Depth of Cavity  
Width ofTape  
Dependent on Chip Size to Minimize Rotation.  
Dependent on Chip Size to Minimize Rotation.  
Dependent on Chip Size to Minimize Rotation.  
K0  
8 -/+0.2  
3.5 -/+0.5  
1.75 -/+0.1  
4 -/+0.1  
W
Distance Between Drive Hole Centers and Cavity Centers  
Distance Between Drive Hole Centers andTape Edge  
Distance Between Cavity Center  
F
E
P1  
Axial Distance Between Drive Hole Centers and Cavity Centers  
Axial Distance Between Drive Hole Centers  
Drive Hole Diameter  
2 -/+0.1  
P2  
4 -/+0.1  
P0  
1.55 -/+0.05  
1.05 -/+0.05  
0.3 Max  
D0  
D1  
T1  
Diameter of Cavity Piercing  
EmbossedTapeThickness  
TopTapeThickness  
0.1 Max  
T2  
Notes :  
• Conforms to EIA-481-1, Revision A  
• Can be supplied to IEC publication 286-3  
68  
Revised: October 9, 2013  
© 2013 Littelfuse, Inc.  
Specifications are subject to change without notice.  
MLN SurgeArray™ Suppressor  
Please refer to www.littelfuse.com/series/MLN.html for current information.  

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